Abstract: A liquid loop cooling apparatus includes tubing enclosing an interior bore or lumen within which a cooling fluid can circulate, a moveable cold plate rigidly coupled to the tubing, and at least one flexible bellows coupled to the tubing and flexibly enabling movement of the moveable cold plate.

Abstract: An airflow control apparatus includes a controllable airflow resistance aligned with an airflow path of a plurality of airflow paths, a sensor capable of detecting an airflow condition in at least one of the plurality of airflow paths, and a controller. The controller is coupled to the controllable airflow resistance and to the sensor, and can control the controllable airflow resistance to manage airflow recirculation based on the airflow condition detected by the sensor.

Abstract: A heat exchanger includes a tube, and a plurality of fins coupled to the tube having a curved fan-stator shape that facilitates straightening of airflow from a fan.

Abstract: A pump assembly includes inlet and outlet interfaces capable of coupling to a liquid cooling loop tubing, a plurality of pump connectors coupled to the inlet and outlet interfaces enabling pluggable connection of a plurality of pumps to the inlet and outlet interfaces, and a controller. The controller is coupled to the plurality of pumps and controls power levels of the individual pumps, enabling control of fluid flow rate in the liquid cooling loop.

Abstract: A liquid loop cooling apparatus includes rigid or semi-rigid tubing enclosing an interior bore or lumen within which a cooling fluid can circulate among at least one heat-generating component in a closed-loop system. The liquid loop cooling apparatus also includes at least one flexible bellows coupled to the tubing that isolates physical stresses along the tubing.

Abstract: A shroud for interacting with a circuit component defining a component surface having an array of pins extending from the component surface. The shroud includes a planar member defining an array of apertures complimenting the array of the pins. The planar member is configured to interact with the circuit component to maintain uniform contact between the pins and a corresponding socket.

Abstract: A liquid loop cooling system, a tubing encloses an interior lumen within which a cooling fluid can circulate. A plurality of heat exchangers is coupled to the tubing and is configured within in a constrained space in conformance to space availability.

Abstract: A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.

Abstract: A heat dissipating arrangement includes a first heat emitting device, a second heat emitting device, and a heat sink thermally coupled to the first heat emitting device and extending on opposite sides of the second heat emitting device.

Abstract: There is described a housing for mounting electronic boards therein, the housing having at least one horizontally positioned plane, adapted for allowing a plurality of electronic circuits to be connected thereto. The plane is arranged to allow air to flow between opposing walls of the housing without causing the air to traverse bends. The electronic circuits may be positioned on both the top and bottom surface of the horizontal plane. In one embodiment, the housing is a computer.

Abstract: An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.

Abstract: A cooling device for electronic devices is built comprising at least two fan sinks thermally coupled together such that when one fan sink fails, the remaining fan sinks are able to compensate for the failed fan sink. Optionally, the remaining fan sinks may be controlled to speed up upon detection of a failure, increasing their cooling capacity to compensate for the failed fan sink. Also optionally, a thermal coupling device such as heat pipes may be used as part of the thermal coupling between the fan sinks to increase the cooling efficiency of the remaining fan sinks to the device or devices closest to the failed fan sink. Also optionally, the thermal coupling device may be configured to allow some flexibility in the cooling device assembly allowing for the cooling of non-coplanar electronic devices.

Abstract: An airflow distribution control system for usage in a raised-floor data center comprises an under-floor partition with a controllable flow resistance and a sensor. The partition is capable of selective positioning in a plenum beneath the raised-floor. The sensor is communicatively coupled to the partition and detects a parameter indicative of airflow distribution and controls the flow resistance based on the parameter.

Abstract: An airflow management apparatus is used in an electronic system and includes a flexible air baffle that mounts on a chassis of an electronic device in an arrangement and obstructs air flow between an air inlet vent and an air exhaust vent of the electronic device. The flexible air baffle has a thickness that extends across a gap to contact an adjacent vertically-stacked electronic device.

Abstract: A slot filler for usage in a rack cabinet can accept a plurality of stacked electronic devices. The cabinet has an air inlet and exit on mutually opposing sides and a plurality of slots capable of securing the stacked electronic devices. The slot filler comprises a blanking panel capable of covering an entry opening of a slot that is unoccupied by an electronic device, and a body coupled to the blanking panel that emulates dimensions of an electronic device and has a thickness selected so that clearance between the slot filler and an adjacent electronic device leaves an air flow gap from the air inlet to exit that is sufficiently small to create an air flow resistance preventing air from re-circling toward the air inlet.

Abstract: A computer fan efficiency feedback system and method are presented. In one embodiment, an indication electronic components are operating is received. A cooling system is directed to provide air flow to the electronic components. In one exemplary implementation the cooling system includes a fan. The fan speed is modulated in accordance with a fan speed efficiency control plan. For example, the fan speed efficiency control plan includes directions for changing or modulating the fan speed to a value that maximizes an efficiency ratio of flow work to input power supplied to the fan.

Abstract: An apparatus in one example comprises one or more control components that regulate one or more thermal test components to adjust one or more emulated operational characteristics for one or more electronic devices. The thermal test components are coupled with one or more rack-mount frames. The thermal test components create the emulated operational characteristics for the one or more electronic devices to generate one or more emulated environmental effects. The one or more control components obtain one or more measurements of one or more of the one or more emulated operational characteristics and the one or more emulated environmental effects. The one or more control components make a prediction of one or more of one or more actual operational characteristics and one or more actual environmental effects of the one or more electronic devices through employment of one or more of the one or more measurements.

Abstract: One or more heat exchanger components of an apparatus are in major part operably locatable outside a computer chassis and serve to reduce one or more temperatures of one or more heat producing components supported with the computer chassis.

Abstract: A fan rotor system for cooling an electronic system includes a rotor body configured to be rotated by a fan motor and at least one collapsible fan blade mounted on the rotor body for moving cooling air through the electronic system. The at least one collapsible fan blade has a first air driving position, wherein the fan blade moves cooling air in a desired direction for cooling the electronic system, and a second air passage position, wherein the at least one collapsible fan blade is collapsed to allow cooling air to pass the at least one collapsible fan blade with less drag than when the at least one collapsible fan blade is in the first air driving position. The at least one collapsible fan blade is movable between the first air driving position when the rotor body is rotating and the second air passage position when the rotor body is not rotating.

Abstract: An apparatus for improved shock and vibration isolation of a CGA integrated package which utilizes solder column grid arrays to provide electrical connection to a printed circuit board. The CGA integrated package includes a substrate and a package lid. A support frame is attached at an attachment point to the substrate or the package lid of the CGA integrated package and at a second attachment point to the printed circuit board. An isolation material, such as Styrofoam or Sorbathane is located at the attachment point of the support frame to the substrate or the package lid, or located at the second attachment point of the support frame to the circuit board such that a vibration or shock to the circuit board must travel through the isolation material at the attachment point prior to reaching the integrated circuit. A method of supporting an integrated circuit on a circuit board and improving the isolation of an integrated circuit from any vibration and shock to the circuit board is also provided.