Patents by Inventor Chuan-Ming Chang
Chuan-Ming Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982798Abstract: A projection lens includes a first lens group, a second lens group and an aperture stop. The first lens group is disposed between a reduced side and a magnified side. The second lens is disposed between the first lens group and the magnified side. The second lens group has a light incident surface, a reflective surface and a light emitting surface, the light incident surface faces the first lens group, the light emitting surface faces a projection surface, the light incident surface, the light emitting surface and the first lens group are disposed at a single side of the reflective surface, and at least one of the light incident surface, the reflective surface and the light emitting surface is a freeform surface. The aperture stop is disposed between the first lens group and the second lens group. Moreover, a projection apparatus including the projection lens is also provided.Type: GrantFiled: November 5, 2021Date of Patent: May 14, 2024Assignee: Coretronic CorporationInventors: Hsin-Hsiang Lo, Wei-Ting Wu, Fu-Ming Chuang, Chuan-Chung Chang, Ching-Chuan Wei
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Publication number: 20060208364Abstract: The present invention provides an LED device with a flip chip structure. The LED device comprises an insulating substrate, an LED flip chip, a molding compound, a first conductive element, and a second conductive element. The LED flip chip is electrically connected to the connection pads on the insulating substrate via the two conductive elements. The P-type and N-type electrodes are connected to the P-type and N-type electrodes layers, respectively. The invention need not require a conventional wire bonding process. It not only increases the yield rate of the product but also makes the product more compact.Type: ApplicationFiled: March 19, 2005Publication date: September 21, 2006Inventors: Chien-Jen Wang, Nai-Wen Chang, Wei-Jen Wang, Kuo-Chun Chiang, Chuan-Ming Chang
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Patent number: 6936860Abstract: An LED includes an insulating substrate; a buffer layer positioned on the insulating substrate; an n+-type contact layer positioned on the buffer layer, the contact layer having a first surface and a second surface; an n-type cladding layer positioned on the first surface of the n+-type contact layer; a light-emitting layer positioned on the n-type cladding layer; a p-type cladding layer positioned on the light-emitting layer; a p-type contact layer positioned on the p-type cladding layer; an n+-type reverse-tunneling layer positioned on the p-type contact layer; a p-type transparent ohmic contact electrode positioned on the n+-type reverse-tunneling layer; and an n-type transparent ohmic contact electrode positioned on the second surface of the n+-type contact layer. The p-type transparent ohmic contact electrode and the n-type transparent ohmic contact electrode are made of the same materials.Type: GrantFiled: May 16, 2002Date of Patent: August 30, 2005Assignee: Epistar CorporationInventors: Shu-Wen Sung, Chin-Fu Ku, Chia-Cheng Liu, Min-Hsun Hsieh, Chao-Nien Huang, Chen Ou, Chuan-Ming Chang
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Publication number: 20030234431Abstract: A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area.Type: ApplicationFiled: October 17, 2002Publication date: December 25, 2003Applicant: Advanced Optoelectronic Technology Inc.Inventors: Teng-Huei Huang, Chuan-Ming Chang, Tse-Min Mao, Min-Huang Huang
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Patent number: 6667497Abstract: A LED package is comprised of a flat panel base and three LED dies. The flat panel base is composed of a first golden film area, a second golden film area, a third golden film area, a fourth golden film area, a first connection area, and a second connection area, wherein the first connection area and the second connection area are connected to the first golden film area. The first LED die is attached on the flat panel base by flip-chip mounting, wherein an anode of the first LED die is connected to the first golden film area, and a cathode of the first LED die is connected to the second golden film area. The second LED die is attached on the flat panel base by flip-chip mounting, wherein the second LED die is composed of an anode connected to the first golden film area, and a cathode connected to the fourth golden film area.Type: GrantFiled: October 17, 2002Date of Patent: December 23, 2003Assignee: Advanced Optoelectronic TechnologyInventors: Teng-Huei Huang, Chuan-Ming Chang, Tse-Min Mao, Min-Huang Huang
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Patent number: 6169294Abstract: A nitride light emitting diode is fabricated on a transparent sapphire substrate. The LED is then mounted upside-down on a conductive silicon substrate with a bottom electrode to serve as the output terminal for the cathode of the LED. The LED die is partially etched to expose the anode of the LED, where a top electrode is formed. In comparison with conventional LED structure with both electrodes located on top of the die, moving one electrode to the bottom allows more light to be transmitted upward and reflects the light incident downward. For equal amount of light emission, the new structure occupies less area.Type: GrantFiled: September 8, 1998Date of Patent: January 2, 2001Assignee: Epistar Co.Inventors: Lee Biing-Jye, Jou Ming-Jiunn, Jacob C. Tarn, Chuan-Ming Chang, Liu Chia-Cheng
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Patent number: 5869849Abstract: A surface-emitting AlGaInP LED is disclosed. The LED uses a GaP layer as a window layer to eliminate the current crowding effect, or may has an ITO window layer and use GaP, instead of GaAs, as the substrate to eliminate the current-crowding effect and avoid the emitted light being absorbed by the substrate. The GaP layer is bonded to the double hetero-structure epitaxy layer by a wafer bonding technique. The present invention, however, provides a manufacturing procedure which is easier and more reliable to handle than prior arts.Type: GrantFiled: October 5, 1995Date of Patent: February 9, 1999Assignee: Industry Technology Research InstituteInventors: Ming-Jiunn Jou, Ming-Yung Jow, Chuan-Ming Chang, Chia-Cheng Liu, Jinn-Kung Sheu, Biing-Jye Lee
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Patent number: 5717226Abstract: A surface-emitting AlGaInP LED is disclosed.Type: GrantFiled: September 18, 1996Date of Patent: February 10, 1998Assignee: Industrial Technology Research InstituteInventors: Biing-Jye Lee, Chuan-Ming Chang, Ming-Jiunn Jou
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Patent number: 5481122Abstract: A surface emitting AlGaInP LED having an ITO layer as a window layer to eliminate the current crowding effect, and an ohmic contact layer between its double hetero-structure of AlGaInP and the ITO layer, so that ITO can be utilized with the double hetero-structure of AlGaInP.Type: GrantFiled: July 25, 1994Date of Patent: January 2, 1996Assignee: Industrial Technology Research InstituteInventors: Ming-Jiunn Jou, Chuan-Ming Chang, Biing-Jye Lee, Jyh-Feng Lin
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Patent number: RE35665Abstract: A surface emitting AlGaInP LED having an ITO layer as a window layer to eliminate the current crowding effect, and an ohmic contact layer between its double hereto-structure of AlGaInP and the ITO layer, so that ITO can be utilized with the double hereto-structure of AlGaInP.Type: GrantFiled: June 25, 1996Date of Patent: November 18, 1997Assignee: Industrial Technology Research InstituteInventors: Jyh-Feng Lin, Chuan-Ming Chang, Biing-Jye Lee, Ming-Jiunn Jou