Patents by Inventor Chun-Ou LIU

Chun-Ou LIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for curing flowable layer
    Patent number: 9543141
    Abstract: Methods for forming a semiconductor structure are provided. The method for forming a semiconductor structure includes forming a flowable layer over a substrate and heating the flowable layer to form a cured layer in a curing process. In addition, the curing process is performed under a pressure of over 2 atmospheres, and the flowable layer reacts with precursors in the flowable layer during the curing process.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: January 10, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Chi-Ming Liao, Ker-Hsun Liao, Chun-Ou Liu, Su-Horng Lin
  • METHOD FOR CURING FLOWABLE LAYER
    Publication number: 20160163540
    Abstract: Methods for forming a semiconductor structure are provided. The method for forming a semiconductor structure includes forming a flowable layer over a substrate and heating the flowable layer to form a cured layer in a curing process. In addition, the curing process is performed under a pressure of over 2 atmospheres, and the flowable layer reacts with precursors in the flowable layer during the curing process.
    Type: Application
    Filed: December 9, 2014
    Publication date: June 9, 2016
    Inventors: Chi-Ming LIAO, Ker-Hsun LIAO, Chun-Ou LIU, Su-Horng LIN