Patents by Inventor Chu-Hsin Yang

Chu-Hsin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fastening structure for stacking electric modules
    Patent number: 7420813
    Abstract: A fastening structure for stacking a plurality of electronic modules on a mainboard is provided. The fastening structure includes a locking member and a plurality of supporting members. The locking member is disposed on a first electronic module for locking the first electronic module onto the mainboard by locking elements. The supporting members are connected to the locking member and are used to carry a second electronic module above the first electronic module. Therefore, under a limited space for disposing the first/second electronic modules, the fastening structure of the present invention increases the space utilization, thereby enhancing the strength of the structure for the first/second electronic modules.
    Type: Grant
    Filed: February 16, 2007
    Date of Patent: September 2, 2008
    Assignee: Inventec Corporation
    Inventor: Chu-Hsin Yang
  • FASTENING STRUCTURE FOR STACKING ELECTRIC MODULES
    Publication number: 20080137311
    Abstract: A fastening structure for stacking a plurality of electronic modules on a mainboard is provided. The fastening structure includes a locking member and a plurality of supporting members. The locking member is disposed on a first electronic module for locking the first electronic module onto the mainboard by locking elements. The supporting members are connected to the locking member and are used to carry a second electronic module above the first electronic module. Therefore, under a limited space for disposing the first/second electronic modules, the fastening structure of the present invention increases the space utilization, thereby enhancing the strength of the structure for the first/second electronic modules.
    Type: Application
    Filed: February 16, 2007
    Publication date: June 12, 2008
    Applicant: INVENTEC CORPORATION
    Inventor: Chu-Hsin Yang