Patents by Inventor Christopher Michael Unger

Christopher Michael Unger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8730621
    Abstract: An electrical connection between a first element and a second element formed by a solder ball bridge having at least three solder balls in physical contact with each other extending to electrically connect the first element and the second element. The solder ball bridge is particularly suitable for a disc drive system, to form an electrical connection between two elements such as between a piezoelectric microactuator element and the suspension assembly. Methods of making a solder ball bridge are also provided.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: May 20, 2014
    Assignee: Seagate Technology LLC
    Inventors: Jackson William Brandts, Kevin J. Schulz, Christopher Michael Unger
  • Patent number: 8259415
    Abstract: A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow. Separately related, an assembly includes a suspension assembly including a suspension mounting surface and a suspension pad on the suspension mounting surface. A slider is positioned adjacent the suspension mounting surface, with a slider pad aligned with the suspension pad. A recessed channel is in at least one of the slider pad or the suspension pad. A solder joint is formed between the suspension pad and the slider pad and extends into the recessed channel.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: September 4, 2012
    Assignee: Seagate Technology LLC
    Inventors: Erik Jon Hutchinson, Christopher Michael Unger
  • Publication number: 20100321829
    Abstract: A slider includes a slider body and a bond pad. The bond pad is positioned on the slider body and has a bonding surface with a recessed channel for directing solder flow.
    Type: Application
    Filed: June 22, 2009
    Publication date: December 23, 2010
    Applicant: Seagate Technology LLC
    Inventors: Erik Jon Hutchinson, Christopher Michael Unger