Patents by Inventor Chun-Yi Liu

Chun-Yi Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240156331
    Abstract: An endoscopic device is provided and includes an insertion tube, an imaging assembly, a light guiding component and a light emitting component. The imaging assembly includes a lens set and an image sensor. The lens set is located adjacent to a distal end of the insertion tube. The image sensor is located inside the insertion tube and engaged with the lens set. The light guiding component is located adjacent to the distal end of the insertion tube and beside the lens set. The light guiding component includes an outer end adjacent to the distal end of the insertion tube and an inner end opposite to the outer end. A length of the light guiding component is greater than a length of the imaging assembly. The light emitting component is located inside the insertion tube and adjacent to the inner end of the light guiding component.
    Type: Application
    Filed: November 10, 2023
    Publication date: May 16, 2024
    Inventors: Liang-Yi Li, Chun-Wei Liu
  • Publication number: 20240144868
    Abstract: The present disclosure provides a pixel circuit with pulse width compensation, and the pixel circuit includes a pulse width modulation circuit and a pulse amplitude modulation circuit, and the pulse amplitude modulation circuit is electrically connected to the pulse width modulation circuit. The pulse width modulation circuit includes a P-type pulse width compensation transistor and a first P-type control transistor, and the first P-type control transistor is electrically connected to the P-type pulse width compensation transistor. The pulse amplitude modulation circuit includes a second P-type control transistor, a first capacitor, a P-type driving transistor and a light-emitting element. The second P-type control transistor is electrically connected to the first P-type control transistor. The first capacitor is electrically connected to the second P-type control transistor.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 2, 2024
    Inventors: De-Fu CHEN, Po Lun CHEN, Chun-Ta CHEN, Ta-Jen HUANG, Po-Tsun LIU, Guang-Ting ZHENG, Ting-Yi YI
  • Publication number: 20240142664
    Abstract: Two types of blue light blocking contact lenses are provided and are formed by curing different compositions. The first composition includes a blue light blocking component formed by mixing or reacting a first hydrophilic monomer and a yellow dye, a first colored dye component formed by mixing or reacting a second hydrophilic monomer and a first colored dye, at least one third hydrophilic monomer, a crosslinker, and an initiator. The first colored dye includes a green dye, a cyan dye, a blue dye, an orange dye, a red dye, a black dye, or combinations thereof. The second composition includes a blue light blocking component, at least one hydrophilic monomer, a crosslinker, and an initiator. The blue light blocking component is formed by mixing or reacting glycerol monomethacrylate and a yellow dye. Further, methods for preparing the above contact lenses are provided.
    Type: Application
    Filed: February 12, 2023
    Publication date: May 2, 2024
    Inventors: Han-Yi CHANG, Chun-Han CHEN, Tsung-Kao HSU, Wei-che WANG, Yu-Hung LIN, Wan-Ying GAO, Li-Hao LIU
  • Publication number: 20240135897
    Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.
    Type: Application
    Filed: December 11, 2022
    Publication date: April 25, 2024
    Inventors: De-Fu CHEN, Po Lun CHEN, Chun-Ta CHEN, Ta-Jen HUANG, Po-Tsun LIU, Guang-Ting ZHENG, Ting-Yi YI
  • Patent number: 11966693
    Abstract: An electronic device and a method for editing a resume are provided. The electronic device includes a display, a transceiver, a storage medium, and a processor. The processor receives personal information through the transceiver, and inputs the personal information into a plurality of item templates to generate an item template with personal information and a blank item template without personal information corresponding to the plurality of item templates. The processor displays the plurality of item templates through the display, and receives a first input operation to add a first item template and a second item template in the plurality of item templates to a resume display area to generate a resume. The processor outputs the resume through the transceiver.
    Type: Grant
    Filed: July 11, 2022
    Date of Patent: April 23, 2024
    Assignee: TRANTOR TECH, INC.
    Inventors: Chun Yi Liu, Cheng-Min Ting, Chun Ling Pan
  • Patent number: 11961489
    Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.
    Type: Grant
    Filed: December 11, 2022
    Date of Patent: April 16, 2024
    Assignees: Interface Technology (ChengDu) Co., Ltd., Interface Optoelectronics (ShenZhen) Co., Ltd., General Interface Solution Limited
    Inventors: De-Fu Chen, Po Lun Chen, Chun-Ta Chen, Ta-Jen Huang, Po-Tsun Liu, Guang-Ting Zheng, Ting-Yi Yi
  • Publication number: 20240096781
    Abstract: A package structure including a semiconductor die, a redistribution circuit structure and an electronic device is provided. The semiconductor die is laterally encapsulated by an insulating encapsulation. The redistribution circuit structure is disposed on the semiconductor die and the insulating encapsulation. The redistribution circuit structure includes a colored dielectric layer, inter-dielectric layers and redistribution conductive layers embedded in the inter-dielectric layers. The electronic device is disposed over the colored dielectric layer and electrically connected to the redistribution circuit structure.
    Type: Application
    Filed: March 20, 2023
    Publication date: March 21, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun-Ti Lu, Hao-Yi Tsai, Chia-Hung Liu, Yu-Hsiang Hu, Hsiu-Jen Lin, Tzuan-Horng Liu, Chih-Hao Chang, Bo-Jiun Lin, Shih-Wei Chen, Hung-Chun Cho, Pei-Rong Ni, Hsin-Wei Huang, Zheng-Gang Tsai, Tai-You Liu, Po-Chang Shih, Yu-Ting Huang
  • Patent number: 11914541
    Abstract: In example implementations, a computing device is provided. The computing device includes an expansion interface, a first device, a second device, and a processor communicatively coupled to the expansion interface. The expansion interface includes a plurality of slots. Two slots of the plurality of slots are controlled by a single reset signal. The first device is connected to a first slot of the two slots and has a feature that is compatible with the single reset signal. The second device is connected to a second slot of the two slots and does not have the feature compatible with the single reset signal. The process is to detect the first device connected to the first slot and the second device connected to the second slot and disable the feature by preventing the first slot and the second slot from receiving the single reset signal.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wen Bin Lin, ChiWei Ding, Chun Yi Liu, Shuo-Cheng Cheng, Chao-Wen Cheng
  • Publication number: 20230315667
    Abstract: In example implementations, a computing device is provided. The computing device includes an expansion interface, a first device, a second device, and a processor communicatively coupled to the expansion interface. The expansion interface includes a plurality of slots. Two slots of the plurality of slots are controlled by a single reset signal. The first device is connected to a first slot of the two slots and has a feature that is compatible with the single reset signal. The second device is connected to a second slot of the two slots and does not have the feature compatible with the single reset signal. The process is to detect the first device connected to the first slot and the second device connected to the second slot and disable the feature by preventing the first slot and the second slot from receiving the single reset signal.
    Type: Application
    Filed: March 29, 2022
    Publication date: October 5, 2023
    Inventors: Wen Bin Lin, ChiWei Ding, Chun Yi Liu, Shuo-Cheng Cheng, Chao-Wen Cheng
  • Publication number: 20230040241
    Abstract: An electronic device and a method for editing a resume are provided. The electronic device includes a display, a transceiver, a storage medium, and a processor. The processor receives personal information through the transceiver, and inputs the personal information into a plurality of item templates to generate an item template with personal information and a blank item template without personal information corresponding to the plurality of item templates. The processor displays the plurality of item templates through the display, and receives a first input operation to add a first item template and a second item template in the plurality of item templates to a resume display area to generate a resume. The processor outputs the resume through the transceiver.
    Type: Application
    Filed: July 11, 2022
    Publication date: February 9, 2023
    Applicant: Trantor Tech, Inc.
    Inventors: Chun Yi Liu, Cheng-Min Ting, Chun Ling Pan
  • Patent number: 11392530
    Abstract: In one example, an adapter card may include a circuit board having a male interface to be inserted into a discrete graphics card slot and a peripheral component interconnect express (PCIe) slot to communicatively couple a PCIe device. Further, the adapter card may include a voltage converter circuit disposed on the circuit board to convert a first voltage associated with the discrete graphics card slot to a second voltage corresponding to the PCIe device and a level shifter circuit disposed on the circuit board to modify a signal level in the discrete graphics card slot to a signal level in the PCIe device.
    Type: Grant
    Filed: October 23, 2018
    Date of Patent: July 19, 2022
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Po-Ying Chih, Chao-Wen Cheng, Chun-Yi Liu
  • Publication number: 20210365398
    Abstract: In one example, an adapter card may include a circuit board having a male interface to be inserted into a discrete graphics card slot and a peripheral component interconnect express (PCIe) slot to communicatively couple a PCIe device. Further, the adapter card may include a voltage converter circuit disposed on the circuit board to convert a first voltage associated with the discrete graphics card slot to a second voltage corresponding to the PCIe device and a level shifter circuit disposed on the circuit board to modify a signal level in the discrete graphics card slot to a signal level in the PCIe device.
    Type: Application
    Filed: October 23, 2018
    Publication date: November 25, 2021
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Po-Ying Chih, Chao-Wen Cheng, Chun-Yi Liu
  • Patent number: 10698019
    Abstract: A method is presented to estimate the remaining life of a moving power cable online. The cable is monitored online remotely for further providing suggestions to users for reducing times of power failure and economic loss. An offline AC impedance measurement experiment is designed at first. Three artificial neural networks are established for convert measured impedances into impedances under a baseline context to calculate impedance change ratios. The impedance change ratio indicates the damage of the cable. At last, a remaining margin of the impedance change ratio is figured out online under various contexts with three equations. Thus, the remaining life of the cable is obtained online.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: June 30, 2020
    Assignee: Chung Yuan Christian University
    Inventors: Ying-Yi Hong, Chun-Yao Lee, Chun-Yi Liu
  • Publication number: 20200158773
    Abstract: A method is presented to estimate the remaining life of a moving power cable online. The cable is monitored online remotely for further providing suggestions to users for reducing times of power failure and economic loss. An offline AC impedance measurement experiment is designed at first. Three artificial neural networks are established for convert measured impedances into impedances under a baseline context to calculate impedance change ratios. The impedance change ratio indicates the damage of the cable. At last, a remaining margin of the impedance change ratio is figured out online under various contexts with three equations. Thus, the remaining life of the cable is obtained online.
    Type: Application
    Filed: November 16, 2018
    Publication date: May 21, 2020
    Inventors: Ying-Yi Hong, Chun-Yao Lee, Chun-Yi Liu
  • Publication number: 20170345741
    Abstract: An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.
    Type: Application
    Filed: July 4, 2016
    Publication date: November 30, 2017
    Inventors: Chi-Hsi Wu, Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai, Chuen-De Wang
  • Patent number: 9812381
    Abstract: An integrated fan-out package is described. The integrated fan-out package comprises a first die and a second die arranged adjacent to each other. A molding compound encapsulates the first and second dies. A redistribution structure is disposed over the molding compound and on the first and second dies. The redistribution structure comprises a first connection structure electrically connected to the first die, a second connection structure electrically connected to the second die and an inter-dielectric layer located between the first and second connection structures and separating the first connection structure from the second connection structure. The ball pad is disposed on the redistribution structure and electrically connected with the first die or the second die. The bridge structure is disposed on the first connection structure and on the second connection structure and electrically connects the first die with the second die.
    Type: Grant
    Filed: July 4, 2016
    Date of Patent: November 7, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chi-Hsi Wu, Chun-Yi Liu, Der-Chyang Yeh, Hsien-Wei Chen, Shih-Peng Tai, Chuen-De Wang
  • Patent number: 9258476
    Abstract: An automatic image-capturing system is used for capturing an image and transmitting the image to a remote device. The automatic image-capturing system includes a photography module for capturing the image; a storage module for storing the image captured by the photography module; a transmission module for receiving a control instruction sent by the remote device; a master core module for making the photography module to capture the image based on the control instruction, and segmenting the image into a plurality of files and segmenting the files into a plurality of packets to be transmitted to the remote device by the transmission module, and a slave core module for monitoring the operations of the master core module to turn off and restart the master core module when there is an abnormal operation in the master core module.
    Type: Grant
    Filed: July 31, 2014
    Date of Patent: February 9, 2016
    Assignee: National Taiwan University
    Inventors: Joe-Air Jiang, Hsiao-Wei Yuan, Chyi-Rong Chiou, Cheng-Long Chuang, Chia-Pang Chen, Chun-Yi Liu, Yu-Sheng Tseng, Chung-Hang Hong, Min-Sheng Liao, Tzu-Shiang Lin
  • Publication number: 20150036012
    Abstract: An automatic image-capturing system is used for capturing an image and transmitting the image to a remote device. The automatic image-capturing system includes a photography module for capturing the image; a storage module for storing the image captured by the photography module; a transmission module for receiving a control instruction sent by the remote device; a master core module for making the photography module to capture the image based on the control instruction, and segmenting the image into a plurality of files and segmenting the files into a plurality of packets to be transmitted to the remote device by the transmission module, and a slave core module for monitoring the operations of the master core module to turn off and restart the master core module when there is an abnormal operation in the master core module.
    Type: Application
    Filed: July 31, 2014
    Publication date: February 5, 2015
    Inventors: Joe-Air Jiang, Hsiao-Wei Yuan, Chyi-Rong Chiou, Cheng-Long Chuang, Chia-Pang Chen, Chun-Yi Liu, Yu-Sheng Tseng, Chung-Hang Hong, Min-Sheng Liao, Tzu-Shiang Lin
  • Patent number: 8896089
    Abstract: Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via.
    Type: Grant
    Filed: November 9, 2011
    Date of Patent: November 25, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Wei Chiu, Tzu-Yu Wang, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu, Shang-Yun Hou
  • Publication number: 20130113070
    Abstract: Interposers for semiconductor devices and methods of manufacture thereof are disclosed. In one embodiment, an interposer includes a substrate, a contact pad disposed on the substrate, and a first through-via in the substrate coupled to the contact pad. A first fuse is coupled to the first through-via. A second through-via in the substrate is coupled to the contact pad, and a second fuse is coupled to the second through-via.
    Type: Application
    Filed: November 9, 2011
    Publication date: May 9, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Wei Chiu, Tzu-Yu Wang, Wei-Cheng Wu, Chun-Yi Liu, Hsien-Pin Hu, Shang-Yun Hou