Abstract: The present disclosure provides an electronic device including a first sensing circuit, a second sensing circuit and a power line. The first sensing circuit includes a first sensing unit and a first transistor, and a first end of the first sensing unit is coupled to a control end of the first transistor. The second sensing circuit includes a second sensing unit and a second transistor, and a first end of the second sensing unit is coupled to a control end of the second transistor. A first end of the first transistor and a first end of the second transistor are coupled to the power line.

Abstract: Aspects described herein include devices and methods with chain routing of signals for massive antenna arrays. In some aspects, an apparatus is provided that includes a first millimeter wave (mmW) transceiver having a first port, a second port, one or more antenna elements, a plurality of chain mmW transceiver ports, and switching circuitry. The switching circuitry is controllable by control data to route portions of a merged clock and data signal and a merged control and data signal between a first route between the one or more antenna elements and the first port and a second route between the one or more antenna elements and the second port and a third route between the first port and the plurality of chain mmW transceiver ports and a fourth route between the second port and the plurality of chain mmW transceiver ports.

Abstract: A system for a semiconductor fabrication facility comprises a transporting tool configured to move a carrier, a first manufacturing tool configured to accept the carrier facing in a first direction, a second manufacturing tool configured to accept the carrier facing in the second direction, and an orientation tool. The carrier is moved to the orientation tool by the transporting tool prior to being moved to the first manufacturing tool or the second manufacturing tool by the transporting tool. The orientation tool rotates the carrier so that the carrier is accepted by the first manufacturing tool or the second manufacturing tool. The transporting tool, the first manufacturing tool, the second manufacturing tool and the orientation tool are physically separated from each other.

Abstract: A BJT and methods of forming the same are described. The BJT includes a collector region disposed in a substrate, a lower base structure disposed on the collector region, a first dielectric layer surrounding a bottom portion of the lower base structure, and a second dielectric layer surrounding a top portion of the lower base structure. The first dielectric layer includes a first oxide, the second dielectric layer includes a second oxide, and the first and second oxides have different densities. The BJT further includes an upper base structure disposed on the second dielectric layer and the lower base structure, an emitter region disposed on the lower base structure, a sidewall spacer structure disposed between the emitter region and the upper base structure, and the sidewall spacer structure includes a material different from materials of the first and second dielectric layers.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a collector element formed in or over a semiconductor substrate. The semiconductor device structure also includes a semiconductor element over the collector element, and the semiconductor element has a top surface, a bottom surface, and a side surface. The semiconductor device structure further includes an emitter element over the top surface of the semiconductor element. In addition, the semiconductor device structure includes a base element over the collector element and in direct contact with the side surface of the semiconductor element.

Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a collector element formed in or over a semiconductor substrate. The semiconductor device structure also includes a semiconductor element over the collector element, and the semiconductor element has a top surface, a bottom surface, and a side surface. The semiconductor device structure further includes an emitter element over the top surface of the semiconductor element. In addition, the semiconductor device structure includes a base element over the collector element and in direct contact with the side surface of the semiconductor element.

Abstract: A housing having a fixing mechanism for fixing at least one electronic device includes a housing body and a pivotable fixing mechanism. The fixing mechanism includes a first positioning device and a second positioning device. The second positioning device has a first fixing member for accommodating a electronic device, and a second fixing member detachably engaged with the first positioning device to fix the second positioning device in a first position on the first positioning device. When the second fixing member is disengaged, the second positioning device is fixed in a second position on the first positioning device, and when the first positioning device is rotated outwards relative to the housing body, the second positioning device can be removed or installed on the first positioning device through the second fixing member.

Abstract: A housing having a fixing mechanism for fixing at least one electronic device includes a housing body and a pivotable fixing mechanism. The fixing mechanism includes a first positioning device and a second positioning device. The second positioning device has a first fixing member for accommodating a electronic device, and a second fixing member detachably engaged with the first positioning device to fix the second positioning device in a first position on the first positioning device. When the second fixing member is disengaged, the second positioning device is fixed in a second position on the first positioning device, and when the first positioning device is rotated outwards relative to the housing body, the second positioning device can be removed or installed on the first positioning device through the second fixing member.

Abstract: A housing includes a housing body defining a receiving space, having a lateral opening, and including two fixed plates one of which is formed with a latch hole. A carrier device includes a carrier frame rotatably connected between the fixed plates and rotatable into and out of the receiving space through the lateral opening and having at least one first connection part, at least one locking member releasably engaged to the latch hole and including a second connection part slidably connected to the first connection part, and at least one resilient biasing element configured to bias the locking member toward the latch hole.

Abstract: A chassis module for fixing electronic devices includes a fixing chassis unit and a first movable chassis unit. The fixing chassis unit has a fixing chassis body and a first fixing retaining structure disposed on a first lateral wall of the fixing chassis body. The first movable chassis unit is detachably disposed in the fixing chassis body. The first movable chassis unit has a first movable chassis body, a first movable retaining structure disposed on a first lateral wall of the first movable chassis body and mated with the first fixing retaining structure, and at least one support element bent downwardly and extended from one lateral wall of the first movable chassis body. Therefore, after the first movable chassis unit is assembled in the fixing chassis unit, the support element provides support function for the first movable chassis unit to prevent the first movable chassis unit from inclining or collapsing.

Abstract: A chassis module for fixing electronic devices includes a fixing chassis unit, a first movable chassis unit and a second movable chassis unit. The fixing chassis unit has a fixing chassis body. The first movable chassis unit is detachably disposed in the fixing chassis body and has a first movable chassis body. One lateral wall of the first movable chassis body and one lateral wall of the fixing chassis body are retainedly mated with each other. The second movable chassis unit is detachably disposed in the fixing chassis body and has a second movable chassis body. One lateral wall of the second movable chassis body and another later wall of the first movable chassis body are retainedly mated with each other, and another lateral wall of the second movable chassis body and another lateral wall of the fixing chassis body are retainedly mated with each other.

Abstract: A housing includes a housing body defining a receiving space, having a lateral opening, and including two fixed plates one of which is formed with a latch hole. A carrier device includes a carrier frame rotatably connected between the fixed plates and rotatable into and out of the receiving space through the lateral opening and having at least one first connection part, at least one locking member releasably engaged to the latch hole and including a second connection part slidably connected to the first connection part, and at least one resilient biasing element configured to bias the locking member toward the latch hole.

Abstract: A computer housing includes a front plate, a front panel and a fixing mechanism for the front panel. The front plate has at least two holes. The front panel has at least two engaging slots corresponding to the holes. The fixing mechanism includes two hooking plates and at least two springs. The hooking plates are slidably disposed on an inner side of the front plate. Each of the hooking plates has at least one hook passing through the hole to limit the hooking plate slidably between a first position and a second position. The spring connects the hooking plate and the front plate. The elasticity of the spring enforces the hooking plate and the hook abuts one edge of the hole to maintain the hooking plate on the first position.

Abstract: A computer housing includes a front plate, a front panel and a fixing mechanism for the front panel. The front plate has at least two holes. The front panel has at least two engaging slots corresponding to the holes. The fixing mechanism includes two hooking plates and at least two springs. The hooking plates are slidably disposed on an inner side of the front plate. Each of the hooking plates has at least one hook passing through the hole to limit the hooking plate slidably between a first position and a second position. The spring connects the hooking plate and the front plate. The elasticity of the spring enforces the hooking plate and the hook abuts one edge of the hole to maintain the hooking plate on the first position.

Abstract: A chassis module for fixing electronic devices includes a fixing chassis unit and a first movable chassis unit. The fixing chassis unit has a fixing chassis body and a first fixing retaining structure disposed on a first lateral wall of the fixing chassis body. The first movable chassis unit is detachably disposed in the fixing chassis body. The first movable chassis unit has a first movable chassis body, a first movable retaining structure disposed on a first lateral wall of the first movable chassis body and mated with the first fixing retaining structure, and at least one support element bent downwardly and extended from one lateral wall of the first movable chassis body. Therefore, after the first movable chassis unit is assembled in the fixing chassis unit, the support element provides support function for the first movable chassis unit to prevent the first movable chassis unit from inclining or collapsing.

Abstract: A chassis module for fixing electronic devices includes a fixing chassis unit, a first movable chassis unit and a second movable chassis unit. The fixing chassis unit has a fixing chassis body. The first movable chassis unit is detachably disposed in the fixing chassis body and has a first movable chassis body. One lateral wall of the first movable chassis body and one lateral wall of the fixing chassis body are retainedly mated with each other. The second movable chassis unit is detachably disposed in the fixing chassis body and has a second movable chassis body. One lateral wall of the second movable chassis body and another later wall of the first movable chassis body are retainedly mated with each other, and another lateral wall of the second movable chassis body and another lateral wall of the fixing chassis body are retainedly mated with each other.

Abstract: A chassis module includes a chassis unit, a movable retaining unit and a switch unit. The chassis unit has a chassis body, at least one first retaining element on the chassis body and a movable cover separably disposed on the chassis body. The movable retaining unit is disposed on an inner surface of the movable cover, and the movable retaining unit has at least one second retaining element selectively cooperating with the first retaining element. The switch unit is assembled on the chassis body. The switch unit has a control portion exposed from the chassis body and a push portion connected to the control portion for selectively separating the first retaining element and the second retaining element from each other. Therefore, after operating the control portion to lift the movable cover up, a user can install or detach data access devices in/from the chassis body easily.

Abstract: A microimprint/nanoimprint uniform pressing apparatus is used to provide uniform imprinting pressure to a molding material layer between a substrate and a mold. The uniform pressing apparatus includes a uniform pressing unit for being directly in contact with the mold or the substrate, so as to allow each point to have equal pressure during imprinting and utilize a simple structure to transmit uniform imprinting pressure.

Abstract: A kind of accessory handle fixing base for a bicycle, including an accessory handle, two cushions for elbow's relaxation, and fixing bases. It features include making the lower section of the fixing base be an arc position sheet, and making the radian of the position sheet with the front middle of the handle. As a result, the fixing base for fixing the accessory handle can be combined at the locking section of the handle and standpipe when the middle section of the handle is locked in an arc groove positioned at the front end of the handle standpipe and the combination groove is combined with a standpipe.

Abstract: A microimprint/nanoimprint device includes a mold, a substrate and an energy transferring module. The substrate is disposed oppositely to the mold and at least has a molding material layer. The energy transferring module includes an energy transferring member and at least one energy source, wherein the energy transferring member is connected to the substrate or the mold, and the energy source provides imprint energy to the substrate or the mold, such that at least part of the imprint energy goes through the energy transferring member to the substrate or the mold for performing imprint molding.