Abstract: A high efficiency light-emitting diode (LED) structure is provided, which mainly includes a die cup. The die cup is respectively provided with an anode and a cathode at two sides there below, and is mounted on a substrate. A plurality of dies is disposed above the die cup. The dies are connected in series via a gold wire and meanwhile sealed with a molding compound. Pins of the dies are connected to the anode and the cathode. A drive current that is lower than one half of a maximum rated current value is applied to the LED structure, thereby improving the luminescent efficiency.