Patents by Inventor Chun-Pin Wu

Chun-Pin Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11913981
    Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 27, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mean-Jue Tung, Ming-Da Yang, Shi-Yuan Tong, Yu-Ting Huang, Chun-Pin Wu
  • Publication number: 20230225096
    Abstract: The present disclosure provides an electromagnetic wave absorbing material, including a core containing iron oxide having a first thermal expansion coefficient; and a shell layer covering the core, which has a second thermal expansion coefficient less than the first thermal expansion coefficient, and the shell layer contains an inorganic compound selected from a group consisting of oxides, nitrides or any combination thereof. The present disclosure further provides a composite structure for suppressing electromagnetic interference including the electromagnetic wave absorbing material as claimed.
    Type: Application
    Filed: December 29, 2022
    Publication date: July 13, 2023
    Inventors: Chun-Pin WU, Mean-Jue TUNG, Shi-Yuan TONG, Wen-Song KO, Yu-Ting HUANG
  • Patent number: 11573277
    Abstract: An electromagnetic property measuring device includes a magnetic conductive structure, a coil, and a scattering parameter measuring unit. The magnetic conductive structure includes a first side facing a sample to be tested and a second side opposite to the first side, and the first side has a magnetic gap. The coil surrounds the magnetic conductive structure to generate a magnetic field with the magnetic conductive structure. The scattering parameter measuring unit is disposed at the first side and located within a range of the magnetic field.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: February 7, 2023
    Assignee: Industrial Technology Research Institute
    Inventors: Chun-Pin Wu, Shi-Yuan Tong, Mean-Jue Tung
  • Publication number: 20210199704
    Abstract: An electrostatic sensing system configured to sense an electrostatic information of a fluid inside a fluid distribution component and including an electrostatic sensing assembly, a signal amplifier and an analog-to-digital converter. The electrostatic sensing assembly includes a sensing component, and a shield. The sensing component is configured to be disposed at the fluid distribution component. The sensing component is disposed through the fluid distribution component so as to be partially located in the fluid distribution component. The shield surrounds a part of the sensing component that is located in the fluid distribution component. At least part of the shield is located on an upstream side of the sensing component. The signal amplifier is electrically connected to the sensing component. The analog-to-digital converter is electrically connected to the signal amplifier. The shield has an opening spaced apart from the sensing component.
    Type: Application
    Filed: December 21, 2020
    Publication date: July 1, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Mean-Jue TUNG, Ming-Da YANG, Shi-Yuan TONG, Yu-Ting HUANG, Chun-Pin WU
  • Publication number: 20210190887
    Abstract: An electromagnetic property measuring device includes a magnetic conductive structure, a coil, and a scattering parameter measuring unit. The magnetic conductive structure includes a first side facing a sample to be tested and a second side opposite to the first side, and the first side has a magnetic gap. The coil surrounds the magnetic conductive structure to generate a magnetic field with the magnetic conductive structure. The scattering parameter measuring unit is disposed at the first side and located within a range of the magnetic field.
    Type: Application
    Filed: December 18, 2020
    Publication date: June 24, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Chun-Pin Wu, Shi-Yuan Tong, Mean-Jue Tung
  • Patent number: 10494556
    Abstract: A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.
    Type: Grant
    Filed: December 29, 2015
    Date of Patent: December 3, 2019
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Pin Wu, Mean-Jue Tung, Ching-Chen Hsieh, Wei-Ta Yang, Meng-Song Yin
  • Publication number: 20180190416
    Abstract: A magnetic material is provided. The magnetic material includes a core portion consisting of above 99 wt % of Fe, based on the total weight of the core portion. An alloy layer including a FeM alloy is disposed on the surface of the core portion, wherein M is Cr, Si, Al, Ti, Zr, or a combination thereof. An oxide layer including M and an oxide of M is disposed on the surface of the alloy layer. A magnetic component is also provided. The magnetic component includes a sintered product of the magnetic material and a metal.
    Type: Application
    Filed: December 30, 2016
    Publication date: July 5, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Pin WU, Mean-Jue TUNG, Wen-Song KO
  • Publication number: 20170158933
    Abstract: A magnetic and thermally conductive material is provided, which includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof. A thermally conductive and dielectric layer is also provided, which includes a magnetic and thermally conductive material and a resin, wherein the thermally conductive material includes a thermally conductive compound powder, and an iron-containing oxide at a surface of the thermally conductive compound powder, wherein the iron-containing oxide is an oxide of iron with an other metal, and the other metal is nickel, zinc, copper, cobalt, magnesium, manganese, yttrium, lithium, aluminum, or a combination thereof.
    Type: Application
    Filed: December 29, 2015
    Publication date: June 8, 2017
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Pin WU, Mean-Jue TUNG, Ching-Chen HSIEH, Wei-Ta YANG, Meng-Song YIN
  • Publication number: 20080024022
    Abstract: A motor wiring seat for a motor comprises a driving assembly; and a coil seat including: a wiring shaft; a periphery of the wiring shaft forming a first combining portion; and a wiring seat separated from the wiring shaft; the wiring seat having a second combining portion combinable to the first combining portion; so that the wiring seat being combined to the wiring shaft. The first combining portion is a dovetail seat, and the second combining portion is a dovetail recess. The motor is a step motor. The motor has a casing.
    Type: Application
    Filed: July 26, 2006
    Publication date: January 31, 2008
    Inventor: Chun-Pin Wu