Patents by Inventor Chun-Lung Su
Chun-Lung Su has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979971Abstract: An extreme ultra violet (EUV) radiation source apparatus includes a collector mirror, a target droplet generator for generating a tin (Sn) droplet, a rotatable debris collection device, one or more coils for generating an inductively coupled plasma (ICP), a gas inlet for providing a source gas for the ICP, and a chamber enclosing at least the collector mirror and the rotatable debris collection device. The gas inlet and the one or more coils are configured such that the ICP is spaced apart from the collector mirror.Type: GrantFiled: April 10, 2019Date of Patent: May 7, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yen-Shuo Su, Chun-Lin Chang, Han-Lung Chang, Li-Jui Chen, Po-Chung Cheng
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Patent number: 11429162Abstract: A power supply housing adapted to a redundant power module includes a casing, a separation member, two front plates and a back plate. The casing includes four side plates and an installation space defined by the side plates. The separation member divides the installation space into a first sub-space and a second sub-space, and includes two first baffles located in the first sub-space and two second baffles located in the second sub-space. The two first baffles define a first installation region for disposing a redundant power module, and the two second baffles define a second installation region for disposing the redundant power module. The front plates are disposed on one end of the installation space and define a placement opening, serving as an entrance of the first and the second installation region. The back plate is disposed on one end of the installation space not provided with the front plates.Type: GrantFiled: January 13, 2020Date of Patent: August 30, 2022Assignee: ZIPPY TECHNOLOGY CORP.Inventors: Chun-Lung Su, Tzung-Han Lee
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Publication number: 20210216115Abstract: A power supply housing adapted to a redundant power module includes a casing, a separation member, two front plates and a back plate. The casing includes four side plates and an installation space defined by the side plates. The separation member divides the installation space into a first sub-space and a second sub-space, and includes two first baffles located in the first sub-space and two second baffles located in the second sub-space. The two first baffles define a first installation region for disposing a redundant power module, and the two second baffles define a second installation region for disposing the redundant power module. The front plates are disposed on one end of the installation space and define a placement opening, serving as an entrance of the first and the second installation region. The back plate is disposed on one end of the installation space not provided with the front plates.Type: ApplicationFiled: January 13, 2020Publication date: July 15, 2021Inventors: Chun-Lung SU, Tzung-Han LEE
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Publication number: 20190075679Abstract: A power supply module with enhanced heat dissipation effect includes a rack including an opening and an accommodating room connected to the opening, as well as at least one power supply including a fitting section inserted from the opening while positioned within the accommodating room, and a heat dissipation section extending toward the outside of the opening from the opening, in which the power supply is formed in the heat dissipation section with a plurality of heat dissipation holes, in such a way that air is capable of entering the power supply from an output end to form heat convection together with the dissipation holes, so as to form a heat dissipation effect with respect to the power supply.Type: ApplicationFiled: September 6, 2017Publication date: March 7, 2019Inventors: Chin-Wen CHOU, Yung-Hsin HUANG, Yu-Yuan CHANG, Chun-Lung SU, Yung-Feng CHIU, Chih-Hao CHEN
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Patent number: 9451721Abstract: A modular redundant power supply includes a casing, a power integration panel, a plurality of power supply modules and a power regulation module. The casing has an installation space defined into a first installation zone and a second installation zone. The power integration panel is located in the installation space. The power supply modules are installed on the first installation zone and connected to the power integration panel. Each power supply module outputs a duty power to the power integration panel after being started. The power regulation module gets the duty power from the power integration panel and regulates thereof to generate an auxiliary duty power output to the power integration panel so that the power integration panel can supply the duty power and the auxiliary duty power to an external device.Type: GrantFiled: April 27, 2015Date of Patent: September 20, 2016Assignee: ZIPPY TECHNOLOGY CORP.Inventors: Tsun-Te Shih, Yu-Yuan Chang, Heng-Chia Chang, Chun-Lung Su
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Publication number: 20140070616Abstract: A power conversion output architecture applied to a redundant power supply system comprises a power integration panel and a power regulation output panel. The power integration panel includes a first integration circuit receiving primary power from a plurality of power supplies and integrating them into primary power integration, and a second integration circuit receiving standby power from the power supplies and integrating them into standby power integration. The power regulation output panel includes a power regulation circuit receiving the primary power integration and converting it into a secondary power, a first output circuit receiving and outputting the secondary power, a second output circuit receiving and outputting the primary power integration, a third output circuit receiving and outputting the standby power integration, and a power administration unit detecting the status of the primary power integration, the standby power integration and the secondary power.Type: ApplicationFiled: September 11, 2012Publication date: March 13, 2014Inventors: Tsun-Te Shih, Yu-Yuan Chang, Chun-Lung Su, Heng-Chia Chang
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Patent number: 8611071Abstract: A power supply structure of a multi-power-supply system which is electrically connected to at least one power supply to get an output power provided by the power supply. The multi-power-supply system includes a power integration back panel and a casing. The power integration back panel is electrically connected to a DC output port and has at least one output cord to receive the power provided by the power supply. The casing has a housing compartment to hold the power integration back panel, an opening for loading the power supply into the housing compartment, and at least one partition to divide the housing compartment to form a space to hold the power supply, a wiring space threaded through by the output cord, and a power supply port exposed outside the surface of the casing to electrically connect to the output cord.Type: GrantFiled: September 23, 2011Date of Patent: December 17, 2013Assignee: Zippy Technology Corp.Inventors: Chun-Lung Su, Yi-Wen Lin
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Publication number: 20130077209Abstract: A power supply structure of a multi-power-supply system which is electrically connected to at least one power supply to get an output power provided by the power supply. The multi-power-supply system includes a power integration back panel and a casing. The power integration back panel is electrically connected to a DC output port and has at least one output cord to receive the power provided by the power supply. The casing has a housing compartment to hold the power integration back panel, an opening for loading the power supply into the housing compartment, and at least one partition to divide the housing compartment to form a space to hold the power supply, a wiring space threaded through by the output cord, and a power supply port exposed outside the surface of the casing to electrically connect to the output cord.Type: ApplicationFiled: September 23, 2011Publication date: March 28, 2013Inventors: Chun-Lung Su, Yi-Wen Lin
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Patent number: 7675749Abstract: A heat dissipating structure of a 1U power supply is installed in an industrial computer host system of a universal standard specification 1U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk.Type: GrantFiled: December 12, 2007Date of Patent: March 9, 2010Assignee: Zippy Technology Corp.Inventor: Chun-Lung Su
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Publication number: 20090154090Abstract: A heat dissipating structure of a 1 U power supply is installed in an industrial computer host system of a universal standard specification 1 U for supplying electric power, and at least one wall of the power supply differentiates a retaining plane and a heat dissipating plane having a heat dissipating hole with a height difference, and a horizontal plane of the heat dissipating plane is lower than the retaining plane and forms an airflow passage with the computer host system for guiding a heat dissipated airflow through the airflow passage to improve the poor heat dissipation at both distal ends of the traditional 1 U power supply due to the same height of the power supply and the computer host system or the proximity of both sides of the power supply with an installed electronic device such as a hard disk.Type: ApplicationFiled: December 12, 2007Publication date: June 18, 2009Inventor: Chun-Lung SU
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Patent number: 7397670Abstract: A power supply device equipped with AC and DC power supply structures aims to separate an AC connection structure and a DC connection structure of the power supply device of a given size specification to replace the conventional DC and AC connection structures that are coupled on a single connection board so that the DC connection board may be extended to the maximum width of the power supply device specification to increase output legs and maximize the output power of the power supply device.Type: GrantFiled: July 13, 2004Date of Patent: July 8, 2008Assignee: Zippy Technology Corp.Inventor: Chun-Lung Su
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Publication number: 20060057865Abstract: An electric output structure for a multi-layer power supply to integrate electricity for electric processing circuits of a plurality of power supply devices connected electrically to a circuit board. The electric output structure includes an electric bridge which has terminals electrically connecting to the electric processing circuits and a linking section connecting to the terminals. The terminals or linking section has at least one fastening section fastenable to a corresponding coupling section of a fastening terminal formed on a power cord through a retaining member. Thus the power supply connection ports on the circuit board may be increased without adding the electrical coupling circuit to facilitate changing of the power cord.Type: ApplicationFiled: September 14, 2004Publication date: March 16, 2006Inventors: Yung-Hsin Huang, Chun-Lung Su
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Publication number: 20060013027Abstract: A power supply device equipped with AC and DC power supply structures aims to separate an AC connection structure and a DC connection structure of the power supply device of a given size specification to replace the conventional DC and AC connection structures that are coupled on a single connection board so that the DC connection board may be extended to the maximum width of the power supply device specification to increase output legs and maximize the output power of the power supply device.Type: ApplicationFiled: July 13, 2004Publication date: January 19, 2006Inventor: Chun-Lung Su
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Patent number: 6935880Abstract: A coupling fixture for inserting power supply input sockets includes a coupling frame to couple with a power cord latch clip when an inserting power supply input socket is inserted in a power supply. The coupling frame is sandwiched between the receptacle of the power supply input socket and the power supply, and has an opening to receive the body of the power supply input socket and anchor flanges extended from two sides that have respectively an anchor bore to couple with the power cord latch clip thereby to overcome the problems occurred to the conventional power cord coupling fixtures used on the inserting power supply input sockets.Type: GrantFiled: May 28, 2004Date of Patent: August 30, 2005Assignee: Zippy Technology Corp.Inventor: Chun-Lung Su
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Patent number: 6801435Abstract: An improved fixing structure for power supplies defines an accommodating area on a power supply for installing a fixing structure, and the power supply has a fixing hole on a casing of the power supply defining a limit fixing condition for the fixing structure when the power supply is pushed into the casing, and the power supply has a limit hole for installing a limit fixing member to restrict the displacement of the fixing structure, and constitutes a fixing structure that can be installed directly inside a power supply without occupying additional space, and attains the effects of fixing two fixing structures and limiting the fixing member.Type: GrantFiled: May 14, 2003Date of Patent: October 5, 2004Assignee: Zippy Technology Corp.Inventors: Chun-Lung Su, Tzung-Han Lee, Hsien-Tang Weng
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Patent number: D488776Type: GrantFiled: May 16, 2003Date of Patent: April 20, 2004Assignee: Zippy Technology Corp.Inventors: Chun-Lung Su, Tzung-Han Lee, Hsien-Tang Weng
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Patent number: D852151Type: GrantFiled: October 3, 2017Date of Patent: June 25, 2019Assignee: ZIPPY TECHNOLOGY CORP.Inventors: Chin-Wen Chou, Yung-Hsin Huang, Yu-Yuan Chang, Yung-Feng Chiu, Chun-Lung Su, Chih-Hao Chen