Patents by Inventor Chuichi Matsuda

Chuichi Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for soldering printed circuit boards
    Patent number: 4824010
    Abstract: At least one chip type component is soldered to a printed circuit board by independent first and second nozzles which spout molten solder so as to form respective first and second solder waves, with the printed circuit board sequentially passed through the first and second nozzles. The first and second solder waves define therebetween a space and flow at least in a direction of movement of the printed circuit board and in a direction counter to the direction of movement of the printed circuit board, respectively. The second nozzle is disposed at a level higher than the first nozzle such that the printed circuit board is moved obliquely upwardly.
    Type: Grant
    Filed: October 17, 1986
    Date of Patent: April 25, 1989
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Takao Inoue, Keiji Saeki, Chuichi Matsuda, Schuichi Murakami
  • Device for soldering printed board
    Patent number: 4602730
    Abstract: Device for soldering a printed board, equipped with a printed substrate conveyor, which effects soldering of chip parts on a printed substrate by moving the printed substrate through a molten solder wave formed by providing a nozzle in a solder tank accommodating molten solder, and a vibration imparter for giving vibration to the printed substrate when it is passing through the molten solder wave.
    Type: Grant
    Filed: May 22, 1984
    Date of Patent: July 29, 1986
    Inventors: Shuichi Murakami, Chuichi Matsuda, Tatsuya Matsumae, Kenichi Yamashita, Mikio Mori