Patents by Inventor Chun-Ta Yeh
Chun-Ta Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240090171Abstract: A vapor chamber includes a main body. The main body includes a base plate and a top plate. The base plate includes a plate body, a peripheral frame and a plurality of supporting pillars. The plate body has a surface. The peripheral frame is disposed on the surface of the plate body. The surface and the peripheral frame together define a first space. The first space is configured to accommodate a working fluid. The supporting pillars are located in the first space and are distributed on the surface of the plate body. The supporting pillars, the plate body and the peripheral frame are of an integrally-formed structure. The top plate abuts against the peripheral frame and the supporting pillars to seal up the first space.Type: ApplicationFiled: November 20, 2023Publication date: March 14, 2024Inventors: Chun-Ta YEH, Chin-Long LIN
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Publication number: 20230171929Abstract: The present disclosure is related to a vapor chamber lid. The vapor chamber lid includes a base plate and a top plate. The base plate includes a plate body, a frame, a plurality of supporting pillars and a chip accommodating portion. The frame surrounds the plate body to define a cooling space. The cooling space is configured to accommodate a working fluid. The supporting pillars are located in the cooling space. The chip accommodating portion is located on the plate body of the base plate and is facing away from the cooling space. The top plate is located on the frame of the base plate to seal the cooling space. An external sidewall of the frame of the base plate is coplanar with an external sidewall of the top plate.Type: ApplicationFiled: October 11, 2022Publication date: June 1, 2023Inventors: Chun-Ta YEH, Chin-Hung KUO, Po-Li WANG
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Publication number: 20220312640Abstract: A vapor chamber includes a main body. The main body includes a base plate and a top plate. The base plate includes a plate body, a peripheral frame and a plurality of supporting pillars. The plate body has a surface. The peripheral frame is disposed on the surface of the plate body. The surface and the peripheral frame together define a first space. The first space is configured to accommodate a working fluid. The supporting pillars are located in the first space and are distributed on the surface of the plate body. The supporting pillars, the plate body and the peripheral frame are of an integrally-formed structure. The top plate abuts against the peripheral frame and the supporting pillars to seal up the first space.Type: ApplicationFiled: January 27, 2022Publication date: September 29, 2022Inventors: Chun-Ta YEH, Chin-Long LIN
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Patent number: 11404344Abstract: A heat spreading plate is suitable to be a top cover of a chip package structure. The heat spreading plate includes a main body and an isolating frame. The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally and capable of thermally connecting different working chips mounted within the chip package structure, respectively. A gap is formed between any two neighboring ones of the metal sheets to completely separate them. The isolating frame surrounds the outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together. One surface of the isolating frame is formed with a plurality of hollow recesses, and each of the metal sheets is exposed outwards from one of the hollow recesses.Type: GrantFiled: September 21, 2020Date of Patent: August 2, 2022Assignee: Jentech Precision Industrial Co., LTD.Inventor: Chun-Ta Yeh
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Patent number: 11388823Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.Type: GrantFiled: October 21, 2020Date of Patent: July 12, 2022Assignee: Jentech Precision Industrial Co., Ltd.Inventors: Chun-Ta Yeh, Kuo-Pin Cheng, Chin-Long Lin
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Patent number: 11083087Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.Type: GrantFiled: December 12, 2019Date of Patent: August 3, 2021Assignee: Jentech Precision Industrial Co., LTD.Inventors: Chun-Ta Yeh, Kuo-Pin Cheng, Chin-Long Lin
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Publication number: 20210143077Abstract: A heat spreading plate is suitable to be a top cover of a chip package structure. The heat spreading plate includes a main body and an isolating frame. The main body includes a plurality of metal sheets which are arranged spaced apart from one another totally and capable of thermally connecting different working chips mounted within the chip package structure, respectively. A gap is formed between any two neighboring ones of the metal sheets to completely separate them. The isolating frame surrounds the outer edges of the metal sheets and fills into the gaps for fixedly holding the metal sheets together. One surface of the isolating frame is formed with a plurality of hollow recesses, and each of the metal sheets is exposed outwards from one of the hollow recesses.Type: ApplicationFiled: September 21, 2020Publication date: May 13, 2021Inventor: Chun-Ta YEH
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Publication number: 20210045239Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.Type: ApplicationFiled: October 21, 2020Publication date: February 11, 2021Inventors: Chun-Ta YEH, Kuo-Pin CHENG, Chin-Long LIN
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Publication number: 20210045240Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.Type: ApplicationFiled: October 23, 2020Publication date: February 11, 2021Inventors: Chun-Ta YEH, Kuo-Pin CHENG, Chin-Long LIN
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Publication number: 20200229303Abstract: An insulated metal substrate (IMS) includes a metal substrate, an insulating layer, a plastic frame, and a plurality of conductive metal pads. The insulating layer is located on the metal substrate. The plastic frame is located on the insulating layer and has a plurality of aperture areas. The conductive metal pads are located on the insulating layer and are respectively located in the aperture areas, and the conductive metal pads have sidewalls are in contact with the plastic frame.Type: ApplicationFiled: December 12, 2019Publication date: July 16, 2020Inventors: Chun-Ta YEH, Kuo-Pin CHENG, Chin-Long LIN
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Publication number: 20110133623Abstract: A light emitting diode lamp comprises: a heat dissipating assembly including a column unit and a coolant container, the column unit defining opposite first and second fluid passages separated from each other, the coolant container defining a coolant storing space for storing a coolant therein; a heat sink mounted on the heat dissipating assembly and defining a fluid channel therein; a light emitting unit including at least one light emitting diode and mounted on the heat sink; and a coolant driving member. The coolant driving member, the heat sink, the coolant container and the column unit are coupled together so that the coolant driving member drives circulation of the coolant through the first and second fluid passages, the coolant storing space and the fluid channel.Type: ApplicationFiled: December 2, 2010Publication date: June 9, 2011Inventors: Shao-Nong TSAI, Chun-Ta Yeh
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Publication number: 20100018676Abstract: A planar heat dissipating device includes: a planar housing defining a planar inner space therein; and a partitioning unit dividing the inner space into a plurality of upper fluid channels and a plurality of lower fluid channels that cross the upper fluid channels. Each of the upper fluid channels is in fluid communication with at least one of the lower fluid channels at an intersection therebetween.Type: ApplicationFiled: October 1, 2009Publication date: January 28, 2010Applicants: National Central University, Industrial Technology Research InstituteInventors: Chien-Yuh Yang, Chun-Ta Yeh, Wei-Chi Liu
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Publication number: 20060264073Abstract: A planar heat dissipating device includes: a planar housing defining a planar inner space therein; and a partitioning unit dividing the inner space into a plurality of upper fluid channels and a plurality of lower fluid channels that cross the upper fluid channels. Each of the upper fluid channels is in fluid communication with at least one of the lower fluid channels at an intersection therebetween.Type: ApplicationFiled: May 16, 2006Publication date: November 23, 2006Inventors: Chien-Yuh Yang, Chun-Ta Yeh, Wei-Chi Liu