Abstract: A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

Abstract: A liquid immersion cooling sheet includes a metal case and a porous structure. The metal case has a heated surface and a cooling surface formed on a back of the heated surface. The porous structure is disposed on the cooling surface and has multiple gaps. A width of each gap is less than or equal to about 0.2 mm. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

Abstract: A liquid immersion cooler includes a metal case, a soldering layer, a heat conduction layer, and a porous structure. The metal case has a heated surface and a cooling surface disposed on back of the heated surface. The soldering layer is laid on the cooling surface. The heat conduction layer is laid on the soldering layer. The porous structure is laid on the heat conduction layer. Therefore, the waste heat from an electronic heat source may be rapidly dissipated.

Abstract: An air-liquid composite cooler for a memory module is provided. The memory module has a top portion and two side portions. The air-liquid composite cooler includes a liquid-cooling structure and a pair of air-cooling structures. The liquid-cooling structure is arranged on the top portion and has a liquid passage. The air-cooling structure is arranged on a side portion, and includes a phase-change thermo-conductive member. One end of the phase-change thermo-conductive member contacts the liquid-cooling structure to conduct heat and another end of the phase-change thermo-conductive member is extended in a direction away from the liquid-cooling structure. Therefore, the overall cooling efficiency of the cooler may be improved.

Abstract: A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.

Abstract: A heat dissipating apparatus using phase change heat transfer includes a box, a heat conductive block, a working fluid, and a heat transfer device. The box has a first shell plate and a second plate between both of which a chamber is defined. An opening is formed through the first shell plate. The heat conductive block is disposed corresponding to the opening; a portion of the heat conductive block is formed inside the chamber and the other portion of the heat conductive block is exposed out of the first shell plate. The working fluid is disposed in the chamber and in contact with the heat conductive block. The heat transfer device has an evaporator section installed inside the chamber to absorb the heat generated by the working fluid after phase change. Thus, the heat dissipating efficiency of the whole apparatus can be enhanced.

Abstract: A heat dissipation module includes a heat sink, a wind-guiding element and a pivot. The wind-guiding element is disposed on the heat sink, and the pivot is connected between the heat sink and the wind-guiding element to allow the wind-guiding element to rotate relative to the heat sink via the pivot. The wind-guiding element can change a direction of airflow to provide an optimal heat dissipation effect. Additionally, an electronic device using the heat dissipation module is also provided. The heat dissipation module can provide superior heat dissipation effect to an electronic component on the electronic device and maintain a normal operation of the electronic component.

Abstract: An electronic apparatus including a circuit board having multiple heat generating elements and a heat-dissipation module is provided. The heat-dissipation module includes a heat-dissipation plate and a heat pipe set. The heat-dissipation plate having a first surface and a second surface is disposed on the circuit board and having multiple contacting portions and at least one heat pipe protecting portion connecting the contacting portions. The contacting portions are used for receiving heat from the heat generating elements. A heat pipe accommodating groove passing through the heat pipe protecting portion is set on the first surface. The heat pipe set is disposed in the heat pipe accommodating groove of the heat-dissipation plate.

Abstract: A heat dissipation module includes a heat sink, a wind-guiding element and a pivot. The wind-guiding element is disposed on the heat sink, and the pivot is connected between the heat sink and the wind-guiding element to allow the wind-guiding element to rotate relative to the heat sink via the pivot. The wind-guiding element can change a direction of airflow to provide an optimal heat dissipation effect. Additionally, an electronic device using the heat dissipation module is also provided. The heat dissipation module can provide superior heat dissipation effect to an electronic component on the electronic device and maintain a normal operation of the electronic component.

Abstract: An electronic apparatus including a circuit board having multiple heat generating elements and a heat-dissipation module is provided. The heat-dissipation module includes a heat-dissipation plate and a heat pipe set. The heat-dissipation plate having a first surface and a second surface is disposed on the circuit board and having multiple contacting portions and at least one heat pipe protecting portion connecting the contacting portions. The contacting portions are used for receiving heat from the heat generating elements. A heat pipe accommodating groove passing through the heat pipe protecting portion is set on the first surface. The heat pipe set is disposed in the heat pipe accommodating groove of the heat-dissipation plate.

Abstract: A gap adjusting jig for heat dissipation is suitable to hold at least a heat source of a plate-shaped module. The gap adjusting jig for heat dissipation includes a first heat dissipation plate and a second heat dissipation plate and at least a gap adjusting element. A gap is formed between the first and second heat dissipation plates. The heat source is suitable to be provided in the gap and lean against the first and second heat dissipation plates. The gap adjusting element is connected between the first and second heat dissipation plates. The gap adjusting element is suitable to adjust the gap between the first and second heat dissipation plates to enable the first and second heat dissipation plates to hold the heat source.