Patents by Inventor Chun Ching Liew

Chun Ching Liew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including a clip
    Patent number: 10424534
    Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: September 24, 2019
    Assignee: Infineon Technologies AG
    Inventors: Xavier Arokiasamy, Chun Ching Liew
  • SEMICONDUCTOR DEVICE INCLUDING A CLIP
    Publication number: 20170250125
    Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.
    Type: Application
    Filed: May 2, 2017
    Publication date: August 31, 2017
    Applicant: Infineon Technologies AG
    Inventors: Xavier Arokiasamy, Chun Ching Liew
  • Semiconductor device including a clip
    Patent number: 9640465
    Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.
    Type: Grant
    Filed: June 3, 2015
    Date of Patent: May 2, 2017
    Assignee: Infineon Technologies AG
    Inventors: Xavier Arokiasamy, Chun Ching Liew
  • SEMICONDUCTOR DEVICE INCLUDING A CLIP
    Publication number: 20160358843
    Abstract: A semiconductor device includes a lead frame including a die paddle and a lead, a semiconductor chip, and a clip. The semiconductor chip has a first side and a second side opposite to the first side. The first side is attached to the die paddle and the second side includes a first bond pad and a second bond pad. The clip electrically couples the first bond pad to the lead. The clip contacts the first bond pad at a first edge portion of the first bond pad adjacent to the second bond pad and defines a first cavity between a central portion of the first bond pad and the clip. Solder is within the first cavity to electrically couple the clip to the first bond pad. The semiconductor device includes a first opening to the first cavity to route flux away from the second bond pad during reflow soldering.
    Type: Application
    Filed: June 3, 2015
    Publication date: December 8, 2016
    Applicant: Infineon Technologies AG
    Inventors: Xavier Arokiasamy, Chun Ching Liew