Abstract: A shock isolation system for electronic devices includes a first baseboard, a second baseboard and a plurality of helical springs interposed transversely between the first baseboard and the second baseboard. The helical springs can deform horizontally and vertically to isolate horizontal and vertical vibration-impact on the electronic devices. The first baseboard and the second baseboard further are bridged by a plurality of damping elements, which have damping characteristics to dissipate kinetic energy and reduce the vibration amplitude and instantaneous acceleration between the first baseboard and the second baseboard, thereby to enhancing the composite effect. The first baseboard further has a plurality of buffer struts to separate the first baseboard and the second baseboard, and prevent the second baseboard from directly hitting the first baseboard.