Abstract: A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated with a resist in remaining areas which comprises(i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having(a) a group which is reactive with an isocyanate group and(b) a blocked isocyanate group, and incorporating in the electrodeposited film a compound containing at least two groups selected from hydroxy, amino and carboxyl,(ii) heating the electrodeposited film to render it resistant to a solvent with which the resist is removable(iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and(iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film.

Abstract: Images are formed by the following process:(i) a substrate is treated with a layer of a liquid composition comprising(A) a residue that is polymerizable by means of free radicals, such as an acrylic ester,(B) a radiation-activated polymerization initiator for (A), such as a metallocene or a mixture of a Group IVA organometallic compound with a photoreducible dye.

Abstract: The present invention provides a method for making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas which comprises (i) protecting the bare metal by coating with a film-forming resin, (ii) removing any film-forming resin from the resist, (iii) removing the resist from said remaining areas using a solvent which will not remove the film-forming resin, thereby exposing metal in said remaining areas, (iv) etching the metal exposed in (iii) using an etchant which does not remove the film-forming resin and (v) removing the film-forming resin with a suitable solvent.

Abstract: A method of making a pattern on an electrically conductive material such as a printed circuit comprises(i) electrodepositing on an electrically conductive surface a film of an organic polymer having, per average molecule, more than one reactive functional group,(ii) forming on the electrodeposited film a predetermined pattern of a heat-curable resist having, per average molecule, more than one group reactive with the reactive groups in the electrodeposited film on heating, thereby leaving predetermined areas of the electrodeposited film uncovered,(iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, conductive material coated by areas of the electrodeposited film covered by the resist, and(iv) heating to complete adhesion of the resist to the electrically conductive surface through the areas of the electrodeposited film covered by the resist,st

Abstract: Imides of the formula I ##STR1## In which R.sub.1, R.sub.2 and R.sub.4 independently of one another are hydrogen or methyl, R.sub.3 is a direct bond or a C.sub.2 -C.sub.20 aliphatic radical which can be interrupted by O atoms or a mononuclear or polynuclear C.sub.5 -C.sub.20 cycloaliphatic or C.sub.6 -C.sub.20 aromatic radical or is a group of the formula II ##STR2## in which T is methylene, isopropylidene, CO, O, S or SO.sub.2 and R.sub.5 is hydrogen or phenyl, can be crosslinked either photochemically or by heat and produce polymers having excellent properties, in particular a very high resistance to heat. They are particularly suitable for the production of heat-resistant photolithographs or as matrix resins for the production of composite materials.

Abstract: Metallic patterns, such as printed circuits, are prepared by immersing metal substrates, bearing electrodeposited films and resist films in patterned areas, into an aqueous solution or dispersion of a hardening agent so that the hardening agent diffuses only into the electrodeposited film. This is followed by curing the hardening agent by heat or irradiation to render it resistant to the solvent used to remove the resist film and to the etchant solution for the metal exposed when the resist film is removed.

Abstract: A method of making a pattern of an electrically conductive material which comprises(i) electrodepositing on an electrically conductive surface a film comprising a photocurable organic resin,(ii) forming on the electrodeposited film a predetermined pattern of a resist co-cured with with underlying areas of the electrodeposited film by exposure to actinic radiation, thereby leaving predetermined areas of the electrodeposited film uncovered, and(iii) removing the uncovered areas of the electrodeposited film by treatment with a solvent therefor, thereby forming a surface comprising bare conductive material in predetermined areas and, in other predetermined areas, photocured resist securely bonded to the electrically conductive surface through the cured areas of the electrodeposited film covered by the resist.The method is useful in the production of printed circuits.

Abstract: A process for the formation of an image comprises(i) applying to a substrate a layer of a liquid composition which comprises(A) a polymerizable material having, on average, more than one polymerizable acrylic group per molecule,(B) a first radiation-activated polymerization initiator for (A) and(C) a second radiation-activated polymerization initiator for (A), the initiator (B) being activatable by radiation of longer wavelength than that of radiation by which (C) is activatable,the composition being substantially free from polymerizable epoxide or vinyl ether groups when (B) or (C) is an aromatic onium salt,(ii) subjecting the composition to radiation having a wavelength at which one of (B) and (C) is activated but the other is not substantially activated, thereby polymerizing (A) such that the layer of liquid composition is solidified but remains curable,(iii) subjecting the solidified layer in a predetermined pattern to radiation having a wavelength at which the initiator not activated in stage (ii) is act

Abstract: A polymerizable composition comprises a mixture of(A) a substance having at least one allyl- or methallyl-substituted bicyclo[2.2.1]-hept-5-ene-2,3-dicarboxylic acid imide residue, and(B) a substance having at least one polymerizable residue of formulaCH.sub.2 =C(R.sup.1)COO-- Iwhere R.sup.1 denotes a hydrogen atom or a methyl group.Typically, (A) is bis[4-(allylbicyclo[2.2.1]hept-5-ene-2,3-dicarboximidophenyl)]methane and (B) is an acrylate or methacrylate of a polyhydric alcohol. The compositions can be photopolymerized or heat-cured. They are suitable for use in prepreg manufacture and in image formation.

Abstract: A method of making a metallic pattern on a substrate having a surface comprising bare metal in predetermined areas and metal coated by a resist in remaining areas comprises(i) protecting the bare metal by electrodepositing thereon a heat-curable polymeric film having (a) a group which is reactive with an isocyanate group and (b) a blocked isocyanate group,(ii) heating the electrodeposited polymeric film to render it resistant to a solvent with which the resist is removable,(iii) removing the resist from said remaining areas using a solvent which does not remove the electrodeposited polymeric film, thereby exposing metal in said remaining areas, and(iv) etching the metal exposed in step (iii) using an etchant which does not remove the electrodeposited polymeric film, thereby leaving a metallic pattern protected by the electrodeposited polymeric film, which can be removed subsequently using a solvent therefor.The method is useful in the production of printed circuits.

Abstract: A process for the formation of an image comprises(i) applying to a substrate a layer of a liquid composition comprising(A) a residue which is cationically polymerizable or polymerizable by means of free radicals,(B) a radiation-activated polymerization initiator for (A) and(C) a radiation-solubilizable residue,(ii) subjecting the composition to radiation having a wavelength at which (B) is activated but at which (C) is not substantially activated, optionally followed by heating, thereby polymerizing (A) such that the layer of liquid composition is solidified,(iii) subjecting the solidified layer in a predetermined pattern to radiation having a wavelength which is different from that of the radiation used in stage (ii) and at which the residue (C) is activated, such that the solidified layer is rendered more soluble in a developer in exposed areas than in unexposed areas, and(iv) removing the exposed areas by treatment with a developer.

Abstract: The invention provides a process for the production of an image which comprises(i) applying to a substrate a layer of a liquid composition comprising(A) a cationically polymerizable residue(B) a radiation-activated polymerization initator for (A)(C) a radiation-curable residue that is different from (A) and optionally(D) a radiation activated initiator for the cure of (C),(ii) subjecting the composition to actinic radiation having a wavelength at which initiator (B) is activated but at which the residue (C) and/or initiator (D) is not substantially activated, followed by heating, if necessary, so that (A) is polymerized and the layer of liquid composition is solidified, but remains curable,(iii) subjecting the solidified layer in a predetermined pattern to actinic radiation having a wavelength that is different from that of the radiation used in stage (ii) and at which the radiation-curable residue (C) and/or the initiator (D) is activated, such that in the exposed areas (C) is substantially cured, and(iv) re

Abstract: Metallic surfaces, especially of ferrous metals, are coated by passing an electric current at a voltage of at least 15 V between the metallic surface as anode and a cathode in contact with a composition comprising(A) an epoxide resin, and(B) a salt of formula ##STR1## where A.sup.y+ denotes a cation which is a metal, a metal complex an organometallic, a heterocycle, a sulphoxonium, ammonium, a substituted ammonium or a phosphonium ion,y denotes 1, 2, or 3,Z.sup.- denotes an anion selected from perchlorate, trifluoromethane sulphonate pentafluorohydroxoantimonate, and the complex anions of formula MQ.sub.d.sup.-,M represents a boron, phosphorus, antimony or arsenic atomQ represents a halogen atom, andd is 4 or 6 and is one more than the valency of M, whereby polymerized epoxide resin is deposited on the metallic surface.

Abstract: A process for the production of an image on a substrate comprises(i) inserting the substrate as an electrode into a liquid composition comprising(A) a cationically polymerizable material,(B) a polymerizing agent for (A) which is activated by an electric current, and(C) a photosensitive material,(ii) passing an electric current through the liquid composition between the substrate and another electrode, such that a photosensitive layer of essentially solid, polymerized material is deposited on the surface of the substrate,(iii) removing the substrate from the liquid composition,(iv) exposing the photosensitive layer to actinic radiation in a predetermined pattern so as to effect a difference in solubility between exposed parts and unexposed parts of the layer, and(v) removing more soluble parts of the layer by treatment with a solvent, leaving less soluble parts of the layer on the substrate.

Abstract: Cationically polymerizable materials, such as epoxide resins, phenoplasts, and aminoplasts, are polymerized by passing an electric current through a composition comprising(A) the cationically polymerizable material, and(B) a boron trifluoride complex,between an anode and a cathode in contact with the composition, whereby polymerized material is deposited on the anode.Typical complexes (B) are those of boron trifluoride with primary, secondary, or tertiary amines or with trialkyl or triaryl phosphines.The method is a particularly suitable means for coating conductive substrates, giving a rapid cure without the need for special formulations to render the polymers electrodepositable.