Patents by Inventor Chun Howe Sim

Chun Howe Sim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packages
    Patent number: 11495514
    Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.
    Type: Grant
    Filed: September 18, 2020
    Date of Patent: November 8, 2022
    Assignee: Intel Corporation
    Inventors: Chew Ching Lim, Chun Howe Sim
  • BATHTUB INTEGRATED HEAT SPREADER WITH MULTIPLE THERMAL-INTERFACE MATERIAL FOR INTEGRATED-CIRCUIT PACKAGES
    Publication number: 20210183727
    Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.
    Type: Application
    Filed: September 18, 2020
    Publication date: June 17, 2021
    Inventors: Chew Ching Lim, Chun Howe Sim