Patents by Inventor Chun-Ta Wang
Chun-Ta Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11914432Abstract: A portable electronic device including a first body, a second body, a pivot element, a heat source, a first flexible heat conductive element, and a flip cover is provided. The pivot element is connected to the second body, and the second body is pivotally connected to the first body through the pivot element. The heat source is disposed in the first body. The first flexible heat conductive element is thermally coupled to the heat source and extends toward the pivot element from the heat source. The first flexible heat conductive element passes through the pivot element and extends into the inside of the second body and is thus thermally coupled to the second body. The flip cover is pivotally connected to the first body and located on a moving path of the pivot element.Type: GrantFiled: April 19, 2022Date of Patent: February 27, 2024Assignee: Acer IncorporatedInventors: Chun-Chieh Wang, Wen-Neng Liao, Cheng-Wen Hsieh, Chuan-Hua Wang, Yi-Ta Huang
-
Patent number: 11630362Abstract: A one-way glass with switching modes includes an absorbing layer located on a weak light side, a reflecting layer located on an intense light side, and a converting layer stacked between the absorbing layer and the reflecting layer. The absorbing layer absorbs first polarized light and allows second polarized light to pass through. The reflecting layer reflects the first polarized light and allows the second polarized light to pass through. Unpolarized light incident from the weak light side or from the intense light side is respectively converted into the polarized light. During the process of gradually adjusting the converting layer from a twisted state to a vertical state, rotated angles of polarization directions of the first polarized light and the second polarized light gradually decrease.Type: GrantFiled: June 17, 2022Date of Patent: April 18, 2023Assignee: NATIONAL SUN YAT-SEN UNIVERSITYInventors: Tsung-Hsien Lin, Chun-Ta Wang, Heng-Yi Tseng, Cheng-Chang Li, Li-Min Chang, Kuan-Wu Lin, Hung-Chang Jau
-
Patent number: 10022836Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.Type: GrantFiled: September 8, 2015Date of Patent: July 17, 2018Assignee: San Fang Chemical Industry Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Wei-Te Liu, Chun-Ta Wang
-
Patent number: 9835924Abstract: A silicon based terahertz full wave liquid crystal phase shifter is provided. The liquid crystal phase shifter has a first silicon conductive substrate, a second silicon conductive substrate, a plurality of pads, and a liquid crystal. The first and second silicon conductive substrates, instead of the quartz glass and transparent electrode, such as ITO, are used as substrates and to provide electrodes of the liquid crystal phase shifter. Thus, the effect of the liquid crystal phase modulation of the liquid crystal phase shifter in the THz range can be improved.Type: GrantFiled: December 29, 2016Date of Patent: December 5, 2017Assignee: National Sun Yat-Sen UniversityInventors: Chao-Kuei Lee, Han-Wei Zhang, Tsung-Hsien Lin, Chun-Ta Wang, Jun-Ting Guo
-
Publication number: 20160187679Abstract: A switchable grating and an application thereof are provided. The switchable grating includes two electrically conductive substrates and a switchable liquid crystal grating layer, which is disposed between the two electrically conductive substrates. When an electric field is applied to a presumption area of the switchable liquid crystal grating layer by the two electrically conductive substrates, the electric field could shift an orientation of a cholesteric liquid crystal molecule of the presumption area. When the electric field is removed, the cholesteric liquid crystal molecule still maintains the aforementioned orientation, thus decreasing energy consumption. When a display device manufactured by the aforementioned switchable grating switches an image to a 2D image or a 3D image, the display device has lower energy consumption.Type: ApplicationFiled: June 22, 2015Publication date: June 30, 2016Inventors: Tsung-Hsien LIN, Hung-Chang JAU, Chun-Ta WANG, Chien-Tsung HOU, Cheng-Chang LI, Chih-Wei WU
-
Publication number: 20160082568Abstract: The present invention relates to a polishing pad comprising a base sheet containing a restriction layer. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.Type: ApplicationFiled: September 8, 2015Publication date: March 24, 2016Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEI-TE LIU, CHUN-TA WANG
-
Publication number: 20150202732Abstract: The present invention relates to a polishing pad comprising a buffer sheet containing a pressure distribution sheet. The invention also relates to a polishing apparatus and a method for manufacturing a polishing pad.Type: ApplicationFiled: January 15, 2015Publication date: July 23, 2015Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, WEI-TE LIU, CHUN-TA WANG
-
Patent number: 9044840Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.Type: GrantFiled: April 21, 2011Date of Patent: June 2, 2015Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Chun-Ta Wang, Hsin-Ru Song
-
Patent number: 8343586Abstract: The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.Type: GrantFiled: April 21, 2009Date of Patent: January 1, 2013Assignee: Bestac Advanced Material Co., Ltd.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang
-
Publication number: 20120094584Abstract: The present invention relates to a sheet for mounting a workpiece and a method for making the same. The method includes the steps of: (a) providing a sheet body having a top surface, a bottom surface, at least one side surface and a plurality of pores, wherein some of the pores open at the side surface; and (b) sealing or narrowing the pores that open at the side surface. Since the pores that open at the side surface are sealed or narrowed, the slurry is prevented from entering into the interior of the sheet body. Therefore, the infiltration distance reaches a predetermined value slowly, thereby increasing the effective life of the sheet.Type: ApplicationFiled: April 21, 2011Publication date: April 19, 2012Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, CHUN-TA WANG, HSIN-RU SONG
-
Publication number: 20110177305Abstract: The present invention relates to a polishing pad and method for making the same. The polishing pad includes a fabric substrate and a second high polymeric elastomer resin. The fabric substrate is formed by a plurality of cross composite fibers. Each composite fiber has a plurality of fine fibers and a first high polymeric elastomer resin, and the first high polymeric elastomer resin discontinuously encloses the fine fibers. The second high polymeric elastomer resin encloses the composite fibers, and the first high polymeric elastomer resin and the second high polymeric elastomer resin have the same functional group. By adjusting the degree of saturation of the first high polymeric elastomer resin and the second high polymeric elastomer resin, the fine fibers will have smaller size and will not be easily entangled. Therefore, a workpiece to be polished will not be scratched and will have excellent surface quality.Type: ApplicationFiled: April 14, 2010Publication date: July 21, 2011Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih FENG, Chun-Ta WANG, Kun-Cheng TSAI, Yung-Chang HUNG, I-Peng YAO, Kao-Lung YANG, Chih-Yi LIN
-
Publication number: 20100146863Abstract: The present invention relates to a polishing pad having an insulation layer and a method for making the same. The polishing pad includes a bottom layer, an insulation layer, and an abrasive layer. The bottom layer includes a fabric layer wrapped in a high polymer. The insulation layer is disposed on the bottom layer. The abrasive layer is disposed on the insulation layer. The abrasive layer is a high polymeric elastomer and has a plurality of columnar-like cells. The insulation layer can prevent the slurry from infiltrating into the bottom layer during the polishing processs to improve the polishing effect and quality.Type: ApplicationFiled: August 5, 2009Publication date: June 17, 2010Applicant: BESTAC ADVANCED MATERIAL CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang, Wei-Te Liu
-
Publication number: 20100119811Abstract: The present invention relates to a conductive polishing pad and a method for making the same. The conductive polishing pad includes a bottom layer, a conductive film and a polishing layer. The bottom layer includes a first high polymer and a fiber base. The first high polymer covers the fiber base, and has a plurality of first holes. The conductive film is disposed on the bottom layer. The polishing layer is disposed on the conductive film, and includes a second high polymer. The second high polymer has a plurality of second holes. Even though the bottom layer and the polishing layer are poor conductors, the conductivity thereof is raised by the conductive film, so that the polishing pad has good conductivity. Further, the polishing pad has a flexible surface, which prevents a surface of a workpiece to be polished from being scratched during polishing.Type: ApplicationFiled: April 21, 2009Publication date: May 13, 2010Applicant: BESTAC ADVANCED MATERIAL CO., LTD.Inventors: Chung-Chih Feng, I-Peng Yao, Yung-Chang Hung, Chun-Ta Wang
-
Patent number: 7662028Abstract: A groove structure for avoiding stripping of a polishing surface of a polishing pad, the polishing pad including a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. The polishing pad contains more grinding liquid, to clean the small grinded pieces. The grinding layer does not have an acute structure and is not easily peeled to form the small grinded pieces. Therefore, grinding quality and grinding effect are improved.Type: GrantFiled: June 16, 2008Date of Patent: February 16, 2010Assignee: Bestac Advanced Material Co., Ltd.Inventors: Chung-Chih Feng, Wei-Te Liu, Yung-Chang Hung, Chun-Ta Wang, I-Peng Yao
-
Publication number: 20090258587Abstract: The present invention relates to a polishing pad having a groove structure for avoiding the polishing surface stripping. The polishing pad of present invention includes a base material and a grinding layer. The base material has a surface. The grinding layer is disposed on the surface, and part of the surface around the edge of the base material is exposed. The grinding layer has a plurality of first grooves and second grooves, and the first grooves cross the second grooves to define a plurality of grinding areas. The exposed part of the surface around the edge of the base material is located between the first grooves, the second grooves and the edge of the polishing pad. Whereby, the polishing pad of present invention is capable to contain more grinding liquid, and is contributive to clean the small grinded pieces. Furthermore, the grinding layer does not have acute structure and is not easy to peel to form the small grinded pieces. Therefore, the grinding quality and grinding effect can be improved.Type: ApplicationFiled: June 16, 2008Publication date: October 15, 2009Applicant: BESTAC ADVANCED MATERIAL CO., LTD.Inventors: Chung-Chih Feng, Wei-Te Liu, Yung-Chang Hung, Chun-Ta Wang, I-Peng Yao
-
Publication number: 20090258578Abstract: The present invention relates to a polishing pad and method for making the same. In the invention, a liquid-state polymer material is directly formed on the surface of a base material, and then the liquid-state polymer material is solidified to form a flat grinding layer. Whereby, the polishing pad has high unity and flatness. The grinding layer has attenuated structures and a plurality of holes, thus increasing the storage ability of polishing particles distributed in a polishing liquid. In addition, the polishing pad has high compression ratio, so the polishing pad can compactly contact a polishing workpiece, and will not scratch the surface of the polishing workpiece scratched. Therefore, the polishing effect and quality will be improved.Type: ApplicationFiled: September 11, 2008Publication date: October 15, 2009Applicant: SAN FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih Feng, Chun-Ta Wang, Yung-Chang Hung, I-Peng Yao
-
Publication number: 20090258316Abstract: The present invention relates to a method for patterning a covering material by using a high-power exciting beam. The method includes the steps of (a) providing a base material having a plurality of thin layers, the neighboring thin layers having different colors; and (b) utilizing a high-power exciting beam to form at least one pattern on the base material, in which the pattern has at least one concave portion, so as to expose the thin layers with different colors. As a result, the covering material has a layered visual effect and many colors. Furthermore, the patterning method of the present invention is simple, and can form the pattern on the base material easily Therefore, the manufacturing time of the covering material with the pattern is reduced.Type: ApplicationFiled: August 12, 2008Publication date: October 15, 2009Applicant: SANG FANG CHEMICAL INDUSTRY CO., LTD.Inventors: Chung-Chih FENG, Chun-Ta WANG, Yung-Chang HUNG, Wei-Te LIU, I-Peng Yao