Abstract: A method for processing an integrated circuit includes forming a plurality of transistors. The method utilizes a reversed tone patterning process to selectively drive dipoles into the gate dielectric layers of some of the transistors while preventing dipoles from entering the gate dielectric layers of other transistors. This process can be repeated to produce a plurality of transistors each having different threshold voltages.

Abstract: An absorption type near-infrared filter comprising a first multilayer film, a second multilayer film, and an absorption film, wherein in the ultraviolet band, the difference of between the wavelength with the transmittance at 80% of the absorbing film and the wavelength with the reflectivity at 80% of the first multilayer film falls in the range between 25 nm and 37 nm, the difference of between the wavelength with the transmittance at 50% of the absorbing film and the wavelength with the reflectivity at 50% of the first multilayer film falls in the range between 6 nm and 14 nm, and the difference of between the wavelength with the transmittance at 20% of the absorbing film and the wavelength with the reflectivity at 20% of the first multilayer film falls in the range between ?6 nm and 2.5 nm.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: The present application provides a semiconductor device and the method of making the same. The method includes recessing a fin extending from a substrate, forming a base epitaxial feature on the recessed fin, forming a bar-like epitaxial feature on the base epitaxial feature, and forming a conformal epitaxial feature on the bar-like epitaxial feature. The forming of the bar-like epitaxial feature includes in-situ doping the bar-like epitaxial feature with an n-type dopant at a first doping concentration. The forming of the conformal epitaxial feature includes in-situ doping the conformal epitaxial feature with a second doping concentration greater than the first doping concentration.

Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.

Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate, and a dielectric wall adjacent to the first nanostructures. The semiconductor structure also includes a first liner layer between the first nanostructures and the dielectric wall, and the first liner layer is in direct contact with the dielectric wall. The semiconductor structure also includes a gate structure surrounding the first nanostructures, and the first liner layer is in direct contact with a portion of the gate structure.

Abstract: A method includes forming a dummy pattern over test region of a substrate; forming an interlayer dielectric (ILD) layer laterally surrounding the dummy pattern; removing the dummy pattern to form an opening; forming a dielectric layer in the opening; performing a first testing process on the dielectric layer; performing an annealing process to the dielectric layer; and performing a second testing process on the annealed dielectric layer.

Abstract: A method for forming a semiconductor device is provided. The method includes forming a plurality of first channel nanostructures and a plurality of second channel nanostructures in an n-type device region and a p-type device region of a substrate, respectively, and sequentially depositing a gate dielectric layer, an n-type work function metal layer, and a cap layer surrounding each of the first and second channel nanostructures. The cap layer merges in first spaces between adjacent first channel nanostructures and merges in second spaces between adjacent second channel nanostructures. The method further includes selectively removing the cap layer and the n-type work function metal layer in the p-type device region, and depositing a p-type work function metal layer over the cap layer in the n-type device region and the gate dielectric layer in the p-type device region. The p-type work function metal layer merges in the second spaces.

Abstract: A semiconductor device and a method for manufacturing the semiconductor device are provided. The semiconductor device comprises a substrate and a wafer disposed on the substrate. The wafer includes a p-doped layer disposed on the substrate; a first diode disposed on the p-doped layer; a second diode disposed on the p-doped layer; a third diode disposed on the p-doped layer; and a dielectric layer disposed on the substrate and covering the first, second, and third diodes. The first, second, and third diodes are disposed side by side.

Abstract: A sensitivity-adjustable mouse includes a casing, a switching button, an illumination module and a lightshade cover. The switching button is installed on the casing and swingable relative to the casing. The illumination module is disposed within the casing and located under the switching button. The illumination module emits plural light beams to the switching button. The lightshade cover is connected with the switching button and arranged between the switching button and the illumination module. The plural light beams are divided by the lightshade cover. The illumination module and the lightshade cover are covered by the switching button. Due to the appearance of a single button structure, the appearance of the mouse is aesthetically pleasing.

Abstract: A sensitivity-adjustable mouse includes a casing, a switching button, an illumination module and a lightshade cover. The switching button is installed on the casing and swingable relative to the casing. The illumination module is disposed within the casing and located under the switching button. The illumination module emits plural light beams to the switching button. The lightshade cover is connected with the switching button and arranged between the switching button and the illumination module. The plural light beams are divided by the lightshade cover. The illumination module and the lightshade cover are covered by the switching button. Due to the appearance of a single button structure, the appearance of the mouse is aesthetically pleasing.

Abstract: A mouse device includes a casing, a circuit board and two button modules. The circuit board is disposed within the casing. Each button module includes an electronic switch, a button lid, a first protrusion post, a second protrusion post and a buffering structure. The electronic switch is disposed within the casing. An end of the button lid is connected with the casing. The first protrusion post and the second protrusion post are disposed on the bottom surface of the button lid. The buffering structure is disposed on the casing and aligned with the second protrusion post. The second protrusion post is inserted into a buffering hole of the buffering structure. While the button lid is depressed or the pressing force is released, the buffering structure is contacted or not contacted with the second protrusion post along a first lateral direction and/or a second lateral direction.

Abstract: A non-contact and optical measuring automation system, configured to electrically connect to a computer to measure the profile accuracy of a disk cam, includes a base, a rotating chuck, a moving stage module and a laser displacement meter. The rotating chuck is disposed for clamping the disk cam. The moving stage module includes a first linear motion stage movable relative to the base in a first direction and a second linear motion stage movable relative to the first linear motion stage in a second direction. The computer is able to control the rotation of the rotating chuck and the movement of the moving stage module, and is able to control a beam emitted from the laser displacement meter projecting onto a profile surface of the disk cam so as to obtain a profile deviation value of the disk cam by using the laser triangulation method.

Abstract: A non-contact and optical measuring automation system, configured to electrically connect to a computer to measure the profile accuracy of a disk cam, includes a base, a rotating chuck, a moving stage module and a laser displacement meter. The rotating chuck is disposed for clamping the disk cam. The moving stage module includes a first linear motion stage movable relative to the base in a first direction and a second linear motion stage movable relative to the first linear motion stage in a second direction. The computer is able to control the rotation of the rotating chuck and the movement of the moving stage module, and is able to control a beam emitted from the laser displacement meter projecting onto a profile surface of the disk cam so as to obtain a profile deviation value of the disk cam by using the laser triangulation method.

Abstract: A non-contact and optical measuring automation system includes a base, a rotating chuck to clamp a disk cam, a moving stage module and an optical measuring module. The moving stage module includes a first linear motion stage movably disposed on the base, a second linear motion stage movably disposed on the first linear motion stage, and a rotary motion stage rotatably disposed on the second linear motion stage. The optical measuring module disposed on the rotary motion stage includes a laser-emitting unit and an image-capturing unit. The laser-emitting unit projects a light beam onto a cam surface of the disk cam, and the image-capturing unit receives scattering light to capture a grayscale measuring image including a profile speckle pattern. A computer calculates a profile speckle characteristic value according to the grayscale measuring image and the surface roughness value according to the profile speckle characteristic value.

Abstract: A mouse roller module includes a roller, a swinging arm, a movable block and an adjusting device. The roller includes a recess with a toothed surface. The swinging arm includes a contacting part, a linking part and an adjusting part. The contacting part is connected with a first elastic element. In response to an elastic force of the first elastic element, the contacting part provides a pressing force to the toothed surface. When the adjusting part is pushed by the movable block, the swinging arm performs a swinging motion. The movable block is pushed by the piston. While the position of the piston is adjusted by the adjusting device, the movable block is moved and the swinging arm performs the swinging motion. The pressing force of the contacting part provided to the toothed surface is adjusted in response to the swinging motion.

Abstract: A mouse roller module includes a roller, a swinging arm, a movable block and an adjusting device. The roller includes a recess with a toothed surface. The swinging arm includes a contacting part, a linking part and an adjusting part. The contacting part is connected with a first elastic element. In response to an elastic force of the first elastic element, the contacting part provides a pressing force to the toothed surface. When the adjusting part is pushed by the movable block, the swinging arm performs a swinging motion. The movable block is pushed by the piston. While the position of the piston is adjusted by the adjusting device, the movable block is moved and the swinging arm performs the swinging motion. The pressing force of the contacting part provided to the toothed surface is adjusted in response to the swinging motion.

Abstract: A touch panel including a touch area and a peripheral area adjacent to the touch area is provided. The touch panel includes a plurality of first electrodes, a plurality of second electrodes, a plurality of third electrodes, a plurality of pads and a plurality of wirings. The first electrodes, the second electrodes and the third electrodes are located in the touch area and electrically insulated to each other, wherein the third electrodes expose at least a part of the first electrodes and at least a part of the second electrodes. The pads are located in the peripheral area. The first electrodes, the second electrodes and the third electrodes are electrically connected to the pads through the wirings respectively.

Abstract: A touch panel including a touch area and a peripheral area adjacent to the touch area is provided. The touch panel includes a plurality of first electrodes, a plurality of second electrodes, a plurality of third electrodes, a plurality of pads and a plurality of wirings. The first electrodes, the second electrodes and the third electrodes are located in the touch area and electrically insulated to each other, wherein the third electrodes expose at least a part of the first electrodes and at least a part of the second electrodes. The pads are located in the peripheral area. The first electrodes, the second electrodes and the third electrodes are electrically connected to the pads through the wirings respectively.

Abstract: A touch panel and a manufacturing method thereof are provided. The touch panel includes an insulating layer, a plurality of first conductive electrodes, a plurality of second conductive electrodes, a plurality of first auxiliary electrodes and a plurality of second auxiliary electrodes. The insulating layer has a plurality of through holes. The first conductive electrodes are arranged along a first direction and electrically connected with each other. The second conductive electrodes are arranged along a second direction and electrically connected with each other. The first auxiliary electrodes and the first conductive electrodes are electrically connected via part of the though holes. The second auxiliary electrodes and the second conductive electrodes are electrically connected via another of the though holes.