Abstract: A method includes receiving an integrated circuit (IC) design layout including a layout block, where the layout block including first line patterns disposed along a first direction, extending lengths of the first line patterns, connecting portions of the first line patterns disposed within a distance less than a preset value, forming second line patterns disposed outside the layout block parallel to the first line patterns, forming mandrel bar patterns overlapping edges of the layout block, where the mandrel bar patterns oriented along a second direction perpendicular to the first direction, and outputting a pattern layout for mask fabricating, where the pattern layout includes the layout block, the first and second line patterns, and the mandrel bar patterns.

Abstract: An image sensor device is provided. The image sensor device includes a semiconductor substrate having a front surface, a back surface opposite to the front surface, and a light-sensing region close to the front surface. The image sensor device includes an insulating layer covering the back surface and extending into the semiconductor substrate. The protection layer has a first refractive index, and the first refractive index is less than a second refractive index of the semiconductor substrate and greater than a third refractive index of the insulating layer, and the protection layer conformally and continuously covers the back surface and extends into the semiconductor substrate. The image sensor device includes a reflective structure surrounded by insulating layer in the semiconductor substrate.

Abstract: Semiconductor structures and processes are provided. A semiconductor structure of the present disclosure includes a first base portion and a second base portion extending lengthwise along a first direction, a first source/drain feature disposed over the first base portion, a second source/drain feature disposed over the second base portion, a center dielectric fin sandwiched between the first source/drain feature and the second source/drain feature along a second direction perpendicular to the first direction, and a source/drain contact disposed over the first source/drain feature, the second source/drain feature and the center dielectric fin. A portion of the source/drain contact extends between the first source/drain feature and the second source/drain feature along the second direction.

Abstract: A device includes a first channel layer, a second channel layer, a gate structure, a source/drain epitaxial structure, and a source/drain contact. The first channel layer and the second channel layer are arranged above the first channel layer in a spaced apart manner over a substrate. The gate structure surrounds the first and second channel layers. The source/drain epitaxial structure is connected to the first and second channel layers. The source/drain contact is connected to the source/drain epitaxial structure. The second channel layer is closer to the source/drain contact than the first channel layer is to the source/drain contact, and the first channel layer is thicker than the second channel layer.

Abstract: A semiconductor device includes at least one fin, a first dielectric layer and a second dielectric layer. The first dielectric layer is disposed on the at least one fin. The second dielectric layer between the at least one fin and the first dielectric layer. A thickness of the first dielectric layer on a sidewall of the at least one fin is less than a thickness of the second dielectric layer on the sidewall of the at least one fin.

Abstract: This invention provides a shoe upper design model generating method, system and non-transitory computer readable storage media, including steps of providing a 2D mapping boundary, providing a 3D upper, performing a flattening algorithm on the 3D upper with respect to the 2D mapping boundary, constructing a 2D upper boundary, creating an upper design drawing on the 2D upper boundary, intersecting the 2D upper boundary and the 2D mapping boundary to form a 2D upper design area and mapping grids in the 2D upper design area onto grids in the 3D upper, thereby obtaining an upper design model containing the mapping relation between the 2D upper design area and the 3D upper. Accordingly, the upper pattern making time and cost can be saved, and the distortion and deformation in the process of 2D-3D conversion can be reduced, thus the completed 2D upper design drawing can be used in production process directly.

Abstract: A USB IC, an operation method thereof, and a USB device are provided. The USB IC is disposed in the USB device and includes a sideband use interface circuit coupled to a sideband use pin of a USB connector of the USB device, and a control circuit. The control circuit is coupled to the sideband use interface circuit and reports a first adapter configuration to a USB host via the sideband use interface circuit so that the USB host enumerates the USB device. The control circuit observes a behavior of the USB host to the USB device after the USB device is enumerated. The control circuit determines whether the first adapter configuration is suitable for a connection manager of the USB host according to the behavior. If not, the control circuit reports a second adapter configuration to the USB host so that the USB host re-enumerates the USB device.

Abstract: A touch apparatus including a first substrate, a first translucent electrode, a second substrate, an electrochromic layer, a reflective film, and a touch sensing structure is provided. The first substrate has a first inner surface and a first outer surface opposite to each other. The first translucent electrode is disposed on the first inner surface. The second substrate is disposed opposite to the first substrate. The electrochromic layer is located between the first inner surface of the first substrate and the second substrate. The reflective film is disposed on the second substrate. The touch sensing structure is disposed on the first outer surface of the first substrate.

Abstract: A rear-view mirror installed in a transport vehicle is provided. The rear-view mirror includes a first substrate, a second substrate, an electrochromic material layer, a light-transmitting electrode, a reflective layer, and a transparent conductive layer. The second substrate is opposite to the first substrate. The electrochromic material layer is disposed between the first substrate and the second substrate. The light-transmitting electrode is disposed between the first substrate and the electrochromic material layer. The electrochromic material layer is disposed between the first substrate and the reflective layer. The transparent conductive layer is disposed between the electrochromic material layer and the reflective layer. In addition, a driving auxiliary apparatus is also provided.

Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: A touch apparatus including a first substrate, a first translucent electrode, a second substrate, an electrochromic layer, a reflective film, and a touch sensing structure is provided. The first substrate has a first inner surface and a first outer surface opposite to each other. The first translucent electrode is disposed on the first inner surface. The second substrate is disposed opposite to the first substrate. The electrochromic layer is located between the first inner surface of the first substrate and the second substrate. The reflective film is disposed on the second substrate. The touch sensing structure is disposed on the first outer surface of the first substrate.

Abstract: A hub device and corresponding method include a first chip having at least a first upstream port and a plurality of first downstream ports, a second chip, having at least a second upstream port and at least one second downstream port; and an external memory device, storing firmware data corresponding to the first chip and the second chip. One one of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub, and the first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: An interface chip capable of accurate link detection. The interface chip mounted on a first electronic device has a link layer and a physical layer. The link layer outputs data to be transformed and transmitted to a second electronic device by the physical layer. The data transmitted from the second electronic device is received and transformed by the physical layer and then conveyed to the link layer. The link layer includes a state machine, which performs a state modification on the first electronic device to rescue the second electronic device from a trapped state for confirming a link between the first and second electronic devices, wherein data output by the link layer and transformed and transmitted to the second electronic device by the physical layer is changed according to the state modification.

Abstract: A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer.

Abstract: A USB hub and a method thereof. The USB hub supplies power to a USB device, is connected between the USB device and a USB host under a working power state, and comprises an upstream port, a downstream port, a power port, and a controller. The upstream port is coupled to the USB host. The downstream port is coupled to the USB device. The power port is coupled to a power source. The controller is coupled to the upstream port, the downstream port, and the power port, and determines whether the USB host has left the working power state, and determines whether the USB device is electrically chargeable, when the USB host has left the working power state. The downstream port provides power to the USB device from the power source when the USB device is electrically chargeable.

Abstract: A touch-sensing substrate including a substrate, a patterned conductive layer and a patterned insulating layer is provided. The substrate has a plurality of first striped regions and a plurality of second striped regions. The first striped regions are intersected with the second striped regions to define a plurality of sensing-pad disposition regions. The patterned conductive layer includes a plurality of sensing pads disposed in the sensing-pad disposition regions. The patterned insulating layer is disposed on the first striped regions and the second striped regions. The patterned insulating layer and the patterned conductive layer are spliced to form a patterned light-shielding layer. The patterned light-shielding layer has a plurality of enclosed notches arranged in array, wherein parts of the enclosed notches are surrounded by the patterned conductive layer, and other parts of the enclosed notches are surrounded by the patterned conductive layer and the patterned insulating layer.

Abstract: A hub device includes a first chip, a second chip and an external memory device. The first chip includes at least a first upstream port and multiple first downstream ports. The second chip includes at least a second upstream port and multiple second downstream ports. The external memory device stores firmware data corresponding to the first chip and the second chip. One of the first downstream ports of the first chip is coupled to the second upstream port of the second chip to form a tiered hub. The first chip and the second chip are sequentially enabled and the first chip and the second chip sequentially load the corresponding firmware data.

Abstract: A USB hub and a method thereof. The USB hub supplies power to a USB device, is connected between the USB device and a USB host under a working power state, and comprises an upstream port, a downstream port, a power port, and a controller. The upstream port is coupled to the USB host. The downstream port is coupled to the USB device. The power port is coupled to a power source. The controller is coupled to the upstream port, the downstream port, and the power port, and determines whether the USB host has left the working power state, and determines whether the USB device is electrically chargeable, when the USB host has left the working power state. The downstream port provides power to the USB device from the power source when the USB device is electrically chargeable.

Abstract: A bonding mechanism for a heat conduction tube and heat dissipation plate is disclosed. The bonding mechanism comprises an installation platform, an elevating device, and a height-adjusting device. The installation platform allows the heat dissipation plates to be placed flatly on the surface of the platform and the height adjusting device is for the control of the height of the heat conduction tube. A plurality of heat dissipation plates can be mounted in sequence with a fixed gap onto the heat conduction tube. The bonding mechanism provides a low noise and low vibration and facilitating adjustment of bonding gap of the heat dissipation plates.