Patents by Inventor Chu-Jung Sha

Chu-Jung Sha has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6825749
    Abstract: In a symmetric crossover structure of two lines formed of a lower conductor layer and a higher conductor layer above a substrate, each of the two lines is branched to two routes at where they are crossed over to each other. The first route of the first line uses the higher layer to cross the first route of the second line and the lower layer to cross over the second route of the second line. The second route of the first line uses the lower layer to cross over the first route of the second line and the higher layer to cross over the second route of the second line. The two lines therefore have symmetric coupling effects to the substrate.
    Type: Grant
    Filed: January 26, 2004
    Date of Patent: November 30, 2004
    Assignee: National Applied Research Laboratories National Chip Implementation Center
    Inventors: Tser Yu Lin, Chin-Fong Chiu, Ying-Zong Juang, Chu-Jung Sha, Li-E Li