Patents by Inventor Christopher S. Baldwin

Christopher S. Baldwin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230352412
    Abstract: A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.
    Type: Application
    Filed: July 12, 2023
    Publication date: November 2, 2023
    Inventors: Yidnekachew S. MEKONNEN, Kemel AYGUN, Ravindranath V. MAHAJAN, Christopher S. BALDWIN, Rajasekaran SWAMINATHAN
  • Patent number: 11742293
    Abstract: A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: August 29, 2023
    Assignee: Intel Corporation
    Inventors: Yidnekachew S. Mekonnen, Kemel Aygun, Ravindranath V. Mahajan, Christopher S. Baldwin, Rajasekaran Swaminathan
  • Patent number: 11577337
    Abstract: Methods and apparatus to control the acoustic properties of optical cables used as in-well oil and gas probes for acoustic monitoring, such as distributed acoustic sensing (DAS). One example aspect provides a solid path for the acoustic wave to propagate from an outside armor layer of the cable to the sensing optical waveguide embedded therein. Another example aspect offers ways to spatially dispose the optical sensing elements to create response delays indicative of the propagation speed and/or direction of an acoustic wave. Yet another example aspect provides ways to utilize additional spectral interrogation to increase ultimate spatial resolution. Yet another example aspect provides ways to locally vary the acoustic properties along the length of the cable.
    Type: Grant
    Filed: September 22, 2020
    Date of Patent: February 14, 2023
    Assignee: WEATHERFORD TECHNOLOGY HOLDINGS, LLC
    Inventors: Andre R. Vincelette, Christopher S. Baldwin, Paul Lefebvre, Hongbo Li, Domino Taverner, James R. Dunphy
  • Publication number: 20210008657
    Abstract: Methods and apparatus to control the acoustic properties of optical cables used as in-well oil and gas probes for acoustic monitoring, such as distributed acoustic sensing (DAS). One example aspect provides a solid path for the acoustic wave to propagate from an outside armor layer of the cable to the sensing optical waveguide embedded therein. Another example aspect offers ways to spatially dispose the optical sensing elements to create response delays indicative of the propagation speed and/or direction of an acoustic wave. Yet another example aspect provides ways to utilize additional spectral interrogation to increase ultimate spatial resolution. Yet another example aspect provides ways to locally vary the acoustic properties along the length of the cable.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 14, 2021
    Inventors: Andre R. VINCELETTE, Christopher S. BALDWIN, Paul LEFEBVRE, Hongbo LI, Domino TAVERNER, James R. DUNPHY
  • Patent number: 10843290
    Abstract: Methods and apparatus to control the acoustic properties of optical cables used as in-well oil and gas probes for acoustic monitoring, such as distributed acoustic sensing (DAS). One example aspect provides a solid path for the acoustic wave to propagate from an outside armor layer of the cable to the sensing optical waveguide embedded therein. Another example aspect offers ways to spatially dispose the optical sensing elements to create response delays indicative of the propagation speed and/or direction of an acoustic wave. Yet another example aspect provides ways to utilize additional spectral interrogation to increase ultimate spatial resolution. Yet another example aspect provides ways to locally vary the acoustic properties along the length of the cable.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: November 24, 2020
    Assignee: Weatherford Technology Holdings, LLC
    Inventors: Andre R. Vincelette, Christopher S. Baldwin, Paul Lefebvre, Hongbo Li, Domino Taverner, James R. Dunphy
  • Patent number: 10837274
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Grant
    Filed: April 1, 2019
    Date of Patent: November 17, 2020
    Assignee: WEATHERFORD CANADA LTD.
    Inventors: Andre R. Vincelette, Jason Scott Kiddy, John Niemczuk, Christopher S. Baldwin, Paul Lefebvre
  • Publication number: 20190363049
    Abstract: A multiple die package is described that has an embedded bridge to connect the dies. One example is a microelectronic package that includes a package substrate, a silicon bridge embedded in the substrate, a first interconnect having a first plurality of contacts at a first location of the silicon bridge, a second interconnect having a second plurality of contacts at a second location of the silicon bridge, a third interconnect having a third plurality of contacts at a third location of the silicon bridge, and an electrically conductive line in the silicon bridge connecting a contact of the first interconnect, a contact of the second interconnect, and a contact of the third interconnect each to each other.
    Type: Application
    Filed: March 22, 2017
    Publication date: November 28, 2019
    Inventors: Yidnekachew S. MEKONNEN, Kemel AYGUN, Ravindranath V. MAHAJAN, Christopher S. BALDWIN, Rajasekaran SWAMINATHAN
  • Publication number: 20190226321
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Application
    Filed: April 1, 2019
    Publication date: July 25, 2019
    Inventors: Andre R. VINCELETTE, Jason Scott KIDDY, John NIEMCZUK, Christopher S. BALDWIN, Paul LEFEBVRE
  • Patent number: 10246989
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Grant
    Filed: August 11, 2017
    Date of Patent: April 2, 2019
    Assignee: WEATHERFORD TECHNOLOGY HOLDINGS, LLC
    Inventors: Andre R. Vincelette, Jason S. Kiddy, John B. Niemczuk, Christopher S. Baldwin, Paul Lefebvre
  • Publication number: 20180087371
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Application
    Filed: August 11, 2017
    Publication date: March 29, 2018
    Inventors: Andre R. VINCELETTE, Jason S. KIDDY, John B. NIEMCZUK, Christopher S. BALDWIN, Paul LEFEBVRE
  • Publication number: 20160245071
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Application
    Filed: May 5, 2016
    Publication date: August 25, 2016
    Inventors: Andre R. VINCELETTE, Jason S. KIDDY, John B. NIEMCZUK, Christopher S. BALDWIN, Paul LEFEBVRE
  • Patent number: 9418906
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 3, 2015
    Date of Patent: August 16, 2016
    Assignee: Intel Corporation
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Publication number: 20160209584
    Abstract: Methods and apparatus to control the acoustic properties of optical cables used as in-well oil and gas probes for acoustic monitoring, such as distributed acoustic sensing (DAS). One example aspect provides a solid path for the acoustic wave to propagate from an outside armor layer of the cable to the sensing optical waveguide embedded therein. Another example aspect offers ways to spatially dispose the optical sensing elements to create response delays indicative of the propagation speed and/or direction of an acoustic wave. Yet another example aspect provides ways to utilize additional spectral interrogation to increase ultimate spatial resolution. Yet another example aspect provides ways to locally vary the acoustic properties along the length of the cable.
    Type: Application
    Filed: January 13, 2016
    Publication date: July 21, 2016
    Inventors: Andre R. VINCELETTE, Christopher S. BALDWIN, Paul LEFEBVRE, Hongbo LI, Domino TAVERNER, James R. DUNPHY
  • Patent number: 9347312
    Abstract: A sensor arrangement using an optical fiber and methodologies for performing an analysis of a subterranean formation, such as a subterranean formation containing a hydrocarbon based fluid. The sensor arrangement may be used to measure one or more physical parameters, such as temperature and/or pressure, at a multiplicity of locations in the subterranean reservoir. The sensor arrangement may comprise a sensor array comprising an elongated outer casing for insertion in the subterranean formation and into a fluid in the subterranean formation. The sensor array may comprise an optical fiber defining an optical path that links one or more temperature sensors and one or more pressure sensors and transports measurement data generated by the temperature and pressure sensors. A data processing system may be connected to the sensor array to receive measurements from the sensor array and to compute one or more values of a property of an extraction installation operating on the subterranean formation.
    Type: Grant
    Filed: April 22, 2010
    Date of Patent: May 24, 2016
    Assignee: WEATHERFORD CANADA PARTNERSHIP
    Inventors: Andre R. Vincelette, Jason S. Kiddy, John B. Niemczuk, Christopher S. Baldwin, Paul Lefebvre
  • Publication number: 20150340295
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Application
    Filed: August 3, 2015
    Publication date: November 26, 2015
    Applicant: INTEL CORPORATION
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Patent number: 9111927
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 11, 2012
    Date of Patent: August 18, 2015
    Assignee: Intel Corporation
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Patent number: 8834184
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Grant
    Filed: May 10, 2012
    Date of Patent: September 16, 2014
    Assignee: Intel Corporation
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Publication number: 20140241681
    Abstract: Methods and apparatus are provided for transmitting light along multiple pathways using a multi-core optical device. One example apparatus generally includes a plurality of large diameter optical waveguides, each having a core and a cladding, and a body having a plurality of bores with the optical waveguides disposed therein, wherein at least a portion of the cladding of each of the optical waveguides is fused with the body, such that the apparatus is a monolithic structure. Such an apparatus provides for a cost- and space-efficient technique for feedthrough of multiple optical waveguides. Also, the body may have a large outer diameter which can be shaped into features of interest, such as connection alignment or feedthrough sealing features. For some embodiments, at least some of the cores may have different structural parameters (e.g., size and/or shape).
    Type: Application
    Filed: November 15, 2013
    Publication date: August 28, 2014
    Applicant: WEATHERFORD/LAMB, INC.
    Inventors: Christopher S. BALDWIN, Thomas W. F. ENGEL
  • Publication number: 20120322314
    Abstract: In some embodiments an Integrated Circuit package includes a plurality of system functional pins, at least one system functional pin depopulation zone, and at least one non-system functional pin located in the at least one functional pin depopulation zone. Other embodiments are described and claimed.
    Type: Application
    Filed: May 10, 2012
    Publication date: December 20, 2012
    Inventors: Mark B. Trobough, Christopher S. Baldwin
  • Patent number: D830488
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: October 9, 2018
    Inventors: Robert B. Johnson, Christopher S. Baldwin