Abstract: A metal-oxide-semiconductor (MOS) device for radio frequency (RF) applications may include a guard ring. The guard ring may surround the MOS device and at least one other MOS device. The MOS device may further include a level zero contact layer coupled to a first interconnect layer through level zero interconnects and vias. The first interconnect layer may be for routing to the MOS device.

Abstract: A metal oxide semiconductor (MOS) varactor includes a first diffusion region of a first polarity and a second diffusion region of the first polarity on a semiconductor substrate. The MOS varactor further includes a channel between the first diffusion region and the second diffusion region on the semiconductor substrate. The channel has a surface dopant concentration less than 4e1017.

Abstract: A metal oxide semiconductor (MOS) varactor includes a first diffusion region of a first polarity and a second diffusion region of the first polarity on a semiconductor substrate. The MOS varactor further includes a channel between the first diffusion region and the second diffusion region on the semiconductor substrate. The channel has a surface dopant concentration less than 4 e1017.

Abstract: A short-channel metal oxide semiconductor varactor may include a source region of a first polarity having a source via contact. The varactor may further include a drain region of the first polarity having a drain via contact. The varactor may further include a channel region of the first polarity between the source region and the drain region. The channel region may include a gate. The varactor may further include at least one self-aligned contact (SAC) on the gate and between the source via contact and the drain via contact.

Abstract: A metal-oxide-semiconductor (MOS) device for radio frequency (RF) applications may include a guard ring. The guard ring may surround the MOS device and at least one other MOS device. The MOS device may further include a level zero contact layer coupled to a first interconnect layer through level zero interconnects and vias. The first interconnect layer may be for routing to the MOS device.

Abstract: A short-channel metal oxide semiconductor varactor may include a source region of a first polarity having a source via contact. The varactor may further include a drain region of the first polarity having a drain via contact. The varactor may further include a channel region of the first polarity between the source region and the drain region. The channel region may include a gate. The varactor may further include at least one self-aligned contact (SAC) on the gate and between the source via contact and the drain via contact.

Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals. The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units. Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.

Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals . The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units . Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.

Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals. The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units. Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.

Abstract: A Multiple-Input-Multiple-Output (MIMO) antenna device is adapted for connecting electrically to a radio frequency (RF) circuit for transmitting and receiving RF signals. The MIMO antenna device includes a circuit board, a plurality of antenna units, and a plurality of multiplexer units. The antenna units are disposed on the circuit board proximate to a peripheral edge thereof, are arranged in a loop formation, and are divided into a plurality of groups of the antenna units. Each of the multiplexer units is connected electrically to a respective one of the groups of the antenna units for selecting one of the corresponding antenna units and for connecting electrically the selected one of the corresponding antenna units to the RF circuit, thereby achieving the MIMO technique with the independently and simultaneously operating antenna units.

Abstract: A pipe body extrusion device includes a fixed unit, a holding bracket, a packing bolt, a drive unit, a pipe expanded and molded piece, a clip unit, and an operating unit; in which the holding bracket is for clipping a round pipe and putting into a holding space of the fixed unit, the packing bolt is locked into the fixed unit and then the holding bracket is clipped to be positioned, the drive unit is screwed and locked at the fixed unit including a drive rod, the pipe expanded and molded piece is installed at the drive rod and through the clip unit for rapidly integrating or disconnecting with the drive rod, and the operating unit is for driving the drive rod for leading the pipe expanded and molded piece near or away from the round pipe; thus, the present invention has the features of integral structure, simple operation, and enhancing operational efficiency.

Abstract: A power system includes a power adapter, a first power sub-system, and a second power sub-system. The power adapter provides a first DC power. The first power sub-system includes a first converter and a first controlling circuit. The first converter converts a first DC voltage into a second DC voltage, and the first controlling circuit controls a boot time of the first converter. The second power sub-system includes a second converter and a second controlling circuit. The second converter converts the first DC voltage into a third DC voltage, and the second controlling circuit controls the boot time of the second converter.