Patents by Inventor Chun-Hsien Lee

Chun-Hsien Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20050175930
    Abstract: The present invention discloses a photosensitive resin composition for black matrix, which shows high photosensitivity and forms a pattern with good smoothness of edge, high resolution, no undercut and free of peeling after development. The photosensitive resin composition comprises (A) an alkali-soluble resin, (B) a photopolymerizable monomer, (C) a photoinitiator having a general formula (c-1), (D) a solvent, and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1); (Each R is independently H, linear or branch alkyl of C1-C5, phenyl, or halogen.) (Z1 is selected from the group consisting of Ra, Rb-S, Rc-O, wherein each of Ra, Rb, Rc is independently H, alkyl or aryl; Z2 is H, alkyl of C1-C4, or halide.
    Type: Application
    Filed: June 21, 2004
    Publication date: August 11, 2005
    Inventor: Chun-Hsien Lee
  • Publication number: 20050158659
    Abstract: A photosensitive resin composition for a black matrix comprises (A) an alkali-soluble resin; (B) a photopolymerizable monomer; (C) a photoinitiator; (D) a solvent; and (E) a black pigment; wherein the alkali-soluble resin (A) comprises a functional group having a general formula (a-1); viscosity of said photosensitive resin composition for the black matrix is 0.5-4.0 cps at 25° C.; the solid content of said photosensitive resin composition is 5-25 wt. %; and said solvent (D) has a saturated vapor pressure below 4.5 mm-Hg at 20° C.; which presents no pinhole on the surface after low pressure drying, no line and cloud defect on the film, good inner uniformity of the coated film and high photosensitivity after pre-bake, high heat resistance for black matrix after post-bake; which can be coated on the substrate, specifically the large-sized substrate, of liquid crystal display by the slit coating process. (Each of R is independently H, linear or branch alkyl of C1-C5, phenyl or halogen.
    Type: Application
    Filed: May 17, 2004
    Publication date: July 21, 2005
    Inventor: Chun-Hsien Lee
  • Publication number: 20050140335
    Abstract: A terminal voltage equalization circuit is used to equalize the terminal voltage of the series of connected battery strings so that each battery in the series of connected battery strings can be equally charged. When voltage of a certain battery in the battery string is higher than that of the other batteries, the battery voltage sensing and controlling circuit will output a high frequency signal to drive the switch devices to transit power from the high voltage batteries to the low voltage batteries by transformer. By the high switching switches, the charging currents through the batteries with high terminal voltages can be reduced, the charging currents through the batteries with low terminal voltages can be enhanced, and therefore the damages to the batteries due to overcharging can be avoided and speedy balance of the terminal voltages between each battery can be achieved.
    Type: Application
    Filed: July 2, 2004
    Publication date: June 30, 2005
    Inventors: Chun-Hsien Lee, Pao-Chuan Lin
  • Publication number: 20050041564
    Abstract: A recording apparatus includes a microphone for receiving sound waves and generating a corresponding audio signal, a signal module for providing corresponding sound data according to the audio signal, and an optical recording module for writing the data optically onto optical storage media. The optical recording module is only for writing the data optically into the optical storage media.
    Type: Application
    Filed: September 18, 2003
    Publication date: February 24, 2005
    Inventors: Hsi-Yuan Hsu, Chun-Hsien Lee
  • Patent number: 6859129
    Abstract: A three dimensional adjustable high frequency inductor, its module and fabrication method of the same. The high frequency module includes micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: February 22, 2005
    Assignee: Asia Pacific Microsystems
    Inventors: Shu-Hui Tsai, Shang-Yu Liang, Chun-Hsien Lee
  • Publication number: 20050029987
    Abstract: A battery energy balance circuit and a battery charging bypass circuit is disclosed for batteries being charged at the same time to be charged equally. When the terminal voltages of the batteries are different, a controllable power device switch in the circuit switches on and off at a high frequency in order to reduce the input current to the batteries with higher terminal voltages and to increase the input current to the batteries with lower terminal voltages, achieving the goal of equal charging. The disclosed energy balance circuit can avoid damages to the batteries as a result of overcharging. When the number of batteries increases, one can expand the system in a modularized way to prevent inconvenience of circuit designs.
    Type: Application
    Filed: November 24, 2003
    Publication date: February 10, 2005
    Inventors: Pao-Chuan Lin, Chun-Hsien Lee, Yi-Shuo Huang, Chung-Lin Lee
  • Patent number: 6764570
    Abstract: A method and an apparatus are provided for bonding a coating to a web of cloth or foam without sacrificing the characteristics of the spandex mesh or foam. The coating and the cloth or foam are bonded and heated and then conveyed to an aspiration device for removing air between the coating and the cloth, thereby providing a thorough bonding therebetween.
    Type: Grant
    Filed: August 27, 2001
    Date of Patent: July 20, 2004
    Inventor: Chun-Hsien Lee
  • Publication number: 20040101068
    Abstract: A digital receiver is enabled to process modulated signals at various data rates including a sampling circuit for receiving modulated signals and outputting digitalized sampled signals, a matched filter for expelling noise from digitalized sampled signals at a first data rate and at a second data rate and generating in-phase and quadrature-phase signals, a barker code correlator for depreading digitalized sampled signals at first data rate, a channel equalizer which counteracts co-channel interferences by using equalizer coefficients obtained from a plurality of noise whitening coefficients so as to generate a sequence of symbol decisions therefrom, a CCK correlator coupled to the channel equalizer for decoding signals at the second data rate and at a third data rate, a first quantization filter for recovering transmitted signals at the first data rate, and a second quantization fitler for recovering transmitted signals at the second data rate and at the third data rate.
    Type: Application
    Filed: November 25, 2002
    Publication date: May 27, 2004
    Inventors: Tzu-Pai Wang, Chun-Hsien Lee
  • Publication number: 20040063039
    Abstract: Disclosed herein is a method for inductor An Improved Structure For the Endpiece of Tape Rule of the high frequency integrated passive devices in which a spiral inductor pattern is formed on an insulation substrate, the spiral inductor pattern is spirally coiled outwards from the center. A thick film dielectric layer made of bisbenzocyclobutene (BCB) is formed on the spiral inductor pattern. A metal layer can be formed according to under bump metallization technique (UBM). The metal layer is either formed into a continuous spirally coiled form or a spread discrete configuration. With this structure, laser trimming can be applied to the metal layer pattern so as to acquire an ideal inductance value, thereby achieving wafer level trimming and compensating the process tolerance.
    Type: Application
    Filed: June 19, 2003
    Publication date: April 1, 2004
    Applicant: ASIA PACIFIC MICROSYSTEMS, INC.
    Inventors: Shang-Yu Liang, Shu-Hui Tsai, Chun-Hsien Lee, Chung-Hsien Lin
  • Publication number: 20040036569
    Abstract: A three dimensional adjustable high frequency inductor, its module and fabrication method of the same; the high frequency module comprises micro high frequency inductors, filters, resistors, capacitors and associated with active components or power components to form a hybrid circuit, then it is packaged by using the technology of flip chip or wafer level packaging, so as to upgrade properties of high frequency modules and reduce the packaging and instrumentation costs by minimizing the modular size.
    Type: Application
    Filed: August 20, 2002
    Publication date: February 26, 2004
    Applicant: Asia Pacific Microsystems, Inc.
    Inventors: Shu-Hui Tsai, Shang-Yu Liang, Chun-Hsien Lee
  • Patent number: 6690143
    Abstract: A power factor correction (PFC) circuit with a resonant snubber. The power factor correction (PFC) circuit has an input part (601) for receiving an AC voltage and outputting a first DC voltage; a main part (604) for converting the first DC voltage to a second DC voltage; and a snubber (500) for ensuring the main part operates in soft turn-on and soft turn-off. The main part (604) has a primary inductor and a primary diode connected in series, and a switch (606) connected to the connection node of the primary inductor and the primary diode. The snubber (500) has a cascaded device (a first diode and a resonant inductor connected in series) and a second diode connected in series, and a resonant capacitor connected between the connection node of the cascaded device and second diode, and the switch (606).
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: February 10, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Pao-Chuan Lin, Chun-Hsien Lee, Chih-Hsin Chen, Chung-Shing Tzou
  • Publication number: 20030107354
    Abstract: A power factor correction (PFC) circuit with a snubber (500). The snubber of the PFC circuit uses a resonant capacitor (503) in conjunction with a resonant inductor (and two diodes) to make the voltage across the switch (606) increases slowly when the switch becomes turn-off from a turn-on state so as to reducing the switch loss. The snubber (500) of the PFC circuit at least comprises: a cascaded device which at least is composed of a first diode (501) and a resonant inductor (502), a second diode (504) connected in series with the cascaded device, and a resonant capacitor (503) connected to the anode of the second diode (504).
    Type: Application
    Filed: July 19, 2002
    Publication date: June 12, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Pao-Chuan Lin, Chun-Hsien Lee, Chih-Hsin Chen, Chung-Shing Tzou
  • Publication number: 20030037876
    Abstract: A method and an apparatus are provided for bonding a coating to a web of cloth or foam without sacrificing the characteristics of the spandex mesh or foam. The coating and the cloth or foam are bonded and heated and then conveyed to an aspiration device for removing air between the coating and the cloth, thereby providing a thorough bonding therebetween.
    Type: Application
    Filed: August 27, 2001
    Publication date: February 27, 2003
    Inventor: Chun-Hsien Lee
  • Publication number: 20020124385
    Abstract: A micro-electro-mechanical high frequency switch and method for manufacturing the high frequency switch, comprising the steps of: providing a substrate; forming a metal transmission line and a driving electrode on the substrate; forming a dielectric layer on said metal transmission line and said driving electrode; forming a micro-electro-mechanical switch; forming driving electrodes on and beneath the micro-electro-mechanical switch; such that the driving voltage of high frequency switch is reduced, the insertion loss is lowered, the isolation is high, and the functions of high frequency switch is improved.
    Type: Application
    Filed: December 28, 2001
    Publication date: September 12, 2002
    Applicant: ASIA PACIFIC MICROSYSTEM, INC.
    Inventors: Shu-Hui Tsai, Cheng-Kuo Lee, Chung-Hsien Lin, Chun-Hsien Lee, Fan Kuan Jen
  • Patent number: 6073297
    Abstract: An automatic erasing device is used for erasing chalk marks on a writing board, and includes an erasing mechanism having an elongate housing adapted to be disposed frontwardly of and slidable relative to the writing board between left and right end portions along a longitudinal axis. The elongate housing extends in a transverse axis relative to the longitudinal axis, and has a rear wall formed with an elongate rear opening to confront the writing board. Upper and lower axles are journalled in the elongate housing parallel to the longitudinal axis. A transmitting belt is trained on the upper and lower axles under tension for movement along a rear route proximate to and in alignment with the elongate rear opening, and along a front route parallel to the rear route distal to the elongate rear opening. Several eraser members are mounted detachably on the transmitting belt.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: June 13, 2000
    Inventor: Chun-Hsien Lee