Abstract: A blood pressure detection device manufactured by a semiconductor process includes a substrate, a microelectromechanical element, a gas-pressure-sensing element, a driving-chip element, an encapsulation layer and a valve layer. The substrate includes inlet apertures. The microelectromechanical element and the gas-pressure-sensing element are stacked and integrally formed on the substrate. The encapsulation layer is encapsulated and positioned on the substrate. A flowing-channel space is formed above the microelectromechanical element and the gas-pressure-sensing element. The encapsulation layer includes an outlet aperture in communication with an airbag. The driving-chip element controls the microelectromechanical element, the gas-pressure-sensing element and valve units to transport gas.

Abstract: A blood pressure device includes a first blood pressure measuring device, a second blood pressure measuring device, and a controller. The first blood pressure measuring device is to be worn on a first position of a wrist so as to obtain a first blood pressure information of the first position. The second blood pressure measuring device is to be worn on a second position of the wrist so as to obtain a second blood pressure information of the second position. The controller is electrically coupled to the first blood pressure measuring device and the second blood pressure measuring device so as to adjust tightness between the expanders and the user's skin, respectively. The controller receives, processes, and calculates a pulse transit time between the first blood pressure information and the second blood pressure information, and the controller obtains at least one blood pressure value based on the pulse transit time.

Abstract: A transparent display panel with driving electrode regions, circuit wiring regions, and optically transparent regions is provided. The driving electrode regions are arranged into an array in a first direction and a second direction. An average light transmittance of the circuit wiring regions is less than ten percent, and an average light transmittance of the optically transparent regions is greater than that of the driving electrode regions and the circuit wiring regions. The first direction intersects the second direction. The circuit wiring regions connect the driving electrode regions at intervals, such that each optically transparent region spans among part of the driving electrode regions. The transparent display panel includes first signal lines and second signal lines extending along the circuit wiring regions, and each circuit wiring region is provided with at least one of the first signal lines and at least one of the second signal lines.

Abstract: An integrated circuit package system includes a substrate, a plurality of leads, N semiconductor devices, N first heat sinks, an encapsulating body, a second heat sink and a plurality of heat-dissipating fins protruding upward from the second heat sink, where N is a natural number. The leads are formed on a lower surface of the substrate. Each of the semiconductor devices is attached on an upper surface of the substrate, and includes a plurality of bonding pads which each is electrically connected to the corresponding lead. Each first heat sink is thermally coupled to a first top surface of the corresponding semiconductor device. The encapsulating body is formed to cover the substrate, the N semiconductor devices and the N first heat sinks such that the leads are exposed. The second heat sink is mounted on the encapsulating body, and is thermally coupled to the N first heat sinks.

Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.

Abstract: A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.

Abstract: A MEMS transducing apparatus includes a substrate, a conductive pad, a stacked structure of a transducing device, a first polymer layer, a second polymer layer and a third polymer layer. An upper cavity is formed through the substrate. The conductive pad is formed on a first surface of the substrate to cover a first opening of the upper cavity. The stacked structure of the transducing device is formed on the conductive pad. The first polymer layer is formed on the first surface of the substrate. A lower cavity is formed through the first polymer layer. The stacked structure of the transducing device is exposed within the lower cavity. The third polymer layer is formed on a second surface of the substrate to cover a second opening of the upper cavity. The second polymer layer is formed on the first polymer layer to cover a third opening of the lower cavity.

Abstract: A method for electrolysis of water and a method for preparing a catalyst for electrolysis of water are provided. The method for electrolysis of water includes using a high entropy alloy as a catalyst. Further, the method for preparing a catalyst for electrolysis of water includes the steps of placing a substrate in an aqueous electrolyte containing a high entropy alloy precursor and performing an electroplating process on the substrate to form a high entropy alloy catalyst on the substrate.

Abstract: A mirror display module including a first substrate, pixel units, a second substrate, a display medium layer, a reflection pattern, a third substrate, an electrochromic material layer, a first transparent electrode, and a second transparent electrode is provided. The pixel units are disposed on the first substrate. The second substrate is disposed opposite to the first substrate. The display medium layer is located between the first substrate and the second substrate. The reflection pattern is located between the second substrate and the display medium layer. The reflection pattern has a plurality of openings, and the plurality of openings is overlapped with at least a portion of the plurality of pixel units. The second substrate is located between the third substrate and the first substrate. The electrochromic material layer is located between the third substrate and the second substrate. The first transparent electrode is located between the third substrate and the electrochromic material layer.

Abstract: A method of forming a semiconductor device structure includes: forming a first conductive structure over a substrate, the first conductive structure including twin boundaries; and wherein the forming the first conductive structure includes manipulating process conditions so as to promote formation of the twin boundaries resulting in a promoted density of twin boundaries such that the first conductive structure has an increased failure current density (FCD) relative to a baseline FCD of an otherwise substantially corresponding second conductive structure which has an unpromoted density of twin boundaries, the unpromoted density being less than the promoted density and such that the first conductive structure has a resistance which is substantially the same as the second conductive structure.

Abstract: A mirror display module including a first substrate, pixel units, a second substrate, a display medium layer, a reflection pattern, a third substrate, an electrochromic material layer, a first transparent electrode, and a second transparent electrode is provided. The pixel units are disposed on the first substrate. The second substrate is disposed opposite to the first substrate. The display medium layer is located between the first substrate and the second substrate. The reflection pattern is located between the second substrate and the display medium layer. The reflection pattern has a plurality of openings, and the plurality of openings is overlapped with at least a portion of the plurality of pixel units. The second substrate is located between the third substrate and the first substrate. The electrochromic material layer is located between the third substrate and the second substrate. The first transparent electrode is located between the third substrate and the electrochromic material layer.

Abstract: A method, for forming a semiconductor device structure, includes: forming a conductive structure over a substrate, wherein the conductive structure includes twin boundaries. The forming the conductive structure includes: manipulating process conditions so as to promote formation of the twin boundaries and yet control a density of the twin boundaries to be outside a range for which a portion of a curve is an asymptote of a constant value, the curve representing values of an atomic migration ratio corresponding to values of the density of the twin boundaries.

Abstract: A multi-sensing system, a portable electronic device, and a touch-sensing method are provided. The multi-sensing system includes a sensing sheet and a carrier. The sensing sheet includes a substrate, and a touch-sensing circuit and a force-sensing circuit disposed on the substrate, wherein an orthogonal projection of the force-sensing circuit on the substrate and an orthogonal projection of the touch-sensing circuit on the substrate are misaligned from each other. The carrier has a carrying space and a carrying shoulder adjacent to the carrying space, wherein the carrier carries the sensing sheet with the carrying shoulder. The carrying space is used to accommodate a display element. The touch-sensing circuit is located above the display element.

Abstract: A method of forming a semiconductor device structure includes: forming a first conductive structure over a substrate, the first conductive structure including twin boundaries; and wherein the forming the first conductive structure includes manipulating process conditions so as to promote formation of the twin boundaries resulting in a promoted density of twin boundaries such that the first conductive structure has an increased failure current density (FCD) relative to a baseline FCD of an otherwise substantially corresponding second conductive structure which has an unpromoted density of twin boundaries, the unpromoted density being less than the promoted density and such that the first conductive structure has a resistance which is substantially the same as the second conductive structure.

Abstract: A multi-sensing system, a portable electronic device, and a touch-sensing method are provided. The multi-sensing system includes a sensing sheet and a carrier. The sensing sheet includes a substrate, and a touch-sensing circuit and a force-sensing circuit disposed on the substrate, wherein an orthogonal projection of the force-sensing circuit on the substrate and an orthogonal projection of the touch-sensing circuit on the substrate are misaligned from each other. The carrier has a carrying space and a carrying shoulder adjacent to the carrying space, wherein the carrier carries the sensing sheet with the carrying shoulder. The carrying space is used to accommodate a display element. The touch-sensing circuit is located above the display element.

Abstract: A plug connector is adapted to be connected to a receptacle connector. The plug connector includes an insulation body, a plurality of terminals and a metal housing. The terminals are fixed in the insulation body. The metal housing wraps the insulation body and the terminals and has a mating end. The insulation body and the metal housing construct a slot, which is adapted to couple a tongue portion of the receptacle connector. These terminals extend to the slot. The insulation body extends outward to the mating end from internal of the metal housing to cover at least a part of the mating end. Moreover, an electronic assembly including an electronic apparatus and the plug connector is also provided.

Abstract: A laminated electric core for a lithium-ion battery includes a first current collecting substrate; a first electrode active material layer coated on an inner surface of the first current collecting substrate; a second current collecting substrate; a second electrode active material layer coated on an inner surface of the second current collecting substrate; a separator sandwiched between the first electrode active material layer and the second electrode active material layer, wherein an electrolyte is retained at least in the separator; an adhesive layer between the first electrode active material layer and the separator; a first sealant layer on the inner surface of the first current collecting substrate along peripheral edges of the first electrode active material layer; and a second sealant layer on the inner surface of the second current collecting substrate along peripheral edges of the second electrode active material layer.

Abstract: A method, for forming a semiconductor device structure, includes: forming a conductive structure over a substrate, wherein the conductive structure includes twin boundaries. The forming the conductive structure includes: manipulating process conditions so as to promote formation of the twin boundaries and yet control a density of the twin boundaries to be outside a range for which a portion of a curve is an asymptote of a constant value, the curve representing values of an atomic migration ratio corresponding to values of the density of the twin boundaries.

Abstract: A thin film lithium-ion battery unit includes a positive current collecting substrate, a positive electrode active material layer on an inner surface of the positive current collecting substrate, a negative current collecting substrate, a negative electrode active material layer on an inner surface of the negative current collecting substrate, a separator between the positive electrode active material layer and the negative electrode active material layer, and electrolyte retained at least in the separator. The positive electrode active material layer, the separator and the negative electrode active material layer constitute a laminated electric core. An outer conductive frame is spaced apart from the positive current collecting substrate and encompasses the positive current collecting substrate.

Abstract: A semiconductor device structure with twin-boundaries and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive structure formed over the substrate. The conductive structure includes twin boundaries, and a density of the twin boundaries is in a range from about 25 ?m?1 to about 250 ?m?1.