Abstract: In some embodiments, a wireless local area network (WLAN) front-end can be implemented on a semiconductor die having a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to support the transmit and receive operations.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: In some embodiments, a wireless local area network (WLAN) front-end can be implemented on a semiconductor die having a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to support the transmit and receive operations.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: Front-end integrated circuit for wireless local area network WLAN applications. In some embodiments, a semiconductor die can include a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to facilitate the transmit and receive operations.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: Front-end integrated circuit for wireless local area network WLAN applications. In some embodiments, a semiconductor die can include a semiconductor substrate, and a power amplifier implemented on the semiconductor substrate and configured for WLAN transmit operation associated with a frequency range. The semiconductor die can further include a low-noise amplifier (LNA) implemented on the semiconductor substrate and configured for WLAN receive operation associated with the frequency range. The semiconductor die can further include a transmit/receive switch implemented on the semiconductor substrate and configured to facilitate the transmit and receive operations.

Abstract: Systems, circuits and methods related to dynamic error vector magnitude (DEVM) corrections. In some embodiments, a power amplifier (PA) system can include a PA circuit having a plurality of amplification stages, and a bias system in communication with the PA circuit and configured to provide bias signals to the amplification stages. The PA system can further include a first correction circuit configured to generate a correction current that results in an adjusted bias signal for a selected amplification stage, with the adjusted bias signal being configured to compensate for an error vector magnitude (EVM) during a dynamic mode of operation. The PA system can further include a second correction circuit configured to change the correction current based on an operating condition associated with the PA circuit.

Abstract: A system and method are provided for reducing dynamic EVM of an integrated circuit power amplifier (PA) used for RF communication. In a multistage PA, the largest amplification stage is biased with a high amplitude current pulse upon receipt of a Tx enable, before receipt of the RF signal data burst. The high amplitude current pulse causes a large portion of the total ICQ budget of the multistage PA to pass through the largest amplification stage causing the entire integrated circuit to rapidly approach steady-state operating conditions. A smoothing bias current is applied to the largest amplification stage after the pulse decays to compensate for transient bias current levels while standard bias circuitry is still approaching steady-state temperature.

Abstract: An integrated circuit is disclosed having through silicon vias spaced apart one from another and conductors, each coupled to one or more of the through silicon vias, the conductors in aggregate in use forming a segmented conductive plane maintained at a same potential and forming an electromagnetic shield.

Abstract: A method for controlling a switch based on transistors is disclosed. A switching circuit for switching a signal from an input port to an output port thereof is provided. A shunting circuit for switchably shunting the signal from the input port to ground is also provided. A control signal is generated for biasing a control port of the shunting circuit and an approximately complimentary control signal is generated for biasing of the switching circuit to either shunt a signal received at the input port or to switch the signal to the output port. A further bias signal for biasing a port within the switching circuit along the signal path between the input port and the output port is also provided.

Abstract: A method for controlling a switch based on transistors is disclosed. A switching circuit for switching a signal from an input port to an output port thereof is provided. A shunting circuit for switchably shunting the signal from the input port to ground is also provided. A control signal is generated for biasing a control port of the shunting circuit and an approximately complimentary control signal is generated for biasing of the switching circuit to either shunt a signal received at the input port or to switch the signal to the output port. A further bias signal for biasing a port within the switching circuit along the signal path between the input port and the output port is also provided.

Abstract: A system and method are provided for biasing transistor switches in a semiconductor based high power switch. Off-state Vgsd biasing for the off transistor switches is based upon acceptable levels of spurious harmonic emissions and linearity.

Abstract: A method for controlling a switch based on transistors is disclosed. A switching circuit for switching a signal from an input port to an output port thereof is provided. A shunting circuit for switchably shunting the signal from the input port to ground is also provided. A control signal is generated for biasing a control port of the shunting circuit and an approximately complementary control signal is generated for biasing of the switching circuit to either shunt a signal received at the input port or to switch the signal to the output port. A further bias signal for biasing a port within the switching circuit along the signal path between the input port and the output.

Abstract: A system and method are provided for reducing dynamic EVM of an integrated circuit power amplifier (PA) used for RF communication. In a multistage PA, the largest amplification stage is biased with a high amplitude current pulse upon receipt of a Tx enable, before receipt of the RF signal data burst. The high amplitude current pulse causes a large portion of the total ICQ budget of the multistage PA to pass through the largest amplification stage causing the entire integrated circuit to rapidly approach steady-state operating conditions. A smoothing bias current is applied to the largest amplification stage after the pulse decays to compensate for transient bias current levels while standard bias circuitry is still approaching steady-state temperature.

Abstract: A system and method are provided for biasing transistor switches in a semiconductor based high power switch. Off-state Vgsd biasing for the off transistor switches is based upon acceptable levels of spurious harmonic emissions and linearity.

Abstract: A system and method are provided for biasing transistor switches in a semiconductor based high power switch. Off-state Vgsd biasing for the off transistor switches is based upon acceptable levels of spurious harmonic emissions and linearity.

Abstract: A system and method are provided for biasing transistor switches in a semiconductor based high power switch. Off-state Vgsd biasing for the off transistor switches is based upon acceptable levels of spurious harmonic emissions and linearity.

Abstract: A system and method are provided for reducing dynamic EVM of an integrated circuit power amplifier (PA) used for RF communication. In a multistage PA, the largest amplification stage is biased with a high amplitude current pulse upon receipt of a Tx enable, before receipt of the RF signal data burst. The high amplitude current pulse causes a large portion of the total ICQ budget of the multistage PA to pass through the largest amplification stage causing the entire integrated circuit to rapidly approach steady-state operating conditions. A smoothing bias current is applied to the largest amplification stage after the pulse decays to compensate for transient bias current levels while standard bias circuitry is still approaching steady-state temperature.