Abstract: The present invention relates to new methods for manufacturing electronic packaging devices, particularly printed circuit boards. Methods of the invention include use of reduced pH sweller and etch treatments that can produce printed circuit boards and other devices that are substantially more robust and reliable than produced by prior methods.

Abstract: A process for electroplating a substrate having a surface comprising metallic and non-metallic regions. The process is characterized by selectively forming a protective film over the metallic regions of the substrate surface and forming a sulfide coating selectively over the remaining portions of said substrate. The protective film enables selective sulfide formation only on metallic sites without formation of a sulfide coating on metallic surface regions of the substrate which would otherwise interfere with metal-to-metal bond during electroplating. Following formation of the sulfide conversion coating, the protective film is removed and the surface of the substrate electroplated.