Patents by Inventor Chuan Weng
Chuan Weng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7875473Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: GrantFiled: May 7, 2010Date of Patent: January 25, 2011Assignee: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20100216265Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: May 7, 2010Publication date: August 26, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Patent number: 7716945Abstract: A pressure equalization port for a refrigeration unit is provided. The port includes a conduit having a thermally conductive body. The conduit includes a first opening exposed to a refrigeration chamber enclosed within the refrigeration unit, and a second opening exposed to a space external to the refrigeration chamber. At least one heat-dissipating refrigerant flow coil surrounds a portion of the thermally conductive body to heat said body.Type: GrantFiled: April 7, 2005Date of Patent: May 18, 2010Assignee: Thermo Fisher Scientific (Asheville) LLCInventor: Chuan Weng
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Publication number: 20100055814Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20100047940Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: November 3, 2009Publication date: February 25, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Publication number: 20090246899Abstract: A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.Type: ApplicationFiled: January 15, 2009Publication date: October 1, 2009Applicant: He Shan Lide ELectronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Patent number: 7596145Abstract: An automatic setting method for ATM network is used in an information device for automatic connecting to an ATM network of an ISP office. At first an automatic configuration table is provided and includes a plurality sets of setting parameters of virtual path identifier (VPI)/virtual channel identifier (VCI) and encapsulation capacity for a plurality of default ISP offices. A user tries connection to the ISP office by selecting one set of the setting parameters as a connecting parameter to the ISP office and receives a reply message from the ISP office. The user selects another one set of the setting parameters as a connecting parameter to the ISP office when the connection fails and tries again until the connection to the ISP office successes.Type: GrantFiled: September 24, 2004Date of Patent: September 29, 2009Assignee: Zyxel Communications CorpInventors: Ming-Chuan Weng, Chi-Wen Chen
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Publication number: 20090230407Abstract: An LED device has a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer on the N-type semiconductor layer, a P-type semiconductor layer on the light-emitting layer and a transparent electrode layer formed on the P-type semiconductor layer. A top surface of the transparent electrode layer is formed to have multiple micro concave-convex structures to mitigate the light-emitting loss resulted from total reflection, and increase the light-emitting efficiency of the LED device.Type: ApplicationFiled: January 15, 2009Publication date: September 17, 2009Applicant: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben FAN, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20090215210Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: January 9, 2009Publication date: August 27, 2009Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Publication number: 20090184337Abstract: A light-emitting diode includes a sapphire substrate, an n-type semiconductor, a light-emitting layer, a p-type semiconductor layer, an anode and a conductive material. The n-type semiconductor layer is formed on the sapphire substrate and has a side surface, a center section and an edge around the center portion. The light-emitting layer is formed on the n-type semiconductor layer. The p-type semiconductor layer is formed on the light-emitting layer. The anode is formed on the p-type semiconductor layer. The conductive material is formed on the bottom surface of the sapphire substrate and is in contact with the n-type semiconductor layer.Type: ApplicationFiled: January 9, 2009Publication date: July 23, 2009Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Patent number: 7516425Abstract: A method for generating an input vector to reduce the leakage current in an integrated circuit by using heuristics includes transforming the integrated circuit to a logic representation with PMOS and NMOS parts and P and N devices of the integrated circuit into edges, selecting between PMOS and NMOS logic representations the one with deepest serial stack; and for the selected PMOS or NMOS logic representation, assigning weights to the edges, thereby generating a weighted graph. The assignment includes starting from the output terminal to the Power Vdd (for PMOS) or Ground Vss (for NMOS), and labeling edge weights in a descending order. The resulted cost function from the method of the present invention can be applied as heuristics in different algorithms, such as branch-and-bound, simulated annealing, or genetic algorithm.Type: GrantFiled: December 22, 2005Date of Patent: April 7, 2009Assignee: Industrial Technology Research InstituteInventors: Peisheng Alan Su, Li-Chuan Weng
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Publication number: 20070150843Abstract: A method for generating an input vector to reduce the leakage current in an integrated circuit by using heuristics includes transforming the integrated circuit to a logic representation with PMOS and NMOS parts and P and N devices of the integrated circuit into edges, selecting between PMOS and NMOS logic representations the one with deepest serial stack; and for the selected PMOS or NMOS logic representation, assigning weights to the edges, thereby generating a weighted graph. The assignment includes starting from the output terminal to the Power Vdd (for PMOS) or Ground Vss (for NMOS), and labeling edge weights in a descending order. The resulted cost function from the method of the present invention can be applied as heuristics in different algorithms, such as branch-and-bound, simulated annealing, or genetic algorithm.Type: ApplicationFiled: December 22, 2005Publication date: June 28, 2007Inventors: Peisheng Su, Li-Chuan Weng
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Publication number: 20060225455Abstract: A pressure equalization port for a refrigeration unit is provided. The port includes a conduit having a thermally conductive body. The conduit includes a first opening exposed to a refrigeration chamber enclosed within the refrigeration unit, and a second opening exposed to a space external to the refrigeration chamber. At least one heat-dissipating refrigerant flow coil surrounds a portion of the thermally conductive body to heat said body.Type: ApplicationFiled: April 7, 2005Publication date: October 12, 2006Inventor: Chuan Weng
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Patent number: 7048511Abstract: A method and apparatus which provides a pressure sensor and/or temperature sensor connected to the low pressure side of a refrigeration system, or the discharge line of a scroll compressor. When the scroll compressor rotates backward, the change of pressure or temperature immediately sends a signal to work with a time-delay relay and a normally closed relay to immediately cut off the electrical power supply to the compressor. Thus, causing the scroll compressor to stop rotating in the undesirable direction.Type: GrantFiled: February 22, 2005Date of Patent: May 23, 2006Assignee: Kendro Laboratory Products, Inc.Inventor: Chuan Weng
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Publication number: 20060067322Abstract: An automatic setting method for ATM network is used in an information device for automatic connecting to an ATM network of an ISP office. At first an automatic configuration table is provided and includes a plurality sets of setting parameters of virtual path identifier (VPI)/virtual channel identifier (VCI) and encapsulation capacity for a plurality of default ISP offices. A user tries connection to the ISP office by selecting one set of the setting parameters as a connecting parameter to the ISP office and receives a reply message from the ISP office. The user selects another one set of the setting parameters as a connecting parameter to the ISP office when the connection fails and tries again until the connection to the ISP office successes.Type: ApplicationFiled: September 24, 2004Publication date: March 30, 2006Inventors: Ming-Chuan Weng, Chi-Wen Chen
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Publication number: 20060031931Abstract: A method regulates a connection of at least one computer to Internet through a network-regulating apparatus. At least one supervisor logs in a computer connected to the network-regulating apparatus and sets a user attribution for at least one user in the network-regulating apparatus. The supervisor is authorized to create new user, delete user and edit user data. The supervisor also can set accessible time per day, accessible time per week for user, or unlimited time for user. The supervisor can set up certain keyword to examine the address and content of a website to identify the accessibility of a website. When a user accesses Internet for the first time, the user logs in the network-regulating apparatus and accessing Internet according to the user attribution set in the network-regulating apparatus.Type: ApplicationFiled: August 9, 2004Publication date: February 9, 2006Inventors: Ming-Chuan Weng, Hsueh-ying Liu
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Publication number: 20050147499Abstract: A method and apparatus which provides a pressure sensor and/or temperature sensor connected to the low pressure side of a refrigeration system, or the discharge line of a scroll compressor. When the scroll compressor rotates backward, the change of pressure or temperature immediately sends a signal to work with a time-delay relay and a normally closed relay to immediately cut off the electrical power supply to the compressor. Thus, causing the scroll compressor to stop rotating in the undesirable direction.Type: ApplicationFiled: February 22, 2005Publication date: July 7, 2005Inventor: Chuan Weng
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Publication number: 20050103028Abstract: Methods and apparatus for a refrigeration heat exchanger section useful in circulating a substantially non-CFC refrigerant mixture which comprises: a compressor means, an auxiliary condenser, a first condenser, a second condenser, a third condenser, a subcooler and a liquid/gas separator, wherein a subcooled refrigerant liquid mixture taken as bottoms from the liquid/gas separator is distributed and expanded by a first expansion means and a second expansion means to form first and second expanded streams, respectively, such that the first expanded stream is returned to the auxiliary condenser and compressor in order to avoid overheating of the compressor.Type: ApplicationFiled: November 13, 2003Publication date: May 19, 2005Inventor: Chuan Weng
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Patent number: 6893227Abstract: A method and apparatus which provides a pressure sensor and/or temperature sensor connected to the low pressure side of a refrigeration system, or the discharge line of a scroll compressor. When the scroll compressor rotates backward, the change of pressure or temperature immediately sends a signal to work with a time-delay relay and a normally closed relay to immediately cut off the electrical power supply to the compressor. Thus, causing the scroll compressor to stop rotating in the undesirable direction.Type: GrantFiled: March 21, 2002Date of Patent: May 17, 2005Assignee: Kendro Laboratory Products, Inc.Inventor: Chuan Weng
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Publication number: 20050072957Abstract: Methods and apparatus for a refrigeration heat exchanger section useful in circulating a substantially non-HCFC refrigerant mixture which comprises: a compressor means, an auxiliary condenser, a first condenser, a second condenser, a third condenser, a subcooler and a liquid/gas separator, wherein a subcooled refrigerant liquid mixture taken as bottoms from the liquid/gas separator is distributed and expanded by a first expansion means and a second expansion means to form first and second expanded streams, respectively, such that the first expanded stream is returned to the auxiliary condenser and compressor in order to avoid overheating of the compressor.Type: ApplicationFiled: August 19, 2003Publication date: April 7, 2005Inventor: Chuan Weng