Abstract: The present disclosure discloses a memory access interface device. A clock generation circuit generates reference signals. A transmitter transmits an output command and address signal to a memory device according to the reference signals. A signal training circuit executes a training process in a training mode that includes steps outlined below. A training signal is generated such that the training signal is transmitted as the output command and address signal. The training signal and the data signal generated by the memory device are compared to generate a comparison result indicating whether the data signal matches the training signal. The comparison result is stored. The clock generation circuit is controlled to modify a phase of at least one of the reference signals to be one of a plurality of under-test phases to execute a new loop of the training process until all the under-test phases are trained.

Abstract: The present disclosure discloses a memory access interface device. A clock generation circuit generates reference clock signals. Each of access signal transmission circuits each includes a duty cycle adjusting circuit, a duty cycle detection circuit, a frequency division circuit and an asynchronous first-in-first-out circuit. The duty cycle adjusting circuit performs duty cycle adjustment on one of the reference clock signals according to a duty cycle detection signal to generate an output clock signal having a duty cycle. The duty cycle detection circuit detects a variation of the duty cycle to generate the duty cycle detection signal. The frequency division circuit divides a frequency of the output clock signal to generate a read clock signal. The asynchronous first-in-first-out circuit receives an access signal from a memory access controller and outputs an output access signal according to the read clock signal to access the memory device accordingly.

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

Abstract: A method for semiconductor manufacturing is provided. The method includes defining a first cell level group comprising a first set of pattern features corresponding to a predetermined manufacturing process associated with an layout; determining a first number of cell units based on the first cell level group, wherein each of the first number of cell units is compatible with each other; defining a second cell level group comprising the first set of pattern features and a second set of pattern features; and determining a second number of cell units based on the second cell level group, wherein each of the second number of cell units is compatible with each other. The first set of pattern features and the second set of pattern features are arranged in responsive to sequential operations of the predetermined manufacturing process.

Abstract: A protective cover includes a base plate, and a cover unit cooperating with the base plate to define an accommodating space and including an opening communicating with the accommodating space for entry of a first or second storage device into the accommodating space. At least one pad member is connected foldably to the base plate and is operable to move between unfolded and folded positions. The pad member is folded over the base plate when in the folded position. The accommodating space is adapted to accommodate the first storage device when the pad member is in the unfolded position and the second storage device when the pad member is in the folded position.

Abstract: A protective cover includes a base plate, and a cover unit cooperating with the base plate to define an accommodating space and including an opening communicating with the accommodating space for entry of a first or second storage device into the accommodating space. At least one pad member is connected foldably to the base plate and is operable to move between unfolded and folded positions. The pad member is folded over the base plate when in the folded position. The accommodating space is adapted to accommodate the first storage device when the pad member is in the unfolded position and the second storage device when the pad member is in the folded position.

Abstract: An assembling apparatus is disclosed. The assembling apparatus includes a base, an assembling platform, and a driving part. The assembling platform and the driving part are fixed on the base. The assembling platform defines a receiving space for receiving a semiconductor chip module, a lever chamber for receiving clips of the semiconductor chip module, and a driving groove for connecting the receiving space and the lever chamber. The assembling platform further includes a lever bar removably placed in the lever chamber for expanding the clips. The driving part includes driving shafts. An end of each of the driving shafts is in the driving groove and is movable to pass through the lever chamber and reaches the receiving space. The assembling apparatus is used to assemble a semiconductor chip module conveniently and safely.

Abstract: A clamp tool for circuit board is disclosed. The clamp tool includes a frame, a handle, a plurality of gripping shafts, and a lock. The frame defines two vertical grooves facing each other. The handle is mounted on top of the frame. The gripping shafts are mounted beneath the frame, and include protuberant gripping heads on an end thereof. The lock includes a pull rod and a locking shaft. The pull rod passes through the vertical grooves and connects with the frame by elastic pieces. The locking shaft is mounted beneath the pull rod. The clamp tool is used to move circuit boards.

Abstract: A clamp tool for circuit board is disclosed. The clamp tool includes a frame, a handle, a plurality of gripping shafts, and a locking means. The frame defines two vertical grooves facing to each other. The handle is mounted on top of the frame. The gripping shafts are mounted beneath the frame, and include protuberant gripping heads on an end thereof. The locking means includes a pull rod and a locking shaft. The pull rod passes through the vertical grooves and connects with the frame by elastic pieces. The locking shaft is mounted beneath the pull rod. The clamp tool is used to move circuit boards.

Abstract: An assembling apparatus is disclosed. The assembling apparatus includes a base, an assembling platform, and a driving part. The assembling platform and the driving part are fixed on the base. The assembling platform defines a receiving space for receiving a semiconductor chip module, a lever chamber for receiving clips of the semiconductor chip module, and a driving groove for connecting the receiving space and the lever chamber. The assembling platform further includes a lever bar removably placed in the lever chamber for expanding the clips. The driving part includes driving shafts. An end of each of the driving shafts is in the driving groove and is movable to pass through the lever chamber and reaches the receiving space. The assembling apparatus is used to assemble a semiconductor chip module conveniently and safely.

Abstract: An integrated circuit (IC) layout includes an arrangement of instances of cells, wherein each cell describes a separate corresponding electronic device to be incorporated into the IC. An internal layout of each cell includes one or more objects corresponding to portions of IC material that are to form the corresponding electronic device, and the shape and position of each object within the cell layout represents the shape and position of the corresponding portion of IC material within the corresponding electronic device. When a dimension or position of an object within a cell's internal layout can be altered without affecting the behavior of the electronic device the cell describes, a device rule is created for that cell to indicate any constraint on that object's dimension or relative position. The IC layout is then compacted both by moving cell instances closer together, and also by altering internal layouts of cell instances in a manner consistent with their device rules.

Abstract: A fixing device for memory is disclosed. The fixing device includes a frame, a pair of support rails, and an elastic piece. The frame includes two sides facing to each other. The support rails are mounted on the two sides of the frame. Each support rail defines a slide groove and a clip groove respectively. The elastic piece is positioned between the support rails. The fixing device can fix memory with no screws.

Abstract: An integrated circuit (IC) layout includes an arrangement of instances of cells, wherein each cell describes a separate corresponding electronic device to be incorporated into the IC. An internal layout of each cell includes one or more objects corresponding to portions of IC material that are to form the corresponding electronic device, and the shape and position of each object within the cell layout represents the shape and position of the corresponding portion of IC material within the corresponding electronic device. When a dimension or position of an object within a cell's internal layout can be altered without affecting the behavior of the electronic device the cell describes, a device rule is created for that cell to indicate any constraint on that object's dimension or relative position. The IC layout is then compacted both by moving cell instances closer together, and also by altering internal layouts of cell instances in a manner consistent with their device rules.