Patents by Inventor Chueng-Jen Wang

Chueng-Jen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Systems and methods for die transfer
    Patent number: 11820607
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: November 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • SYSTEMS AND METHODS FOR DIE TRANSFER
    Publication number: 20220384222
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Yi-Fam SHIU, Chueng-Jen WANG, Hsuan LEE, Jiun-Rong PAI
  • Systems and methods for die transfer
    Patent number: 11459190
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Grant
    Filed: November 2, 2020
    Date of Patent: October 4, 2022
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • SEMICONDUCTOR STORAGE APPARATUS WITH INTEGRATED SORTER
    Publication number: 20220037178
    Abstract: An apparatus, system and method for storing die carriers and transferring a semiconductor die between the die carriers. A die stocker includes a rack enclosure with an integrated sorting system. The rack enclosure includes storage cells configured to receive and store die carriers having different physical configurations. A transport system transports first and second die carriers between a first plurality of storage cells and a first sorter load port, where the transport system introduces the first and second die carriers to a first sorter. The transport system transports third and fourth die carriers between a second plurality of storage cells and a second sorter load port, where the transport system introduces the third and fourth die carriers to a second sorter. The first and second die carriers have a first physical configuration, and the third and fourth die carriers have a second physical configuration, different than the first physical configuration.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 3, 2022
    Inventors: Tsung-Sheng KUO, Chih-Chun CHIU, Chih-Chieh FU, Chueng-Jen WANG, Hsuan LEE, Jiun-Rong PAI
  • SYSTEMS AND METHODS FOR DIE TRANSFER
    Publication number: 20210078809
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Application
    Filed: November 2, 2020
    Publication date: March 18, 2021
    Inventors: Tsung-Sheng KUO, Chih-Hung HUANG, Yi-Fam SHIU, Chueng-Jen WANG, Hsuan LEE, Jiun-Rong PAI
  • Systems and methods for die transfer
    Patent number: 10822181
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: November 3, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai
  • SYSTEMS AND METHODS FOR DIE TRANSFER
    Publication number: 20200156884
    Abstract: In certain embodiments, a system includes: a source lane configured to move a first die container between a load port and a source lane staging area; an inspection sensor configured to produce a sensor result based on a die on the first die container; a pass target lane configured to move a second die container between a pass target lane out port and a pass target lane staging area; a fail target lane configured to move a third die container between a fail target lane out port and a fail target lane staging area; and a conveyor configured to move the die from the first die container at the source lane staging area to either the second die container at the pass target lane staging area or the fail target lane staging area based on the sensor result.
    Type: Application
    Filed: October 10, 2019
    Publication date: May 21, 2020
    Inventors: Tsung-Sheng Kuo, Chih-Hung Huang, Yi-Fam Shiu, Chueng-Jen Wang, Hsuan Lee, Jiun-Rong Pai