Patents by Inventor Chuan Wei CHANG
Chuan Wei CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240132923Abstract: Provided is a recombinant microorganism including at least two genes for producing itaconic acid and its derived monomers, and the at least two genes are located on the same expression vector. The at least two genes include one encoding cis-aconitic acid decarboxylase and the other one encoding aconitase, and the genome of the recombinant microorganism includes a gene encoding the molecular chaperone protein GroELS. Also provided is a method for producing itaconic acid by using the microorganism.Type: ApplicationFiled: March 22, 2023Publication date: April 25, 2024Inventors: I-Son NG, Jo-Shu CHANG, Chuan-Chieh HSIANG, Yeong-Chang CHEN, Yu-Chiao LIU, Chia-Wei TSAI
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Patent number: 11932207Abstract: A universal wiper base assembly structure includes a fastening base, a rear base, a combination base, and an outer cover. The fastening base includes a main body and a decorative cover. The main body has a coupling hole, an insertion slot, a protruding platform, a positioning protrusion, a first shaft hole, two limiting arc surfaces, and multiple engagement grooves. The decorative cover has a fastening slot. The rear base includes two contact blocks, a top abutting block, and two hooks. The combination base includes two side plates, a connection plate, an open groove and a second shaft hole. The outer cover includes a fastening block, an opening, and a third shaft hole. Accordingly, a variety of wiper driving arms may be positioned to the universal wiper base assembly structure, so as to improve the convenience in assembling and reduce an overall cost.Type: GrantFiled: March 21, 2023Date of Patent: March 19, 2024Assignee: DANYANG UPC AUTO PARTS CO., LTD.Inventors: Che-Wei Chang, Cheng-Kai Yang, Chuan-Chih Chang
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Patent number: 11922887Abstract: A display may include an array of pixels. Each pixel in the array includes an organic light-emitting diode coupled to associated thin-film transistors. The diode may be coupled to drive transistor circuitry, a data loading transistor, and emission transistors. The drive transistor circuitry may include at least two transistor portions connected in series. The data loading transistor has a drain region connected to a data line and a source region connected directly to the drive transistor circuitry. The data line may be connected to and overlap the drain region of the data loading transistor. The data line and the source region of the data loading transistor are non-overlapping to reduce row-to-row crosstalk.Type: GrantFiled: July 6, 2021Date of Patent: March 5, 2024Assignee: Apple Inc.Inventors: Shinya Ono, Chin-Wei Lin, Chuan-Jung Lin, Gihoon Choo, Hassan Edrees, Hei Kam, Jung Yen Huang, Pei-En Chang, Rungrot Kitsomboonloha, Szu-Hsien Lee, Zino Lee
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Publication number: 20220366102Abstract: The present disclosure provides an injection molding method and system. The injection molding method includes the operations of: sensing physical parameters associated with an injection molding product; analyzing physical parameters to generate an optimized digital twin model of a physical asset; and producing the injection molding product according to the optimized digital twin model. Analyzing the physical parameters to generate the optimized digital twin model of the physical asset includes operations of: simulating, by a digital twin model, the physical parameters to generate simulated parameters according to first input parameters; validating whether the digital twin model is an optimized digital twin model according to the simulated parameters and the physical parameters; and optimizing the digital twin model to generate the optimized digital twin model when the physical parameters differ from the simulated parameters.Type: ApplicationFiled: May 2, 2022Publication date: November 17, 2022Inventors: RONG-YEU CHANG, CHIA-HSIANG HSU, YI-HUI PENG, CHIH-CHUNG HSU, CHUAN-WEI CHANG, PO-YANG YEH
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Patent number: 11230043Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.Type: GrantFiled: June 4, 2020Date of Patent: January 25, 2022Assignee: CORETECH SYSTEM CO., LTD.Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
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Patent number: 11225005Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.Type: GrantFiled: June 24, 2020Date of Patent: January 18, 2022Assignee: CORETECH SYSTEM CO., LTD.Inventors: Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang
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Publication number: 20200384675Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.Type: ApplicationFiled: June 24, 2020Publication date: December 10, 2020Inventors: RONG-YEU CHANG, CHIA-HSIANG HSU, CHUAN-WEI CHANG
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Publication number: 20200384674Abstract: A system for setting injection-molding conditions and a method for setting actual molding conditions of an injection-molding machine are disclosed. The system includes a computer and an injection-molding equipment. The computer is configured to simulate, via computer-aided simulation software, a virtual molding using a plurality of design parameters to generate a plurality of provisional molding conditions. The injection-molding equipment is associated with the computer and configured to perform at least one trial molding using the provisional molding conditions to obtain a plurality of intermediate molding conditions. The computer optimizes the provisional molding conditions to obtain actual molding conditions in accordance with the intermediate molding conditions.Type: ApplicationFiled: June 4, 2020Publication date: December 10, 2020Inventors: RONG-YEU CHANG, CHIA-HSIANG HSU, CHUAN-WEI CHANG
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Patent number: 10562218Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.Type: GrantFiled: August 6, 2018Date of Patent: February 18, 2020Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Patent number: 10384386Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: GrantFiled: June 18, 2018Date of Patent: August 20, 2019Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Publication number: 20190152113Abstract: The present disclosure provides a method for setting up a molding system, wherein the molding system includes a molding machine and a mold disposed on the molding machine, and the mold has a mold cavity to be filled with a molding resin from the molding machine. The method includes generating first and second state waveforms using a predetermined packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting up the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: ApplicationFiled: June 18, 2018Publication date: May 23, 2019Inventors: Yuing CHANG, Rong-Yeu CHANG, Chia-Hsiang HSU, Chuan-Wei CHANG, Ching-Chang CHIEN
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Publication number: 20190152114Abstract: The present disclosure provides a method for operating a molding system. The molding system includes a molding machine and a mold disposed on the molding machine, wherein the mold has a mold cavity for being filled with a molding material from the molding machine. The method comprises a step of obtaining a predetermined state waveform expressing a predetermined volumetric variation of the molding material. Next, the method further comprises obtaining a measured pressure and a measured temperature of the molding material in the mold cavity while performing a molding process for filling the molding material into the mold cavity. Next, the method includes obtaining a detected volumetric property of the molding material corresponding to the measured pressure and the measured temperature. Subsequently, the method comprises displaying the detected volumetric property of the molding material with the predetermined state waveform.Type: ApplicationFiled: August 6, 2018Publication date: May 23, 2019Inventors: Yuing CHANG, Rong-Yeu CHANG, Chia-Hsiang HSU, Chuan-Wei CHANG, Ching-Chang CHIEN
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Patent number: 10076862Abstract: A molding system includes a molding machine, a mold disposed on the molding machine and having a mold cavity to be filled with a molding resin from the molding machine, and a computing apparatus connected to the molding machine. The computing apparatus is configured to perform operations for setting the molding machine to prepare a molding product, wherein the operations comprise: generating a first and a second state waveforms using a setting packing pressure profile; obtaining an updated packing pressure profile based on the first and the second state waveforms; and setting the molding machine based on the updated packing pressure profile to perform an actual molding process to prepare the molding product. The first and the second state waveforms express a relationship between an in-mold pressure and an in-mold temperature at different sensing sites of the molding resin.Type: GrantFiled: November 23, 2017Date of Patent: September 18, 2018Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang, Ching-Chang Chien
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Patent number: 9684295Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: July 12, 2016Date of Patent: June 20, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Chuan Wei Chang, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Hsien Sen Chiu
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Patent number: 9555571Abstract: A method for operating a molding machine includes steps of specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine; performing a virtual molding by using an initial packing pressure profile to generate an initial state waveform expressing a relationship between an in-mold pressure and an in-mold temperature of the molding resin; obtaining an updated packing pressure profile for applying a molding pressure to at least a portion of the genuine domain while taking into consideration the initial state waveform; repeating the virtual molding while taking into consideration the updated packing pressure profile to generate an updated state waveform of the molding resin; and setting the molding machine taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: GrantFiled: November 5, 2015Date of Patent: January 31, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang, Ching Chang Chien, Hsien Sen Chiu
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Publication number: 20170015040Abstract: A method for operating a molding machine includes specifying a simulating domain corresponding to a genuine domain in a mold disposed on the molding machine. The method proceeds to perform a virtual molding by using a setting packing pressure profile to generate a simulated state waveform, generating a designed state waveform including an isobaric phase and an isochoric phase while taking into consideration the simulated state waveform, and obtaining an updated packing pressure profile for applying a molding pressure to a portion of the genuine domain while taking into consideration a difference between the simulated state waveform and the designed state waveform. Subsequently, the method proceeds to set the molding machine while taking into consideration the updated packing pressure profile to perform an actual molding by applying an actual molding pressure to the at least a portion of the genuine domain to prepare the molding product.Type: ApplicationFiled: July 12, 2016Publication date: January 19, 2017Inventors: YUING CHANG, CHUAN WEI CHANG, RONG YEU CHANG, CHIA HSIANG HSU, CHING CHANG CHIEN, HSIEN SEN CHIU
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Patent number: D784392Type: GrantFiled: June 3, 2016Date of Patent: April 18, 2017Assignee: Coretech System Co., Ltd.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang
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Patent number: D790582Type: GrantFiled: August 23, 2016Date of Patent: June 27, 2017Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Ching Chang Chien, Chuan Wei Chang
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Patent number: D817970Type: GrantFiled: June 3, 2016Date of Patent: May 15, 2018Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong Yeu Chang, Chia Hsiang Hsu, Chuan Wei Chang
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Patent number: D866566Type: GrantFiled: August 7, 2017Date of Patent: November 12, 2019Assignee: CORETECH SYSTEM CO., LTD.Inventors: Yuing Chang, Rong-Yeu Chang, Chia-Hsiang Hsu, Chuan-Wei Chang