Abstract: A material for bonding a first wafer to a second wafer, which includes an insulating adhesive with conductive particles embedded in the adhesive substance. When the adhesive is applied and melted or fused, and pressure is applied between the first wafer and the second wafer, the first wafer approaches the second wafer until a minimum separation is reached, defined by a dimension of the conductive particles. Each of the first wafer and the second wafer may have circuitry formed thereon, and the conductive particles may form a conductive path between the circuitry on one wafer and the circuitry on the other wafer. Advantageously, the high fusing temperature required by the insulating adhesive may also serve to activate a getter material, formed in the device cavity between the first wafer and the second wafer.

Abstract: Systems and methods for forming a configurable power supply uses a plurality of dual substrate MEMS switches to couple a plurality of power cells to provide a selectable, or variable, output voltage. The same circuit may output two different voltages to power two different circuits of the device, or may distribute the load evenly amongst the cells. Thus, the configurable power supply may extend the lifetime and improve the reliability of the device, or decrease its weight, size and cost.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: A separated MEMS thermal actuator is disclosed which is largely insensitive to creep in the cantilevered beams of the thermal actuator. In the separated MEMS thermal actuator, a inlaid cantilevered drive beam formed in the same plane, but separated from a passive beam by a small gap. Because the inlaid cantilevered drive beam and the passive beam are not directly coupled, any changes in the quiescent position of the inlaid cantilevered drive beam may not be transmitted to the passive beam, if the magnitude of the changes are less than the size of the gap.

Abstract: An optical MEM device is fabricated with a patterned device layer formed on a silicon wafer. Preferably, the patterned device layer is patterned with plurality of ribbons and/or access trenches. The central portion of the ribbon is released from the silicon wafer using a selective etch process, wherein a cavity is formed under the central portion of the ribbon, while opposing ribbon ends remain attached to the wafer. The selective etching process preferably utilizes an enchant comprising xenon difluoride. In accordance with further embodiments, the silicon wafer is doped, patterned or otherwise modified to enhance the selectivity of the etching process.

Abstract: An electromagnetic read/write system includes a contact interface formed by a pole-structure-carrying wear pad and a recording surface. The uppermost portion of the recording surface is characterized by a buffed, generally planarized topography. Lower elevations of the recording surface may be texturized or untexturized. Various methods of producing such an interface are described. The interface of the present invention provides dramatically improved longevity, i.e, wear performance through long term read/write operation.

Abstract: A operationally contacting hard disk drive system has reduced friction due to lower capillary adhesion between the disk surface and a transducer in a substantially continuous sliding relationship with the surface. The disk surface has an adhesion-reducing texture that includes a microscopic RMS roughness in a range between about 1.5 and 5.5 nanometers, or a number of asperities having a mean plane to peak height in a range between about 6 and 50 nanometers. The roughness may increase in a radially graded fashion to compensate for the increased linear velocity and concomitant frictional power loss near the outer diameter of the disk. It is important that the uppermost reaches of the textured surface are smooth but not flat in order to obtain lasting low friction operation, which is accomplished by constructing the surface with a highest approximately one percent having an average radius of curvature in a range between 2 microns and 100 microns.

Abstract: The present invention is a method for bonding a lubricant onto the surface of rotating storage media. In particular, the method bonds reactive and non-reactive lubricants onto the carbon based protective coating of a magnetic storage disk. The lubricant is first applied onto the disk surface through conventional coating techniques, such as dipping, spinning, spraying, or vapor deposition. The thickness of the applied coating is thicker than the final bonded thickness of the lubricant. Typically, the applied thickness of the film is approximately 30 Angstroms. The lubricant coated disk surface is then exposed to low energy electron irradiation. The energy level of the accelerated electrons is below 100 eV. The lubricated film is exposed to a dosage level of approximately 1000 microcoulombs per square centimeter. This dosage level bonds approximately 15 Angstroms of lubricant to the disk surface. The non-bonded or excess lubricant is then rinsed off in a liquid freon or other suitable rinse.

Abstract: Controlled laser texturing of a magnetic recording disk is accomplished by use of a textured test band on the disk and an analyzing laser system to provide feedback to the texturing laser. The analyzing laser system determines, from diffracted laser light, the average height of the laser-induced bumps formed in the test band by the texturing laser. The analyzing laser beam is directed to the substrate surface and overlaps a group of individual bumps formed in a repetitive pattern. A scanning linear photodector array receives light diffracted from the surface. The digitized output of the array is the angular distribution of diffracted light intensities and is used to compute the average height of the bumps in the test band. The disk is then translated radially so that the texturing laser is aligned with the region of the disk where the textured landing zone is to be placed.

Abstract: The present invention is a method for bonding a lubricant onto the surface of rotating storage media. In particular, the method bonds reactive and non-reactive lubricants onto the carbon based protective coating of a magnetic storage disk. The lubricant is first applied onto the disk surface through conventional coating techniques, such as dipping, spinning, spraying, or vapor deposition. The thickness of the applied coating is thicker than the final bonded thickness of the lubricant. Typically, the applied thickness of the film is approximately 30 Angstroms. The lubricant coated disk surface is then exposed to low energy electron irradiation. The energy level of the accelerated electrons is below 100 eV. The lubricated film is exposed to a dosage level of approximately 1000 microcoulombs per square centimeter. This dosage level bonds approximately 15 Angstroms of lubricant to the disk surface. The non-bonded or excess lubricant is then rinsed off in a liquid freon or other suitable rinse.