Abstract: The present invention provides a base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5, and Y{circle around (?)} are defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

Abstract: The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5 and Y? are as defined in the specification. The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: A method for fabricating a flexible device is provided, which includes providing a rigid carrier; forming an adhesion layer with a given pattern on the rigid carrier; forming a flexible substrate layer on the rigid carrier, wherein a portion of the flexible substrate layer contacts with the rigid carrier to form a first contact interface and the remaining contacts with the adhesion layer to form a second contact interface; forming at least one device on the surface of the flexible substrate layer opposite to the first contact interface; and separating the flexible substrate from the rigid carrier through the first contact interface.

Abstract: The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.

Abstract: A photosensitive resin composition comprising: a photosensitive polyimide of formula (I); an acrylate monomer; and a photoinitiator, wherein A, B, D, J, m, and n are as defined in the specification.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.