Patents by Inventor Christopher T. Ratliff
Christopher T. Ratliff has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 6900413Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: GrantFiled: September 30, 2002Date of Patent: May 31, 2005Assignee: Aviza Technology, Inc.Inventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
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Patent number: 6844528Abstract: An apparatus for heat treatment of a wafer. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: GrantFiled: September 30, 2002Date of Patent: January 18, 2005Assignee: Aviza Technology, Inc.Inventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
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Publication number: 20030089698Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: ApplicationFiled: September 30, 2002Publication date: May 15, 2003Applicant: ASML US, Inc.Inventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
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Publication number: 20030024920Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: ApplicationFiled: October 1, 2002Publication date: February 6, 2003Applicant: ASML US, Inc.Inventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
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Patent number: 6462310Abstract: An apparatus for heat treatment of a wafer is disclosed. The apparatus includes a heating chamber having a heat source. A cooling chamber is positioned adjacent to the heating chamber and includes a cooling source. A wafer holder is. configured to move between the cooling chamber and the heating chamber through a passageway and one or more shutters defines the size of the passageway. The one or more shutters are movable between an open position where the wafer holder can pass through the passageway and an obstructing position which defines a passageway which is smaller than the passageway defined when the shutter is in the open position.Type: GrantFiled: August 11, 2000Date of Patent: October 8, 2002Assignee: ASML US, INCInventors: Christopher T. Ratliff, Jeffrey M. Kowalski, Taiqing Qiu
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Patent number: 6005225Abstract: A vertical rapid heating furnace for treating semiconductor wafers comprising a hot wall reaction tube positioned within a cylindrical array of circular parallel heating elements substantially concentric therewith, each heating element being spaced from the hot wall reaction tube, each heating element comprising a coil of resistance heating conductor. The coiled resistance heating conductor can be a coil of resistance heating wire, the coil having an outer diameter of from 1 to 7 mm and supported in an annular heating element support. Each heating element support is dimensioned to support and accommodate the thermally expanded heating element supported therein at both the minimum and maximum furnace temperatures. Preferably, each annular heating element support is provided by an annular recess in the insulation surrounding the array of heating elements.Type: GrantFiled: March 28, 1997Date of Patent: December 21, 1999Assignee: Silicon Valley Group, Inc.Inventors: Jeffrey M. Kowalski, Christopher T. Ratliff, Terry A. Koble, Jr., Jon H. Pack, Michael H. Yang
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Patent number: 5618351Abstract: Thermal treatment boat comprising a cylinder having a central axis and a plurality of band slots having opposed upper and lower surfaces in planes perpendicular to said central axis and spaced at predetermined locations along said central axis. At least one slot in each set extends around at least 180.degree. and less than of the full circumference of said cylinder. Pairs of adjacent band slots define an annular band therebetween. The height of each slot being from about 3.8 to 12.7 mm. Each of the bands having a height, Height.sub.Band, in mm, according to the equation: ##EQU1## wherein Height.sub.Band is always .ltoreq. wafer thickness; ColumnHeight is the total height of the cylinder, mm; BandSlotHeight is the height of the slot, mm; and NumberBands is the total number of bands in the treatment boat. The cylinder can include a wafer loading effector slot therethrough in a plane of the central axis extending along the length of the cylinder.Type: GrantFiled: November 28, 1995Date of Patent: April 8, 1997Assignee: Silicon Valley Group, Inc.Inventors: Terry A. Koble, Jr., Anthony Dip, Erik H. Engdahl, Ian R. Oliver, Christopher T. Ratliff