Patents by Inventor Chun-Man Chan

Chun-Man Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of Manufacturing a Semiconductor Package, Such Semiconductor Package as well as an Electronic System Comprising a PCB Element and at Least Such Semiconductor Package
    Publication number: 20240120247
    Abstract: A method of manufacturing a semiconductor package is provided, with an integrated heatsink and electrical connection feature. The semiconductor die can be attached to the terminal using eutectic bonding, preferably CuSn eutectic, Ag containing adhesives or Ag sintering material. These bondings are lead (Pb) free connection methods, which make the finished semiconductor package RoHS compliant (restriction of hazardous materials).
    Type: Application
    Filed: October 6, 2023
    Publication date: April 11, 2024
    Applicant: NEXPERIA B.V.
    Inventors: Regnerus Hermannus Poelma, Wai Man Wong, Tim Böttcher, Hans-Juergen Funke, Jannik Entringer, Yuet Keung Cheung, Chun Ning Chan
  • Process for electroless plating and a solution used for the same
    Patent number: 9783890
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: October 10, 2017
    Assignee: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
  • Process for electroless plating and a solution used for the same
    Patent number: 9499910
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Grant
    Filed: July 21, 2015
    Date of Patent: November 22, 2016
    Inventors: Dennis Kwok-Wai Yee, Michael Chi-Yung Tang, Martin W. Bayes, Ka-Ming Yip, Chun-Man Chan, Hung-Tat Chan, Tsui-Kiu Li, Lok-Lok Liu
  • PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
    Publication number: 20150322574
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Dennis Kwok-Wai YEE, Michael Chi-Yung TANG, Martin W. BAYES, Ka-Ming YIP, Chun-Man CHAN, Hung-Tat CHAN, Tsui-Kiu LI, Lok-Lok LIU
  • PROCESS FOR ELECTROLESS PLATING AND A SOLUTION USED FOR THE SAME
    Publication number: 20140120263
    Abstract: A process of pretreatment for selective application of electroless metallization to a surface of a non-conductive material and a solution useful for the pretreatment are provided. The process achieves good coverage in areas to be plated on the surface of non-conductive materials without skip plating or over plating.
    Type: Application
    Filed: October 26, 2012
    Publication date: May 1, 2014
    Applicant: ROHM AND HAAS ELECTRONIC MATERIALS LLC
    Inventors: Dennis Kwok-Wai YEE, Michael Chi-Yung TANG, Martin W. BAYES, Ka-Ming YIP, Chun-Man CHAN, Hung-Tat CHAN, Tsui-Kiu LI, Lok-Lok LIU
  • Combined knife, fork, and spoon set
    Patent number: D284442
    Type: Grant
    Filed: March 6, 1984
    Date of Patent: July 1, 1986
    Assignee: Space Lab (H.K.) Enterprises Limited
    Inventor: Chun-Man Chan