Patents by Inventor Chun-Kai Chiu

Chun-Kai Chiu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240174892
    Abstract: This disclosure relates to a polishing composition that includes an abrasive, at least two pH adjusters, a barrier film removal rate enhancer, a low-k removal rate inhibitor, and an azole-containing corrosion inhibitor. This disclosure also features a method of using the polishing composition to polish a substrate containing copper and silicon oxide.
    Type: Application
    Filed: November 21, 2023
    Publication date: May 30, 2024
    Inventors: Ting-Kai Huang, Yannan Liang, Bin Hu, Chun-Fu Chen, Ying-Shen Chuang, Tzu-Wei Chiu, Sung TsaiLin, Hanyu Fan, Hsin-Hsien Lu
  • Patent number: 11990507
    Abstract: A high voltage transistor structure including a substrate, a first isolation structure, a second isolation structure, a gate structure, a first source and drain region, and a second source and drain region is provided. The first isolation structure and the second isolation structure are disposed in the substrate. The gate structure is disposed on the substrate, at least a portion of the first isolation structure, and at least a portion of the second isolation structure. The first source and drain region and the second source and drain region are located in the substrate on two sides of the first isolation structure and the second isolation structure. The depth of the first isolation structure is greater than the depth of the second isolation structure.
    Type: Grant
    Filed: August 16, 2021
    Date of Patent: May 21, 2024
    Assignee: United Microelectronics Corp.
    Inventors: Chin-Hung Chen, Ssu-I Fu, Chih-Kai Hsu, Chun-Ya Chiu, Chia-Jung Hsu, Yu-Hsiang Lin
  • Publication number: 20240162114
    Abstract: A power module including at least one power device, an insulation thermally conductive layer, and a heat dissipation device is provided. The insulation thermally conductive layer has a patterned circuit layer. The power device is disposed on the patterned circuit layer and is electrically connected to the patterned circuit layer. The heat dissipation device includes a heat dissipation plate and a heat dissipation base. The heat dissipation plate has a first surface and a second surface opposite to each other, and the insulation thermally conductive layer is disposed on the first surface. The heat dissipation base is partially bonded to the heat dissipation plate, and a chamber is formed between the heat dissipation plate and the heat dissipation bases. The heat dissipation base has a plurality of first heat dissipation bumps located in the chamber.
    Type: Application
    Filed: February 9, 2023
    Publication date: May 16, 2024
    Applicant: Industrial Technology Research Institute
    Inventors: Shian-Chiau Chiou, Chun-Kai Liu, Po-Kai Chiu, Chih-Ming Tzeng, Yao-Shun Chen
  • Publication number: 20240128127
    Abstract: A semiconductor device includes a single diffusion break (SDB) structure dividing a fin-shaped structure into a first portion and a second portion, an isolation structure on the SDB structure, a first spacer adjacent to the isolation structure, a metal gate adjacent to the isolation structure, a shallow trench isolation (STI around the fin-shaped structure, and a second isolation structure on the STI. Preferably, a top surface of the first spacer is lower than a top surface of the isolation structure and a bottom surface of the first spacer is lower than a bottom surface of the metal gate.
    Type: Application
    Filed: December 28, 2023
    Publication date: April 18, 2024
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chih-Kai Hsu, Ssu-l Fu, Chun-ya Chiu, Chi-Ting Wu, Chin-HUNG Chen, Yu-Hsiang Lin
  • Patent number: 8054617
    Abstract: This invention discloses a desktop computer and a method for manufacturing the same. The desktop computer includes a display device and a main body. The display device has a display side and a back side. One end of the main body is connected to the back side of the display device. The other end of the main body and the display device contact a surface where the desktop computer is disposed. The angle between the main body and the display device is adjustable.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: November 8, 2011
    Assignee: Pegatron Corporation
    Inventors: Yen Kuang, Chi-Sheng Yin, Jeffery Lai, Yen-De Wu, Tsai-Feng Hsiang, Chien-Hung Yeh, Chen-Han Sung, Chun-Kai Chiu
  • Publication number: 20090303675
    Abstract: This invention discloses a desktop computer and a method for manufacturing the same. The desktop computer includes a display device and a main body. The display device has a display side and a back side. One end of the main body is connected to the back side of the display device. The other end of the main body and the display device contact a surface where the desktop computer is disposed. The angle between the main body and the display device is adjustable.
    Type: Application
    Filed: May 29, 2009
    Publication date: December 10, 2009
    Inventors: Yen Kuang, Chi-Sheng Yin, Jeffery Lai, Yen-De Wu, Tsai-Feng Hsiang, Chien-Hung Yeh, Chen-Han Sung, Chun-Kai Chiu
  • Patent number: D599791
    Type: Grant
    Filed: July 31, 2008
    Date of Patent: September 8, 2009
    Assignee: Pegatron Corporation
    Inventors: Yen Kuang, Chi-Sheng Yin, Jeffery Lai, Yen-De Wu, Tsai-Feng Hsiang, Chien-Hung Yeh, Chen-Han Sung, Chun-Kai Chiu