Patents by Inventor Chun Chieh Kung

Chun Chieh Kung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor Device Structure with Interconnect Structure and Method for Forming the Same
    Publication number: 20240087951
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first metal layer over a substrate, forming a dielectric layer over the first metal layer. The method includes forming a trench in the dielectric layer, and performing a surface treatment process on a sidewall surface of the trench to form a hydrophobic layer. The hydrophobic layer is formed on a sidewall surface of the dielectric layer. The method further includes depositing a metal material in the trench and over the hydrophobic layer to form a via structure.
    Type: Application
    Filed: November 17, 2023
    Publication date: March 14, 2024
    Inventors: Chun-Hao Kung, Chih-Chieh Chang, Kao-Feng Liao, Hui-Chi Huang, Kei-Wei Chen
  • System and method for protecting a receiver from jamming interference
    Patent number: 6704557
    Abstract: An interference protection system includes a receiving section for receiving an electromagnetic signal, a detector for detecting a jamming signal, and a control system for orienting a changeable null direction of an antenna system to reduce interference in a receiver from the jamming signal.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: March 9, 2004
    Assignee: Lucent Technologies Inc.
    Inventors: Sreenath Krishnamurthy, Chun Chieh Kung, Kun-Yii Tu