Abstract: Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to one embodiment includes first nanostructures, a first gate structure wrapping around each of the first nanostructures and disposed over an isolation structure, and a backside gate contact disposed below the first nanostructures and adjacent to the isolation structure. A bottom surface of the first gate structure is in direct contact with the backside gate contact.

Abstract: The present disclosure is related to a lead frame structure. The lead frame structure includes a bottom board and a blocking wall. The bottom board has a first conductive portion and a second conductive portion. The first conductive portion separates from the second conductive portion. The first and second conductive portions are configured to electrically connect to a light source. The blocking wall is located on the bottom board, and the blocking wall surrounds an opening. The first and the second conductive portions are exposed from the opening. The first and the second conductive portions each have an extending portion. The extending portion extends beyond an external surface of the blocking wall in a horizontal direction.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A semiconductor device structure and a method for forming a semiconductor device structure are provided. The semiconductor device structure includes a stack of channel structures over a base structure. The semiconductor device structure also includes a first epitaxial structure and a second epitaxial structure sandwiching the channel structures. The semiconductor device structure further includes a gate stack wrapped around each of the channel structures and a backside conductive contact connected to the second epitaxial structure. A first portion of the backside conductive contact is directly below the base structure, and a second portion of the backside conductive contact extends upwards to approach a bottom surface of the second epitaxial structure. In addition, the semiconductor device structure includes an insulating spacer between a sidewall of the base structure and the backside conductive contact.

Abstract: A method includes placing a polisher head on platen, the polisher head including a set of first magnets, and controlling a set of second magnets to rotate the polisher head on the platen, wherein controlling the set of second magnets includes reversing the polarity of at least one second magnet of the set of second magnets to produce a magnetic force on at least one first magnet of the set of first magnets, wherein the set of second magnets are external to the polisher head.

Abstract: An image sensor includes a group of sensor units and a color filter layer disposed within the group of sensor units. The image sensor further includes a dielectric structure and a plurality of polarization splitters disposed corresponding to the color filter layer. Each of the plurality of polarization splitters has a first meta element extending in a first direction from top view and a second meta element extending in a second direction from top view. The second direction is perpendicular to the first direction.

Abstract: A semiconductor device with dual side source/drain (S/D) contact structures and a method of fabricating the same are disclosed. The method includes forming a fin structure on a substrate, forming a superlattice structure on the fin structure, forming first and second S/D regions within the superlattice structure, forming a gate structure between the first and second S/D regions, forming first and second contact structures on first surfaces of the first and second S/D regions, and forming a third contact structure, on a second surface of the first S/D region, with a work function metal (WFM) silicide layer and a dual metal liner. The second surface is opposite to the first surface of the first S/D region and the WFM silicide layer has a work function value closer to a conduction band energy than a valence band energy of a material of the first S/D region.

Abstract: An acute kidney injury predicting system and a method thereof are proposed. A processor reads the data to be tested, the detection data, the machine learning algorithm and the risk probability comparison table from a main memory. The processor trains the detection data according to the machine learning algorithm to generate an acute kidney injury prediction model, and inputs the data to be tested into the acute kidney injury prediction model to generate an acute kidney injury characteristic risk probability and a data sequence table. The data sequence table lists the data to be tested in sequence according to a proportion of each of the data to be tested in the acute kidney injury characteristics. The processor selects one of the medical treatment data from the risk probability comparison table according to the acute kidney injury characteristic risk probability.

Abstract: A semiconductor device includes a first dielectric layer, a stack of semiconductor layers disposed over the first dielectric layer, a gate structure wrapping around each of the semiconductor layers and extending lengthwise along a direction, and a dielectric fin structure and an isolation structure disposed on opposite sides of the stack of semiconductor layers and embedded in the gate structure. The dielectric fin structure has a first width along the direction smaller than a second width of the isolation structure along the direction. The isolation structure includes a second dielectric layer extending through the gate structure and the first dielectric layer, and a third dielectric layer extending through the first dielectric layer and disposed on a bottom surface of the gate structure and a sidewall of the first dielectric layer.

Abstract: A handheld electronic device is provided. The handheld electronic device includes a housing, a first speaker, a second speaker, a third speaker, and a fourth speaker. The housing includes a back plate, a first sidewall, and a second sidewall. The first sidewall and the second sidewall are disposed at opposite sides of the back plate. The first sidewall is parallel to the second sidewall, and a length of the first sidewall is greater than a distance between the first sidewall and the second sidewall. The first speaker and the second speaker are disposed in the housing and arranged along the first sidewall. The third speaker and the fourth speaker are disposed in the housing and arranged along the second sidewall.

Abstract: A sound quality evaluation method and a sound quality evaluation system using same are provided. The sound quality evaluation system records playback of a test audio file on a plurality of playback devices to generate a plurality of pieces of audio data, and divides the audio data into a plurality of frequency bands. The sound quality evaluation system calculates the frequency bands to obtain a plurality of evaluation scores of the playback devices. The sound quality evaluation system captures sound quality ranking information corresponding to the playback devices from a reference source, and adjusts the evaluation scores according to the sound quality ranking information, to further obtain a reference model. The sound quality evaluation system adjusts correspondingly evaluation scores of a plurality of to-be-tested playback devices according to the reference model, to obtain sound quality ranking information of the to-be-tested playback devices.

Abstract: Provided is a protection method for use in fan malfunctions, applicable to an electronic device, and effective in preventing the electronic device from being overheated. The electronic device includes a fan, temperature sensor, and processor. The method includes steps of: limiting the processor's performance, upon determination that not only is the fan's rotation speed greater than or equal to a predetermined upper rotation speed limit, but the electronic device's temperature sensed by the temperature sensor is also greater than or equal to a predetermined upper temperature limit; determining whether the fan's rotation speed is less than or equal to a first restored rotation speed when the fan's rotation speed is determined to be less than the predetermined upper rotation speed limit; and stopping the limiting of the processor's performance when the fan's rotation speed is determined to be less than or equal to the first restored rotation speed.

Abstract: A sound quality evaluation method and a sound quality evaluation system using same are provided. The sound quality evaluation system records playback of a test audio file on a plurality of playback devices to generate a plurality of pieces of audio data, and divides the audio data into a plurality of frequency bands. The sound quality evaluation system calculates the frequency bands to obtain a plurality of evaluation scores of the playback devices. The sound quality evaluation system captures sound quality ranking information corresponding to the playback devices from a reference source, and adjusts the evaluation scores according to the sound quality ranking information, to further obtain a reference model. The sound quality evaluation system adjusts correspondingly evaluation scores of a plurality of to-be-tested playback devices according to the reference model, to obtain sound quality ranking information of the to-be-tested playback devices.

Abstract: A size determination method for a document processing device is provided. The document processing device includes an automatic document feeding module. The automatic document feeding module includes a support tray, an entrance and a detecting module. The detecting module includes a front-row detector and plural rear-row detectors. The size determination method includes following steps. Firstly, a document with plural originals is placed on the support tray and inserted into the entrance. Then, a selected original of the document is transported. When the selected original is detected by the front-row detector, the plural rear-row detectors are powered on. The selected original is continuously transported, and the plural rear-row detectors are operated in a detection mode. Then, a size of the selected original is determined according to detection results of the plural rear-row detectors and a transfer time of the selected original.

Abstract: A sheet size detecting mechanism includes a sheet guiding module, a sensing module and a control unit. The sensing module includes a contact element and a circuit board. The circuit board includes a first conducting part, a second conducting part and plural fixed resistors. The first conducting part includes plural conductive segments. The plural conductive segments are connected with the corresponding fixed resistors, respectively. While the sheet guiding module is moved relative to the sheet input tray, the contact element is moved with the sheet guiding module. When the electric connection between a first conductive segment and the second conducting part is established through the contact element, the corresponding fixed resistor provides a resistance value, and the circuit board issues a sensing signal according to the resistance value. The control unit acquires the size of the paper sheet according to the sensing signal.

Abstract: Provided is a protection method for use in fan malfunctions, applicable to an electronic device, and effective in preventing the electronic device from being overheated. The electronic device includes a fan, temperature sensor, and processor. The method includes steps of: limiting the processor's performance, upon determination that not only is the fan's rotation speed greater than or equal to a predetermined upper rotation speed limit, but the electronic device's temperature sensed by the temperature sensor is also greater than or equal to a predetermined upper temperature limit; determining whether the fan's rotation speed is less than or equal to a first restored rotation speed when the fan's rotation speed is determined to be less than the predetermined upper rotation speed limit; and stopping the limiting of the processor's performance when the fan's rotation speed is determined to be less than or equal to the first restored rotation speed.

Abstract: A sheet size detecting mechanism includes a sheet guiding module, a sensing module and a control unit. The sensing module includes a contact element and a circuit board. The circuit board includes a first conducting part, a second conducting part and plural fixed resistors. The first conducting part includes plural conductive segments. The plural conductive segments are connected with the corresponding fixed resistors, respectively. While the sheet guiding module is moved relative to the sheet input tray, the contact element is moved with the sheet guiding module. When the electric connection between a first conductive segment and the second conducting part is established through the contact element, the corresponding fixed resistor provides a resistance value, and the circuit board issues a sensing signal according to the resistance value. The control unit acquires the size of the paper sheet according to the sensing signal.

Abstract: A method for preventing battery from expanding is applied to awake an embedded controller to measure variations of a temperature and a storage capacity of a battery module of an electric device at a preset frequency to timely control the battery module to discharge when the electric device is in an off-state, so as to prevent the battery module from expanding and deforming.

Abstract: A handle structure including a base portion, a stop portion and a grip portion is provided. The grip portion is connected between the base portion and the stop portion. The handle structure has a cavity therein, the cavity has a bottom surface, and the bottom surface of the cavity is inclined to an axial direction of the grip portion.