Patents by Inventor Chun-Chen Lin

Chun-Chen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240162359
    Abstract: A backsheet of a solar cell module including a substrate, a first protection layer, and a second protection layer is provided. The substrate includes a first surface and a second surface opposite to each other. The first protection layer is disposed on the first surface of the substrate. The second protection layer is disposed on the second surface of the substrate, wherein the first protection layer and the second protection layer include a silicone layer. At least one of the first protection layer and the second protection layer includes diffusion particles, wherein the diffusion particles include zinc oxide, titanium dioxide modified with silicon dioxide, or a combination thereof. A thickness of the first protection layer and a thickness of the second protection layer are respectively 10 ?m to 30 ?m. A solar cell module including the backsheet is also provided.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Chih-Kang Peng, Cheng-Hsuan Lin, Yu-Ling Hsu, Chun-Chen Chiang
  • Publication number: 20240146176
    Abstract: A method of controlling phase shift pulse width modulation of a power converter, the method includes a step of obtaining sampling signals of an output voltage and current of the power converter. Then, a digital signal processor is used to calculate an output power of the power converter. Next, a comparator is used to compare the output power of the power converter with a reference power. When the output power is less than the reference power, the modulation control of the switch of the power converter enters into hard-switching mode, and when the output power is greater than the reference power, the modulation control of the switch of the power converter enters into soft-switching mode.
    Type: Application
    Filed: November 24, 2022
    Publication date: May 2, 2024
    Inventors: Chun-Chen Chen, Jian-Hsieng Lee, Feng-Yi Lin
  • Publication number: 20240118329
    Abstract: An apparatus is provided. The apparatus includes a laser generation device configured to emit a laser signal to a semiconductor fabrication component. The apparatus includes a reflection detection device configured to receive a reflection signal comprising light, of the laser signal, reflected by a surface of the semiconductor fabrication component. The reflection detection device includes an optical filter. The optical filter is configured to block light, of the reflection signal, that has a wavelength outside a defined range of wavelengths. The optical filter is configured to provide filtered light, from the reflection signal, that has a wavelength within the defined range of wavelengths. The reflection detection device includes a light sensor configured to generate an electrical signal based upon the filtered light. The apparatus includes a computer configured to determine, based upon the electrical signal, measures of electrostatic field strength at the surface of the semiconductor fabrication component.
    Type: Application
    Filed: May 11, 2023
    Publication date: April 11, 2024
    Inventors: Ming Da YANG, Yi-Chen LI, Chun-Hsuan LIN
  • Publication number: 20240113166
    Abstract: A method for fabricating semiconductor devices includes forming channel regions over a substrate. The channel regions, in parallel with one another, extend along a first lateral direction. Each channel region includes at least a respective pair of epitaxial structures. The method includes forming a gate structure over the channel regions, wherein the gate structure extends along a second lateral direction. The method includes removing, through a first etching process, a portion of the gate structure that was disposed over a first one of the channel regions. The method includes removing, through a second etching process, a portion of the first channel region. The second etching process includes one silicon etching process and one silicon oxide deposition process. The method includes removing, through a third etching process controlled based on a pulse signal, a portion of the substrate that was disposed below the removed portion of the first channel region.
    Type: Application
    Filed: February 15, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Ging Lin, Chun-Liang Lai, Yun-Chen Wu, Ya-Yi Tsai, Shu-Yuan Ku, Shun-Hui Yang
  • Patent number: 11940388
    Abstract: Example methods are provided to improve placement of an adaptor (210,220) to a mobile computing device (100) to measure a test strip (221) coupled to the adaptor (220) with a camera (104) and a screen (108) on a face of the mobile computing device (100). The method may include displaying a light area on a first portion of the screen (108). The first portion may be adjacent to the camera (104). The light area and the camera (104) may be aligned with a key area of the test strip (221) so that the camera (104) is configured to capture an image of the key area. The method may further include providing first guiding information for a user to place the adaptor (210,220) to the mobile computing device (100) according to a position of the light area on the screen (108).
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: March 26, 2024
    Assignee: IXENSOR CO., LTD.
    Inventors: Yenyu Chen, An Cheng Chang, Tai I Chen, Su Tung Yang, Chih Jung Hsu, Chun Cheng Lin, Min Han Wang, Shih Hao Chiu
  • Patent number: 11935894
    Abstract: An integrated circuit device includes a device layer having devices spaced in accordance with a predetermined device pitch, a first metal interconnection layer disposed above the device layer and coupled to the device layer, and a second metal interconnection layer disposed above the first metal interconnection layer and coupled to the first metal interconnection layer through a first via layer. The second metal interconnection layer has metal lines spaced in accordance with a predetermined metal line pitch, and a ratio of the predetermined metal line pitch to predetermined device pitch is less than 1.
    Type: Grant
    Filed: November 4, 2022
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Fong-yuan Chang, Chun-Chen Chen, Po-Hsiang Huang, Lee-Chung Lu, Chung-Te Lin, Jerry Chang Jui Kao, Sheng-Hsiung Chen, Chin-Chou Liu
  • Publication number: 20240076797
    Abstract: A susceptor assembly for supporting a crucible during a crystal growth process includes a susceptor base, a tubular sidewall connected to the susceptor base, and a removable sacrifice ring interposed between the susceptor base and the sidewall. Each of the susceptor base and the sidewall is formed of a carbon-containing material. The susceptor base has an annular wall and a shoulder extending radially outward from an outer surface of the annular wall. The sidewall has a first end that receives the annular wall to connect the sidewall to the susceptor base. The sacrifice ring has a first surface that faces the outer surface of the annular wall, a second surface that faces an interior surface of the sidewall, and a ledge extending outward from the second surface that engages the first end of the sidewall.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 7, 2024
    Inventors: Hong-Huei Huang, Benjamin Michael Meyer, Chun-Sheng Wu, Wei-Chen Chou, Chen-Yi Lin, Feng-Chien Tsai
  • Publication number: 20230334619
    Abstract: A device produces a dolly zoom effect with automatic focal length adjustment. The device uses a camera to capture an initial image including at least a foreground object and a background. The device includes a size tracking circuit to identify the size of the foreground object in the initial image. The device further includes a focal length control circuit. The focal length control circuit calculates an adjusted focal length of the camera to maintain the size of the foreground object in subsequently captured images.
    Type: Application
    Filed: April 18, 2022
    Publication date: October 19, 2023
    Inventors: Chih-Wei Chen, Pei-Kuei Tsung, Yao-Sheng Wang, Chun Chen Lin, Chia-Ching Lin, Hsiao-Chien Chiu
  • Publication number: 20230053776
    Abstract: A system collects a training dataset for training an artificial intelligence (AI) model. The system receives high-resolution (HR) images and information of one or more regions-of-interest (ROIs) in the HR images. The system maps a stride distribution to the ROIs, and samples the HR images with non-uniform strides according to the ROIs and the stride distribution to generate corresponding low-resolution (LR) images. The system then trains the AI model to perform super-resolution (SR) operations using training pairs formed by the HR images and respective corresponding LR images.
    Type: Application
    Filed: July 21, 2022
    Publication date: February 23, 2023
    Inventors: Wai Mun Wong, Chia-Da Lee, Cheng Lung Jen, Chun Chen Lin, Shih-Che Chen, Pei-Kuei Tsung
  • Publication number: 20220358619
    Abstract: A system produces a dolly zoom effect by utilizing side view information. The system first captures a main image at a main location. The main image includes at least a foreground object of a given size and a background. The system calculates one or more side view locations based on a zoom-in factor to be applied to the background and an estimated size of the foreground object. The system then guides a user to capture one or more side view images at the one or more side view locations. The foreground object of the given size is superimposed onto a zoomed-in background. Then the side view information is used by the system to perform image inpainting.
    Type: Application
    Filed: April 18, 2022
    Publication date: November 10, 2022
    Inventors: Chih-Wei Chen, Pei-Kuei Tsung, Yao-Sheng Wang, Chun Chen Lin, Chia-Ching Lin
  • Patent number: 10944283
    Abstract: A distributed single-stage on-board charging device comprises a first transformer having a first primary winding and a first secondary winding; a first capacitor connected to the first primary winding; a first inductor connected to the first capacitor, wherein the first capacitor is located between the first inductor and the first transformer; a first transistor connected to the first capacitor and the first inductor; a first diode connected to the first secondary winding; a second transformer having a second primary winding and a second secondary winding, wherein the first transformer and the second transformer are connected in parallel; a second capacitor connected to the second primary winding; a second inductor connected to the second capacitor, wherein the second capacitor is located between the second inductor and the second transformer; and a second transistor connected to the second capacitor and the second inductor.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: March 9, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Nan-Hsiung Tseng, Chun-Chen Lin, Hsieh-Tai Su, Jih-Sheng Lai, Chin-Hone Lin
  • Publication number: 20190199114
    Abstract: A distributed single-stage on-board charging device comprises a first transformer having a first primary winding and a first secondary winding; a first capacitor connected to the first primary winding; a first inductor connected to the first capacitor, wherein the first capacitor is located between the first inductor and the first transformer; a first transistor connected to the first capacitor and the first inductor; a first diode connected to the first secondary winding; a second transformer having a second primary winding and a second secondary winding, wherein the first transformer and the second transformer are connected in parallel; a second capacitor connected to the second primary winding; a second inductor connected to the second capacitor, wherein the second capacitor is located between the second inductor and the second transformer; and a second transistor connected to the second capacitor and the second inductor.
    Type: Application
    Filed: December 22, 2017
    Publication date: June 27, 2019
    Inventors: NAN-HSIUNG TSENG, Chun-Chen Lin, Hsieh-Tai Su, Jih-Sheng Lai, Chin-Hone Lin
  • Patent number: 10097088
    Abstract: A soft-switching auxiliary circuit is provided, which may be applicable to a converter including a first main switch and a second main switch. The soft-switching auxiliary circuit may include a first auxiliary switch, a second auxiliary switch, a first energy adjustment module and a second energy adjustment module. By means of the first auxiliary switch and a second auxiliary switch, the first energy adjustment module and the second energy adjustment may properly store and adjust the energy of the converter; therefore, both the first main switch and the second main switch of the converter can achieve soft-switching.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: October 9, 2018
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Chen Lin, Chih-Wei Ko, Yi-Ling Lin, Chien-Ming Wang
  • Publication number: 20180061811
    Abstract: A semiconductor package includes a first chip, a second chip, a plurality of first conductive bumps, a plurality of second conductive bumps and an underfill. The first chip includes a first active surface having a chip bonding zone, a plurality of first inner pads in the chip bonding zone and a plurality of first outer pads out of the chip bonding zone. The second chip is flipped on the chip bonding zone. The first conductive bumps are disposed on the first outer pads. The second conductive bumps are disposed between the first inner pads of the first chip and a plurality of second pads of the second chip. The underfill is disposed on the first active surface and covers the second conductive bumps, at least a part of each second chip lateral and at least a part of each first conductive bump. Multiple semiconductor package manufacturing methods are further provided.
    Type: Application
    Filed: December 9, 2016
    Publication date: March 1, 2018
    Applicant: ChipMOS Technologies Inc.
    Inventors: Geng-Shin Shen, Ching-Chen Tu, Tzu-Sheng Wu, Chun-Chen Lin, Hui-Wen Yeh
  • Publication number: 20170163153
    Abstract: A soft-switching auxiliary circuit is provided, which may be applicable to a converter including a first main switch and a second main switch. The soft-switching auxiliary circuit may include a first auxiliary switch, a second auxiliary switch, a first energy adjustment module and a second energy adjustment module. By means of the first auxiliary switch and a second auxiliary switch, the first energy adjustment module and the second energy adjustment may properly store and adjust the energy of the converter; therefore, both the first main switch and the second main switch of the converter can achieve soft-switching.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 8, 2017
    Inventors: Chun-Chen Lin, Chih-Wei Ko, Yi-Ling Lin, Chien-Ming Wang
  • Publication number: 20120042589
    Abstract: A door frame structure, which includes a plurality of door frame units and locking elements. Each door frame unit has a main body and a door stop, where the door stop is at a surface of the main body. A notch is formed between the main body and the door stop to accommodate a buffer strip. The door frame unit can further include a plurality of set pieces for anchoring to the wall with different thicknesses. The door frame structure of the instant disclosure saves construction labor, improves visual appearance, increases structural stability and adaptability, and reduces door hitting noise.
    Type: Application
    Filed: August 18, 2010
    Publication date: February 23, 2012
    Inventor: CHUN-CHEN LIN
  • Publication number: 20080305666
    Abstract: A structure for an electronic card connector is comprised of an insulating body having a universal card slot on a side thereof, a first group of pins, and a pressing unit disposed on the first surface. The universal card slot is comprised of a first surface thereinside and the first group of pins is comprised of a plurality of conducting terminals. Furthermore, the pressing unit is comprised of a contacting portion disposed higher than the first group of pins, a plurality of pivoting portions, and a pressing portion. A plurality of pivoting holes disposed on the surface are connected with the pivoting portion of the pressing unit and the pressing portion abuts against free ends of the conducting terminals. The structure is used to prevent the conducting terminals from improper contact with the inserted electronic card.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 11, 2008
    Inventors: Chun Chen Lin, An-Yu Yu, Leland Wang
  • Publication number: 20070262223
    Abstract: A clamping device includes a seat body, two clamping elements, at least one spring, a gear, a turning wheel, an impeding element, and a release button. The seat body has a front casing and a rear casing. Each clamping element has a clamping body with a rack. The spring is disposed between the seat body and one of the two clamping elements. The gear and the turning wheel are pivoted in the seat body together. The gear is engaged with the two racks, and the turning wheel has a contact surface formed therearound. The impeding element is pivoted in the seat body, wherein the impeding element has an impeding surface that contacts the contact surface. The release button is movably disposed on the seat body and connected with the impeding element. Hence the clamping device's whole structure is simple, and the cost of the clamping device is reduced.
    Type: Application
    Filed: May 15, 2006
    Publication date: November 15, 2007
    Inventors: Leland Wang, Chun-Chen Lin, Fu-Ching Wang
  • Publication number: 20070262217
    Abstract: A sucking disc apparatus includes a body, a sucking disc, a pulling rod, a spring, and an operation element. The body includes a pressing part and a protruding part protruding from the top of the pressing part. The sucking disc is located at the bottom of the pressing part of the body. The pulling rod is located in the body and has a rectangular slot hole. The spring is located between the body and the sucking disc. The operation element includes an operation part and a cam part. The operation element is pivoted with the protruding part of the body via a pivoting shaft. Thereby, the rectangular slot hole is hidden in the sucking disc apparatus, the appearance of the sucking disc apparatus is not affected, and muck does not drop into the rectangular slot hole so that the movement of the sucking disc is smooth.
    Type: Application
    Filed: May 15, 2006
    Publication date: November 15, 2007
    Inventors: Leland Wang, Chun-Chen Lin, Fu-Ching Wang
  • Patent number: 6343448
    Abstract: The auxiliary frame has a plurality of frame bars made of plastic or metallic material. Each of the frame bars has a hollow inside and has a crossed reinforcing rib installed therein. One side of each of the frame bars forms an embowed reinforcing girder to achieve better reinforcing effect. A through hole and a snap groove are disposed at each side of the reinforcing girder. Two of the frame bars are disposed at opposite sides, while another frame bar is disposed at the top ends of the two frame bars. A fixing element is installed between the bottom ends of the two frame bars at two sides. The two ends of the frame bar at top end are screwed with the two frame bars via a plurality of screws vertically penetrating the through holes at the top ends of the two frame bars. The bottom ends of the two frame bars are screwed with the two ends of the fixing element via a plurality of screws vertically penetrating the through holes at the bottom ends of the two frame bars.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: February 5, 2002
    Inventor: Chun-Chen Lin