Abstract: The present disclosure provides an immunoconjugate includes an antibody comprising an antigen-binding fragment that specifically binds to an epitope in mesothelin, N-glycan binding domain and an N-glycan; a linker linking to the N-glycan; and a payload A and a payload B conjugated to the linker, respectively; wherein the payload A and the payload B are the same or different. A pharmaceutical composition comprises the immunoconjugate and a method for treating cancer are also provided in the disclosure.

Abstract: A carrier structure is provided with a plurality of package substrates connected via connecting sections, and a functional element and a groove are formed on the connecting section, such that the groove is located between the package substrate and the functional element. Therefore, when a cladding layer covering a chip is formed on the package substrate, the groove can accommodate a glue material overflowing from the cladding layer to prevent the glue material from contaminating the functional element.

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Abstract: A compound, a solid carrier including the same and a method for preparing a nucleic acid are provided. The compound has a structure represented by Formula (1) as follows. In Formula (1), the definition of Y1, Y2, Z and * are the same as defined in the detailed description.

Abstract: A composite film for use in an LED wafer-level packaging process to facilitate adhesion of an LED wafer to a carrier and an LED wafer-level packaging process carried out with a heating process are introduced. The composite film includes a substrate including a first surface and a second surface; a heat-resisting pressure-sensing adhesive formed on the first surface of the substrate to allow the LED wafer to be adhered to the substrate; and a heat-resisting thermally-visbreaking pressure-sensing adhesive formed on the second surface of the substrate to allow the substrate to be adhered to the carrier. The heat-resisting thermally-visbreaking pressure-sensing adhesive undergoes the heating process to reduce its adhesiveness strength; thus, upon completion of the LED wafer-level packaging process, the carrier can be detached from the composite film easily.

Abstract: The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0?V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

Abstract: The instant disclosure provides a polyimide composite film for a flexible display and a method for manufacturing the same. The composite film can be attached to a supporting carrier and includes a double-sided tape, a releasing layer and a transparent polyimide film. The double-sided tape includes a substrate, a surface of the substrate has an adhesive disposed thereon, and the other surface of the substrate has a releasing agent disposed thereon. A releasing layer is attached to the adhesive on the substrate and is removable from the substrate so that the substrate is attachable to the supporting carrier through the adhesive. The method includes providing a transparent polyimide film; providing the double-sided tape mentioned above; and removing the releasing layer on the releasing agent of the substrate for adhering the transparent polyimide film to the releasing agent.

Abstract: The instant disclosure provides a polyimide composite film for a flexible display and a method for manufacturing the same. The composite film can be attached to a supporting carrier and includes a double-sided tape, a releasing layer and a transparent polyimide film. The double-sided tape includes a substrate, a surface of the substrate has an adhesive disposed thereon, and the other surface of the substrate has a releasing agent disposed thereon. A releasing layer is attached to the adhesive on the substrate and is removable from the substrate so that the substrate is attachable to the supporting carrier through the adhesive. The method includes providing a transparent polyimide film; providing the double-sided tape mentioned above; and removing the releasing layer on the releasing agent of the substrate for adhering the transparent polyimide film to the releasing agent.

Abstract: The instant disclosure provides a thermal-curable adhesive composition and adhesive sheet. The thermal-curable adhesive composition has a rate of change of adhesion ranging from 80% to 98% and defined by the following equation: V=[(V0?V1)/V0]×100, wherein V is the rate of change of adhesion of the thermal-curable adhesive composition, V0 is the adhesion of the thermal-curable adhesive composition under room temperature, and V1 is the adhesion of the thermal-curable adhesive composition after being heated to a predetermined temperature then cooled to the room temperature.

Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract: The present disclosure relates, according to some embodiments, to a multilayered polyimide film comprising a peelable base layer, and a polyimide layer adhered in contact with the peelable base layer. A peelable base layer may be derived from a reaction comprising a diamine compound and a dianhydride compound, wherein the peelable base comprises a polyimide and a structure according to formula (I): wherein n is a number of repeating units. According to some embodiments, a quantity of silicon atoms present in a peelable base layer comprises about 1% to about 12% of a total weight of the peelable base layer.

Abstract: The present disclosure relates, according to some embodiments, to the fabrication of a flexible circuit board, which includes forming a base layer comprising polyimide, forming a polyimide layer on the base layer, the polyimide layer having a first surface and a second surface opposite to each other, the first surface being peelably adhered in contact with the base layer, forming a metal layer on the second surface of the polyimide layer, and peeling the base layer from the polyimide layer with the metal layer remaining on the second surface of the polyimide layer.

Abstract: A polyimide film includes a first sub-layer and a second sub-layer connected with each other. The first sub-layer contains a first polyimide, and a particulate filler of fluorine-containing polymer distributed in the first polyimide. The second sub-layer includes a second polyimide similar or identical to the first polyimide. The first polyimide is derived from a first diamine component and a first dianhydride component, the first diamine component and/or the first dianhydride component containing fluorine atoms. The second sub-layer is derived from a second diamine component and a second dianhydride component, the second diamine component and/or the second dianhydride component also containing fluorine atoms.

Abstract: A polyimide film arrangement (e.g., a polyimide film) includes a polyimide layer having a first and a second surface opposite to each other, and a base layer peelably adhered to the first surface of the polyimide layer and containing a polyimide. The polyimide layer or the base layer includes a filler having a surface energy less than about 35 dyne/cm. Moreover, the present application also describes a method of fabricating the polyimide film arrangement, and its assembly on a substrate.

Abstract: A polyimide film includes a polyimide, a carbon black present in a quantity between about 0.5 wt % and about 5 wt %, and a fluorine-containing polymer present in a quantity between about 15 wt % and about 40 wt %. The polyimide film can be a single-layer film or a multi-layer film, and has a low dielectric constant and low gloss.