Patents by Inventor Chun Lan

Chun Lan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160076348
    Abstract: A method of increasing a thermal conductivity of a subterranean formation and a hydrocarbon-containing material comprises introducing nanoparticles having a high thermal conductivity into the subterranean formation. The nanoparticles adhere to surfaces of the hydrocarbon-containing material and increase the thermal conductivity of the hydrocarbon-containing material. A heating fluid is injected into the subterranean formation and contacts the nanoparticles. Heat is transferred to hydrocarbons of the hydrocarbon-containing material and reduces a viscosity of the hydrocarbons. Methods of transferring heat to a hydrocarbon-containing material, as well as methods of recovering hydrocarbons from a subterranean formation are also disclosed.
    Type: Application
    Filed: September 12, 2014
    Publication date: March 17, 2016
    Inventors: Fermin Fernandez-Ibanez, Ashley L. Christian, Chun Lan, Jeffrey J. Krimmel, Jacob D. Gibson, Bernhard Meyer-Heye
  • Publication number: 20150277519
    Abstract: An electrical device having thermal isolation function includes a housing, a heat-generating source, a heat-conductive member, and a thermal isolation plate. The housing includes an accommodation space therein, an inner surface and an outer surface which is opposite to the inner surface. The heat-generating source is disposed in the accommodation space. The heat-conductive member is disposed in the accommodation space, and is in contact with the heat-generating source. The thermal isolation plate is disposed between the heat-conductive member and the inner surface of the housing, and the thermal isolation plate is formed with a vacuum camber therein.
    Type: Application
    Filed: October 21, 2014
    Publication date: October 1, 2015
    Applicant: QUANTA COMPUTER INC.
    Inventors: Sung-Fong YANG, Chang-Chun LAN, Yu-Nien HUANG, Shun-Ta YU, Wei-Che YEH
  • Publication number: 20150145073
    Abstract: Systems and methods are provided for fabricating a semiconductor structure including sidewall spacers. An example semiconductor structure includes: a gate structure, a first sidewall spacer, and a second sidewall spacer. The gate structure is formed over a substrate. The first sidewall spacer is adjacent to the gate structure, a top part of the first sidewall spacer including a first dielectric material, a bottom part of the first sidewall spacer including a second dielectric material. The second sidewall spacer is adjacent to the first sidewall spacer, the second sidewall spacer including a third dielectric material.
    Type: Application
    Filed: November 26, 2013
    Publication date: May 28, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: WEI-YANG LEE, CHIA-CHUN LAN
  • Patent number: 9000098
    Abstract: Polymer spheres are fabricated. Dispersing polymerization and a two-stage swelling procedure are processed. The polymer spheres fabricated have uniform granular sizes and are highly cross-linking. Thus, the polymer spheres are heat-resistant and solvent-resistant.
    Type: Grant
    Filed: May 14, 2012
    Date of Patent: April 7, 2015
    Assignee: Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense
    Inventors: Ming-Hsiung Wei, Yu-Wei Hou, Hui Chen, Chun-Lan Tseng
  • Publication number: 20150059662
    Abstract: A portable engine-generator is described having an engine and a generator coupled to the engine. An engine mount has a mounting plate coupled to the engine and also includes a frame. An outer housing surrounds the engine, generator and frame. At least one handle is coupled to the outer housing. The housing is defined in three sections; a lower section, a middle section and an upper section. The three housing sections are coupled to the frame.
    Type: Application
    Filed: August 29, 2014
    Publication date: March 5, 2015
    Inventors: Chun LAN, Paul J. JOHNSON, Kevin A. McNUTT, Michael J. DRESEN
  • Patent number: 8957452
    Abstract: A light emitting diode (LED) structure includes a substrate, an LED element, a reverse current protection element, a third conductor, and a fourth conductor. The LED element includes a first N-type semiconductor layer, a first lighting layer, a first P-type semiconductor layer, a first transparent conductive layer, a first electrode, and a second electrode. The reverse current protection element is located on the substrate and surrounds the LED element. The reverse current protection element includes a stack layer, a first conductor, and a second conductor. The stack layer is formed on the substrate by sequentially stacking a second N-type semiconductor layer, a second lighting layer, and a second P-type semiconductor layer. The third conductor is electrically connected to the first conductor and the second electrode. The fourth conductor is electrically connected to the second conductor and the first electrode.
    Type: Grant
    Filed: February 25, 2014
    Date of Patent: February 17, 2015
    Assignee: Lextar Electronics Corporation
    Inventors: Cheng-Chun Lan, Tzu-Hung Chou, Chi-Chung Chao
  • Patent number: 8942473
    Abstract: A method and an apparatus for processing an image are provided. A buffer is provided and separated into a series of storage units. Each storage unit has a fixed size. The image is divided into pixel groups, and each pixel group corresponds to one storage unit. Each pixel group is compressed by one of candidate compression methods to obtain compressed data so that the compressed data of each pixel group fits the corresponding storage unit.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: January 27, 2015
    Inventors: Ko Hung Lin, Yen Chuo, Yin Chun Lan
  • Publication number: 20140374767
    Abstract: A light emitting diode (LED) structure includes a substrate, an LED element, a reverse current protection element, a third conductor, and a fourth conductor. The LED element includes a first N-type semiconductor layer, a first lighting layer, a first P-type semiconductor layer, a first transparent conductive layer, a first electrode, and a second electrode. The reverse current protection element is located on the substrate and surrounds the LED element. The reverse current protection element includes a stack layer, a first conductor, and a second conductor. The stack layer is formed on the substrate by sequentially stacking a second N-type semiconductor layer, a second lighting layer, and a second P-type semiconductor layer. The third conductor is electrically connected to the first conductor and the second electrode. The fourth conductor is electrically connected to the second conductor and the first electrode.
    Type: Application
    Filed: February 25, 2014
    Publication date: December 25, 2014
    Applicant: Lextar Electronics Corporation
    Inventors: Cheng-Chun LAN, Tzu-Hung CHOU, Chi-Chung CHAO
  • Publication number: 20140377899
    Abstract: A light emitting diode chip manufacturing method includes the following steps: a substrate is provided. A first semiconductor layer is formed on the substrate. A light-emitting layer is formed on a portion of the first semiconductor layer, and the surface of the first semiconductor layer not covered by the light-emitting layer is exposed. A second semiconductor layer is formed on the light-emitting layer. A hard shielding layer is formed on the second semiconductor layer and the exposed surface of the first semiconductor layer, such that a multi-layer stacked structure is formed on the substrate. A cutting treatment is performed. An etching treatment is performed. The hard shielding layer is patterned to form a current blocking layer on the second semiconductor layer, and the current blocking layer is made of the hard shielding layer.
    Type: Application
    Filed: December 30, 2013
    Publication date: December 25, 2014
    Applicant: Lextar Electronics Corporation
    Inventors: Tzu Hung CHOU, Cheng Chun LAN, Chi Chung CHAO
  • Patent number: 8831885
    Abstract: NMR porosity measurements made in a gas free-formation are used to calibrate acoustic measurements. The calibration parameters are then used in conjunction with estimates of shale content to provide improved estimates of formation porosity in shaly intervals which may include a gas.
    Type: Grant
    Filed: October 6, 2011
    Date of Patent: September 9, 2014
    Assignee: Baker Hughes Incorporated
    Inventors: Chun Lan, Songhua Chen, Fabio Brambilla
  • Publication number: 20140126140
    Abstract: A removable computer component module includes a plurality of drive trays each adapted for receiving a computer component. Each of the plurality of drive trays includes front and back ends at two lateral opposite ends thereof, two first and two second engaging portions arranged at two vertical opposite ends thereof. The two first and two second engaging portions horizontally extended from the front end to the back end. The two first engaging portions of one of the plurality of drive trays are engageable with the second engaging portions of the other of the plurality of drive trays to form a vertical array without tools.
    Type: Application
    Filed: February 6, 2013
    Publication date: May 8, 2014
    Applicant: ISG INDUSTRIAL CO., INC.
    Inventors: Kuo-Hsin Wang, Chun-Lan Hsiao
  • Patent number: D704231
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: May 6, 2014
    Inventor: Chun Lan Chen
  • Patent number: D704232
    Type: Grant
    Filed: July 16, 2013
    Date of Patent: May 6, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714831
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714832
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714833
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714834
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714835
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D714836
    Type: Grant
    Filed: May 30, 2014
    Date of Patent: October 7, 2014
    Inventor: Chun Lan Chen
  • Patent number: D731558
    Type: Grant
    Filed: July 15, 2014
    Date of Patent: June 9, 2015
    Inventor: Chun Lan Chen