Patents by Inventor Chui-Jung Chiu

Chui-Jung Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11353324
    Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
    Type: Grant
    Filed: December 19, 2019
    Date of Patent: June 7, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu
  • Publication number: 20200124411
    Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using the measurement tool, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
    Type: Application
    Filed: December 19, 2019
    Publication date: April 23, 2020
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu
  • Patent number: 10520303
    Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
    Type: Grant
    Filed: November 13, 2017
    Date of Patent: December 31, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu
  • Publication number: 20180066939
    Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
    Type: Application
    Filed: November 13, 2017
    Publication date: March 8, 2018
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu
  • Patent number: 9823066
    Abstract: A method includes receiving, into a measurement tool, a substrate having a material feature, wherein the material feature is formed on the substrate according to a design feature. The method further includes applying a source signal on the material feature by using a source in the measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain measurement data, and with a computer connected to the measurement tool, calculating a simulated response signal from the design feature using the tool setting parameter. The method further includes, with the computer, in response to determining that a difference between the collected response signal and the simulated response signal exceeds a predetermined value, causing the measurement tool to re-measure the material feature.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: November 21, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu
  • Patent number: 9404743
    Abstract: A method is provided for validating measurement data, such as data obtained from a scanning electron microscope using in a semiconductor fabrication facility. The method includes applying a signal on a material feature by using a source in a measurement tool having a tool setting parameter, collecting a response signal from the material feature by using a detector in the measurement tool to obtain the measurement data, calculating a simulated response signal by a smart, and validating the measurement data by comparing the collected response signal with the simulated response signal. The system also includes a design database having a design feature, a measurement tool collecting a response signal, and a smart review engine configured to connect the measurement tool and the design database.
    Type: Grant
    Filed: November 1, 2012
    Date of Patent: August 2, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chui-Jung Chiu, Jen-Chieh Lo, Ying-Chou Cheng, Ru-Gun Liu