Patents by Inventor Chun-Ying Huang
Chun-Ying Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11984165Abstract: A memory device includes a plurality of word lines (WLs). The memory device includes a plurality of drivers that are each configured to control a corresponding one of the plurality of WLs and each comprise a first transistor having a first conductive type and a second transistor having a second conductive type. The first transistor of a first one of the drivers is formed in a first well of a substrate, and the second transistor of the first driver is formed in a second well of the substrate. The first well is spaced apart from the second well.Type: GrantFiled: May 24, 2022Date of Patent: May 14, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Chun-Ying Lee, Chia-En Huang, Chieh Lee
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Publication number: 20240136183Abstract: A photo resist layer is used to protect a dielectric layer and conductive elements embedded in the dielectric layer when patterning an etch stop layer underlying the dielectric layer. The photo resist layer may further be used to etch another dielectric layer underlying the etch stop layer, where etching the next dielectric layer exposes a contact, such as a gate contact. The bottom layer can be used to protect the conductive elements embedded in the dielectric layer from a wet etchant used to etch the etch stop layer.Type: ApplicationFiled: January 2, 2024Publication date: April 25, 2024Inventors: Yu-Shih Wang, Hong-Jie Yang, Chia-Ying Lee, Po-Nan Yeh, U-Ting Chiu, Chun-Neng Lin, Ming-Hsi Yeh, Kuo-Bin Huang
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Patent number: 11955191Abstract: A memory device and a method of operating a memory device are disclosed. In one aspect, the memory device includes a plurality of non-volatile memory cells, each of the plurality of non-volatile memory cells is operatively coupled to a word line, a gate control line, and a bit line. Each of the plurality of non-volatile memory cells comprises a first transistor, a second transistor, a first diode-connected transistor, and a capacitor. The first transistor, second transistor, first diode-connected transistor are coupled in series, with the capacitor having a first terminal connected to a common node between the first diode-connected transistor and the second transistor.Type: GrantFiled: June 2, 2023Date of Patent: April 9, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Perng-Fei Yuh, Tung-Cheng Chang, Gu-Huan Li, Chia-En Huang, Chun-Ying Lee, Yih Wang
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Publication number: 20240107776Abstract: An antiferroelectric field effect transistor (Anti-FeFET) of a memory cell includes an antiferroelectric layer instead of a ferroelectric layer. The antiferroelectric layer may operate based on a programmed state and an erased state in which the antiferroelectric layer is in a fully polarized alignment and a non-polarized alignment (or a random state of polarization), respectively. This enables the antiferroelectric layer in the FeFET to provide a sharper/larger voltage drop for an erase operation of the FeFET (e.g., in which the FeFET switches or transitions from the programmed state to the erased state) relative to a ferroelectric material layer that operates based on switching between two opposing fully polarized states.Type: ApplicationFiled: January 5, 2023Publication date: March 28, 2024Inventors: Chun-Chieh LU, Chih-Yu CHANG, Yu-Chuan SHIH, Huai-Ying HUANG, Yu-Ming LIN
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Publication number: 20230193289Abstract: A composition for treating Fabry disease, which includes a polynucleotide having gene editing function for correction of the specific mutation (IVS4+919 G>A) of GLA gene. A method for treating Fabry disease, which uses gene editing systems for correction of the specific mutation (IVS4+919 G>A) of GLA gene in Fabry disease.Type: ApplicationFiled: August 5, 2022Publication date: June 22, 2023Applicant: Taipei Veterans General HospitalInventors: Dau-Ming Niu, Yu-Ying Lu, Yen-Fu Cheng, Yun-Ru Chen, Ching-Tzu Yen, Chun-Ying Huang
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Patent number: 11508566Abstract: A use of an anthranilic acid derivative as a matrix for a MALDI Mass spectrometry, comprising: preparing a matrix compound represented by the following formula: wherein X is selected from hydrogen and a hydroxyl group, and Y is selected from hydrogen, a methyl group or an acetyl group, provided that when X is hydrogen, Y is hydrogen or an acetyl group, and when X is a hydroxyl group, Y is a methyl group; applying the matrix compound and an analyte onto a sample holder; and analyzing the analyte by the MALDI mass spectrometer.Type: GrantFiled: September 3, 2020Date of Patent: November 22, 2022Assignee: National Taiwan UniversityInventors: Cheng-Chih Hsu, Pi-Tai Chou, Chuping Lee, Peng-Hsuan Huang, Li-En Lin, Chun-Ying Huang, Ta-Chun Lin
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Publication number: 20210066060Abstract: A use of an anthranilic acid derivative as a matrix for a MALDI Mass spectrometry, comprising: preparing a matrix compound represented by the following formula: wherein X is selected from hydrogen and a hydroxyl group, and Y is selected from hydrogen, a methyl group or an acetyl group, provided that when X is hydrogen, Y is hydrogen or an acetyl group, and when X is a hydroxyl group, Y is a methyl group; applying the matrix compound and an analyte onto a sample holder; and analyzing the analyte by the MALDI mass spectrometer.Type: ApplicationFiled: September 3, 2020Publication date: March 4, 2021Applicant: National Taiwan UniversityInventors: Cheng-Chih Hsu, Pi-Tai Chou, Chuping Lee, Penghsuan Huang, Li-En Lin, Chun-Ying Huang, Ta-Chun Lin
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Patent number: 10373916Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.Type: GrantFiled: July 28, 2016Date of Patent: August 6, 2019Assignee: UNIVERSAL SCIENTIFIC INDUSTRIAL (SHANGHAI) CO., LTD.Inventors: Ji-Min Lin, Ming-Wen Liao, Chun-Ying Huang
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Publication number: 20180033736Abstract: A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.Type: ApplicationFiled: July 28, 2016Publication date: February 1, 2018Inventors: Ji-Min LIN, Ming-Wen Liao, Chun-Ying Huang
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Publication number: 20150162459Abstract: Provided are methods for forming antireflective layers on solar cells using wet chemical processes and solar cells with anti-reflective layers formed of ZnO based nanorods. Self-assembling ZnO nanorods are generated in the chemical solution without any catalysts. The nanorods are formed to different shapes such as hexagonal, cubic, and circular in cross-section. The refractive index of the ARC layer formed of the nanorods is modulated by controlling the diameter and length of the nanorods by controlling the Molarity of the solution used to form the nanorods. A correlation is established between the refractive index and solution Molarity and a solution is prepared with the desired Molarity. The nanorods are formed from HMT ([CH2]6NH4) and a dissociative Zn2+/OH? chemical such as Zn(NO3)2.Type: ApplicationFiled: December 11, 2013Publication date: June 11, 2015Applicant: TSMC Solar Ltd.Inventors: Wei-Lun LU, Chun-Ying HUANG, Wei-Lun XU
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Publication number: 20150147832Abstract: A method for producing a light-emitting diode is provided, including the following steps. First, a carrier is provided, wherein the carrier comprises a die bonding surface. Then, a die bonding adhesive layer is formed on the die bonding surface, wherein the die bonding adhesive layer has a photoresist property. Next, at least one lighting chip is disposed on the die bonding adhesive layer, and an uncovered portion of the die bonding adhesive layer is not covered by the lighting chip. Finally, the uncovered portion of the die bonding adhesive layer is removed.Type: ApplicationFiled: April 30, 2014Publication date: May 28, 2015Applicant: LEXTAR ELECTRONICS CORPORATIONInventors: Li-Cheng YANG, Chun-Ying HUANG
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Patent number: 9012676Abstract: A preparation of aryl carbamates can be achieved readily by carbonylation of an aromatic polyamine compound with diphenyl carbonate (DPC) using a combination of an organic acid and a tertiary amine as a catalyst. Aryl carbamate can be converted into 4,4?-diphenylmethane diisocyanate (MDI) by heating it at about 200 to about 230° C. in a non-polar solvent containing inhibitor such as benzoyl chloride. In another application, trans-ureation of biscarbamates with an amine or mixed amines is found to be extremely facile in a polar solvent such as dimethyl sulfoxide (DMSO) and tetramethylene sulfone (TMS) in absence of any catalyst to make polyurea polymers of high molecular weights. Thus, efficient green-chemistry processes based on biscarbamates in making isocyanate products as well as urea prepolymers, urea elastomers and urea plastics have been developed in all in excellent yields without using reactive phosgene or 4,4?-diphenylmethane diisocyanate separately in the trans-ureation polymerizations.Type: GrantFiled: September 22, 2011Date of Patent: April 21, 2015Assignees: Great Eastern Resins Industrial Co., Ltd., National Chung Hsing UniversityInventors: Shenghong A. Dai, Hsueh-Yung Chen, Chao-Hsing Lin, Chun-Ying Huang, Wen-Chen Pan
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Publication number: 20150021163Abstract: A method and apparatus for forming a solar cell can include a heater apparatus having one or more heater elements in a deposition processing system, a front cover covering the one or more heater elements from a front side, and a back metal reflector mating with the front cover on a back side and enclosing the one or more heater elements. The method can include disposing a plurality of substrates about a plurality of surfaces of a substrate apparatus that is operatively coupled to sequentially feed a substrate within a vacuum chamber, forming an absorber layer over a surface of each one of the plurality of substrates and heating the surface of each one of the plurality of substrates with the heater apparatus as described above.Type: ApplicationFiled: July 16, 2013Publication date: January 22, 2015Inventors: Wei-Lun LU, Chun-Ying HUANG, Wen-Chin LEE
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Publication number: 20130107475Abstract: A FCB stack assembly includes a PCB, a shield can, and a FCB. The shield can is fixed on the PCB for receiving and shielding electronic components on the PCB. The FCB is fixed onto and directly supported by the shield can.Type: ApplicationFiled: December 2, 2011Publication date: May 2, 2013Applicant: FIH (HONG KONG) LIMITEDInventors: MING-CHUN HSIEH, CHANG-SHIUN YANG, CHUN-WEI WU, HE-LONG WU, REN-CHING HUA, CHUN-YING HUANG
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Publication number: 20130079542Abstract: A preparation of aryl carbamates can be achieved readily by carbonylation of an aromatic polyamine compound with diphenyl carbonate (DPC) using a combination of an organic acid and a tertiary amine as a catalyst. Aryl carbamate can be converted into 4,4?-diphenylmethane diisocyanate (MDI) by heating it at about 200 to about 230° C. in a non-polar solvent containing inhibitor such as benzoyl chloride. In another application, trans-ureation of biscarbamates with an amine or mixed amines is found to be extremely facile in a polar solvent such as dimethyl sulfoxide (DMSO) and tetramethylene sulfone (TMS) in absence of any catalyst to make polyurea polymers of high molecular weights. Thus, efficient green-chemistry processes based on biscarbamates in making isocyanate products as well as urea prepolymers, urea elastomers and urea plastics have been developed in all in excellent yields without using reactive phosgene or 4,4?-diphenylmethane diisocyanate separately in the trans-ureation polymerizations.Type: ApplicationFiled: September 22, 2011Publication date: March 28, 2013Applicants: National Chung Hsing University, Great Eastern Resins Industrial Co., Ltd.Inventors: Shenghong A. Dai, Xue-Yong Chen, Chao-Hsing Lin, Chun-Ying Huang, Wen-Chen Pan
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Patent number: 7872726Abstract: An active device array mother substrate including a substrate, a plurality of active device arrays, a plurality of common bus lines, at least one first transparent conductive pattern layer, and at least one second transparent conductive pattern layer is provided. The substrate has a plurality of predetermined areas, and the active device arrays are respectively disposed in the predetermined areas. The common bus lines are respectively disposed in the predetermined areas to surround the active device arrays. The first transparent conductive pattern layer is connected or coupled between adjacent two common bus lines. The second transparent conductive pattern layer is extended to the adjacent predetermined area to be connected or coupled to the adjacent common bus line.Type: GrantFiled: October 1, 2008Date of Patent: January 18, 2011Assignee: Chunghwa Picture Tubes, Ltd.Inventors: Chun-Huang Lu, Yi-Ting Chiu, Hsiu-Chih Tseng, Chun-Ying Huang, Hsiao-Sheng Chen
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Patent number: 7803350Abstract: This invention provides a process for producing a radioactive arsenic-containing compound, comprising the steps of: (i) subjecting an arsenic-containing compound to a neutron irradiation treatment, said arsenic-containing compound being selected from a group consisting of As2O3, As2S3, As2S2, and a combination thereof, such that the arsenic element contained in the arsenic-containing compound is converted to a radioactive arsenic isotope; and (ii) recovering the resultant product from step (i). This invention also provides a pharmaceutical composition comprising a therapeutically effective amount of the radioactive arsenic-containing compound and a pharmaceutically acceptable carrier. The pharmaceutical composition can be used in the treatment of tumors/cancers such as hematological malignancies and solid tumors.Type: GrantFiled: July 30, 2007Date of Patent: September 28, 2010Assignees: Institute of Nuclear Energy Research Rocaec, TTY Biopharm Company, LimitedInventors: Te-Wei Lee, Chun-Ying Huang, Ming-Shiuan Wu, Te-Jung Chen, Kwo-Ping Chang, Shiang-Rong Chang, Shyh-Yi Chyi, Chih-Hsien Chang, Yin-Mao Hsu, Kuo-Hsien Fan, Wei-Chuan Hsu, Ying-Kai Fu, Charng-Feng Kao
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Publication number: 20090225269Abstract: An active device array mother substrate including a substrate, a plurality of active device arrays, a plurality of common bus lines, at least one first transparent conductive pattern layer, and at least one second transparent conductive pattern layer is provided. The substrate has a plurality of predetermined areas, and the active device arrays are respectively disposed in the predetermined areas. The common bus lines are respectively disposed in the predetermined areas to surround the active device arrays. The first transparent conductive pattern layer is connected or coupled between adjacent two common bus lines. The second transparent conductive pattern layer is extended to the adjacent predetermined area to be connected or coupled to the adjacent common bus line.Type: ApplicationFiled: October 1, 2008Publication date: September 10, 2009Applicant: CHUNGHWA PICTURE TUBES, LTD.Inventors: Chun-Huang Lu, Yi-Ting Chiu, Hsiu-Chih Tseng, Chun-Ying Huang, Hsiao-Sheng Chen
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Patent number: D802626Type: GrantFiled: June 17, 2016Date of Patent: November 14, 2017Assignee: Happy Island Tech Co., LtdInventor: Chun-Ying Huang
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Patent number: D853969Type: GrantFiled: June 3, 2016Date of Patent: July 16, 2019Assignee: Happy Island Tech Co., LtdInventor: Chun-Ying Huang