Patents by Inventor Chun-Cheng Chan

Chun-Cheng Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Patent number: 11942543
    Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.
    Type: Grant
    Filed: June 29, 2022
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hung-Chou Lin, Yi-Cheng Chiu, Karthick Murukesan, Yi-Min Chen, Shiuan-Jeng Lin, Wen-Chih Chiang, Chen-Chien Chang, Chih-Yuan Chan, Kuo-Ming Wu, Chun-Lin Tsai
  • Patent number: 11862851
    Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: January 2, 2024
    Inventors: Chun-Cheng Chan, Jiun-Wei Wu, Chih-Hsien Wu, Su-Wei Chang
  • Patent number: 11764476
    Abstract: An antenna device is disposed. The antenna device includes a signal cable, a casing, a grounding component, and a metal member. The signal cable includes a signal portion and a grounding portion. The signal cable is fixed on the casing. The grounding portion is connected to the metal member through the grounding component.
    Type: Grant
    Filed: March 25, 2021
    Date of Patent: September 19, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai
  • Patent number: 11749903
    Abstract: The disclosure provides an antenna structure including a ground plane, a first coupling antenna and a reference antenna. The first coupling antenna includes a first excitation source connected to the ground plane. The first excitation source is configured to excite a first resonant mode, and the first coupling antenna forms a first zero current area on the ground plane in response to the first resonant mode. The reference antenna includes a second excitation source connected to the ground plane. The second excitation source is configured to excite a second resonant mode, and the reference antenna forms a second zero current area on the ground plane in response to the second resonant mode. The first excitation source is located in the second zero current area, and the second excitation source is located in the first zero current area.
    Type: Grant
    Filed: July 13, 2021
    Date of Patent: September 5, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai, Chih-Heng Lin
  • Publication number: 20230223682
    Abstract: An antenna device includes a differential antenna and a first balun. The differential antenna includes a first radiator, a first antenna port and a second antenna port connected to a first surface of the first radiator. Orthographic projections of the first antenna port and the second antenna port projected to the first radiator are symmetrical to a midpoint of the first radiator. The first balun is located on one side of the first surface of the first radiator, and its orthographic projection on the first plane where the first surface is located overlaps the first surface. The first balun includes a first port, a first wiring, a first coupling structure electrically connected to the first antenna port, and a second coupling structure electrically connected to the second antenna port. Neither the first coupling structure nor the second coupling structure directly contacts the first wiring.
    Type: Application
    Filed: August 23, 2022
    Publication date: July 13, 2023
    Applicant: TMY Technology Inc.
    Inventors: Chun-Cheng Chan, Jiun-Wei Wu, Su-Wei Chang
  • Publication number: 20230223701
    Abstract: An antenna device, including a case assembly, a first waveguide assembly, and a second waveguide assembly, is provided. A cavity is defined by an interior of the case assembly, and a first side of the case assembly has a slot penetrating the case assembly. At least part of the first waveguide assembly is located within the cavity and is connected to the first side. A projection of the first waveguide assembly to the first side is symmetrically located on two sides of the slot. The second waveguide assembly is located outside the case assembly, is close to the first side, and is connected to the slot. The second waveguide assembly is suitable for transmitting an antenna signal to the cavity through the slot and the first waveguide assembly. The antenna signal resonates in the cavity and radiates outward from a second side of the cavity opposite to the first side.
    Type: Application
    Filed: August 24, 2022
    Publication date: July 13, 2023
    Applicant: TMY Technology Inc.
    Inventors: Chun-Cheng Chan, Jiun-Wei Wu, Chih-Hsien Wu, Su-Wei Chang
  • Patent number: 11588244
    Abstract: The disclosure provides an antenna structure, including at least one supporting module, a first antenna, and a second antenna. The first antenna is disposed on the at least one supporting module and includes a first feeding point and a first zero-current zone. The first antenna is connected to a ground plane. The second antenna is disposed on the at least one supporting module and includes a second feeding point and a second zero-current zone. The second antenna is connected to the ground plane. The first feeding point of the first antenna is disposed in the second zero-current zone of the second antenna, and the second feeding point of the second antenna is disposed in the first zero-current zone of the first antenna.
    Type: Grant
    Filed: August 17, 2020
    Date of Patent: February 21, 2023
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chao-Lin Wu, Jui-Hung Lai, Chih-Heng Lin
  • Publication number: 20220223996
    Abstract: An electronic device including a first body, a second body, and at least one cavity antenna module is provided. The second body has a pivot side and a plurality of non-pivot sides, and the pivot side is connected pivotally to the first body. The cavity antenna module includes a metal cavity body and a first antenna structure. The metal cavity body is disposed in the second body and has an opening. A distance between one of the non-pivot sides and the metal cavity body is smaller than a distance between the pivot side and the metal cavity body, and the opening faces the one of the non-pivot sides. The first antenna structure is disposed in the opening of the metal cavity body, and the first antenna structure includes a feeding portion, a radiating portion, and a ground portion connected with one another.
    Type: Application
    Filed: October 21, 2021
    Publication date: July 14, 2022
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Jhih-Ciang Chen, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chih-Heng Lin, Je-Wei Liao, Chun-Cheng Chan, Jui-Hung Lai
  • Patent number: 11196170
    Abstract: An antenna device is provided in the disclosure. The antenna device includes a metal component, a signal cable, and a grounding component. The metal component includes a slot. The slot includes an open end and a closed end, and the open end forms an opening at a side of the metal component. The signal cable includes a signal portion and a grounding portion. The signal cable is disposed such that a projection of the signal portion is partially overlapped with the opening. The grounding portion is electrically connected to the metal component through the grounding component.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: December 7, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Li-Chun Lee, Chao-Lin Wu, Jui-Hung Lai, Yen-Hao Yu
  • Publication number: 20210344119
    Abstract: The disclosure provides an antenna structure including a ground plane, a first coupling antenna and a reference antenna. The first coupling antenna includes a first excitation source connected to the ground plane. The first excitation source is configured to excite a first resonant mode, and the first coupling antenna forms a first zero current area on the ground plane in response to the first resonant mode. The reference antenna includes a second excitation source connected to the ground plane. The second excitation source is configured to excite a second resonant mode, and the reference antenna forms a second zero current area on the ground plane in response to the second resonant mode. The first excitation source is located in the second zero current area, and the second excitation source is located in the first zero current area.
    Type: Application
    Filed: July 13, 2021
    Publication date: November 4, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai, Chih-Heng Lin
  • Publication number: 20210305706
    Abstract: An antenna device is disposed. The antenna device includes a signal cable, a casing, a grounding component, and a metal member. The signal cable includes a signal portion and a grounding portion. The signal cable is fixed on the casing. The grounding portion is connected to the metal member through the grounding component.
    Type: Application
    Filed: March 25, 2021
    Publication date: September 30, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Jui-Hung Lai
  • Publication number: 20210280973
    Abstract: The disclosure provides an antenna structure, including at least one supporting module, a first antenna, and a second antenna. The first antenna is disposed on the at least one supporting module and includes a first feeding point and a first zero-current zone. The first antenna is connected to a ground plane. The second antenna is disposed on the at least one supporting module and includes a second feeding point and a second zero-current zone. The second antenna is connected to the ground plane. The first feeding point of the first antenna is disposed in the second zero-current zone of the second antenna, and the second feeding point of the second antenna is disposed in the first zero-current zone of the first antenna.
    Type: Application
    Filed: August 17, 2020
    Publication date: September 9, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Yen-Hao Yu, Li-Chun Lee, Chao-Lin Wu, Jui-Hung Lai, Chih-Heng Lin
  • Publication number: 20210083394
    Abstract: An antenna device is provided in the disclosure. The antenna device includes a metal component, a signal cable, and a grounding component. The metal component includes a slot. The slot includes an open end and a closed end, and the open end forms an opening at a side of the metal component. The signal cable includes a signal portion and a grounding portion. The signal cable is disposed such that a projection of the signal portion is partially overlapped with the opening. The grounding portion is electrically connected to the metal component through the grounding component.
    Type: Application
    Filed: January 10, 2020
    Publication date: March 18, 2021
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Chun-Cheng Chan, Shih-Chia Liu, Li-Chun Lee, Chao-Lin Wu, Jui-Hung Lai, Yen-Hao Yu
  • Patent number: D1023935
    Type: Grant
    Filed: March 18, 2022
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Ya-Hao Chan, Yi-Heng Lee, Ming-Cheng Wu, Chun-Yu Chen