Patents by Inventor Chui-Liang Chiu

Chui-Liang Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • LASER CUTTING METHOD FOR A WAFER
    Publication number: 20210339338
    Abstract: A laser cutting method for a wafer is provided. First, an active side of a wafer is cut by a laser to form multiple cutting grooves so that the thicker and harder layer of the integrated circuit on the active side is cut. Then the stealth laser is used to cut the backside of the wafer by aligning the beams of the stealth laser with the cutting grooves. Therefore, the cutting grooves easily extend to the backside of the wafer and penetrate through the wafer to dice the wafer into multiple independent chips.
    Type: Application
    Filed: August 19, 2020
    Publication date: November 4, 2021
    Applicant: Powertech Technology Inc.
    Inventors: Chui-Liang CHIU, Kun-Chi HSU, Chin-Ta WU, Ching-Lin TSENG, Chia-Wei LIN, Jentung Tseng
  • Wafer processing method with full edge trimming
    Patent number: 10388535
    Abstract: A wafer processing method uses a chuck table with smaller diameter than a semiconductor wafer to be processed. A cut through edge trimming is therefore implemented on the periphery of the semiconductor wafer to form a cut through straight side at the periphery and also form a flat portion at the periphery as a positioning means for taping and backside grind processes.
    Type: Grant
    Filed: May 25, 2018
    Date of Patent: August 20, 2019
    Assignee: POWERTECH TECHNOLOGY INC.
    Inventors: Chui-Liang Chiu, Kun-Chi Hsu, Jen-Tung Tseng, Chin-Ta Wu