Patents by Inventor CHU-FENG LIAO

CHU-FENG LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Benchmark circuit on a semiconductor wafer and method for operating the same
    Patent number: 11927628
    Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.
    Type: Grant
    Filed: July 16, 2021
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chu-Feng Liao, Hung-Ping Cheng, Yuan-Yao Chang, Shuo-Wen Chang
  • BENCHMARK CIRCUIT ON A SEMICONDUCTOR WAFER AND METHOD FOR OPERATING THE SAME
    Publication number: 20230014148
    Abstract: The present disclosure provides a semiconductor wafer. The semiconductor wafer includes: a scribe line between a first row of dies and a second row of dies; and a benchmark circuit disposed adjacent to the scribe line and electrically coupled to a first conductive contact and a second conductive contact. The benchmark circuit includes a first device-under-test (DUT); a second DUT; a first switching circuit configured to selectively couple the first DUT and the second DUT to the first conductive contact; and a second switching circuit configured to selectively couple the first DUT and the second DUT to the second conductive contact.
    Type: Application
    Filed: July 16, 2021
    Publication date: January 19, 2023
    Inventors: CHU-FENG LIAO, HUNG-PING CHENG, YUAN-YAO CHANG, SHUO-WEN CHANG