Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.

Abstract: A handheld electronic device including a body, a cover, an engaging assembly, and a releasing member is provided. The cover is disposed on the body and has a hole. The engaging assembly is movably disposed between the body and the cover to engage the cover on the body. The releasing member is disposed on the body and exposed by the hole of the cover. The releasing member is suitable for leaning against the engaging assembly and driving the same from an engaging position to a releasing position so as to release the cover.

Abstract: A handheld electronic device including a body, a cover, an engaging assembly, and a releasing member is provided. The cover is disposed on the body and has a hole. The engaging assembly is movably disposed between the body and the cover to engage the cover on the body. The releasing member is disposed on the body and exposed by the hole of the cover. The releasing member is suitable for leaning against the engaging assembly and driving the same from an engaging position to a releasing position so as to release the cover.

Abstract: A method for manufacturing a personal digital assistant (PDA) that contains an upper housing and a lower housing, includes forming a first portion and a second portion of the upper housing through plastic injection molding at one time, and forming at least one positioning stud on an inner side of the upper housing through plastic injection molding. The first portion can be electroplated, the second portion cannot be electroplated, and the positioning stud contains a surface that can be electroplated. The method further includes electroplating the upper housing so as to form an electrically conductive layer on the first portion and the surface of the positioning stud.