Abstract: A multi-chips Stacked package structure, wherein a plurality of chips are stacked on the substrate with a rotation so that a plurality of metallic ends and the metal pad on each chip on the substrate can all be exposed; a plurality of metal wires are provided for electrically connecting the plurality of metal pads on the plurality of chips with the plurality metallic ends on the substrate in one wire bonding process; then an encapsulate is provided for covering the plurality of stacked chips, a plurality of metal wires and the plurality of metallic ends on the substrate.