Patents by Inventor Chun-Wen Pai

Chun-Wen Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Function module with built-in heat dissipation device
    Patent number: 7130191
    Abstract: A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.
    Type: Grant
    Filed: June 8, 2004
    Date of Patent: October 31, 2006
    Assignee: Quanta Computer Inc.
    Inventors: Wen-Yen Lin, Tsan-Nan Chien, Chun-Wen Pai
  • Function module with built-in heat dissipation device
    Publication number: 20040246678
    Abstract: A function module with built-in heat dissipation device. The function module includes a first circuit board, a second circuit board, a first height-compensation heat spreader, a second height-compensation heat spreader, and a heat dissipation fin. The first circuit board has a first surface, a first and second device. The second circuit board has a second surface facing the first surface, a third device, and a fourth device. The first height-compensation heat spreader has a first face, contacting the first and second devices simultaneously, and a third face, opposite to the first face. The second height-compensation heat spreader has a second face, contacting the third and fourth devices simultaneously, and a fourth face, opposite to the second face. The heat dissipation fin is disposed between the first circuit board and the second circuit board.
    Type: Application
    Filed: June 8, 2004
    Publication date: December 9, 2004
    Inventors: Wen-Yen Lin, Tsan-Nan Chien, Chun-Wen Pai
  • Function module with built-in heat dissipation fin
    Publication number: 20040218367
    Abstract: A function module with a built-in heat dissipation fin. The function module includes a first circuit board, a second circuit board, and a heat dissipation fin. The first circuit board includes a first surface with a first ground layer formed thereon. The second circuit board is coupled to the first circuit board, and includes a second surface facing the first surface. A second ground layer is formed on the second surface. The heat dissipation fin is disposed between the first circuit board and the second circuit board, and abuts the first ground layer and the second ground layer respectively.
    Type: Application
    Filed: April 14, 2004
    Publication date: November 4, 2004
    Inventors: Wen-Yen Lin, Tsan-Nan Chien, Chun-Wen Pai