Patents by Inventor Chun-Yong KIM

Chun-Yong KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149254
    Abstract: Provided herein are a method for producing a hydrocarbon adsorption catalyst includes dealuminated zeolite by heat-treating a zeolite in moisture-containing air at a first temperature to remove a portion of aluminum included in the zeolite, and supporting a metal on a carrier including the zeolite after the heat-treating and a hydrocarbon adsorption catalyst prepared using the same method. The metal-supported support may be additionally heat-treated in moisture-containing air at a second temperature that is higher than the first temperature.
    Type: Application
    Filed: March 15, 2023
    Publication date: May 9, 2024
    Inventors: Chun Yong Kang, Eunhee Jang, Jungkyu Choi, Jaehee Shim, Jin Seong Kim
  • Patent number: 8590722
    Abstract: A vacuum receptacle lid for easy sealing includes a lid body that closes and opens an inlet portion of a receptacle body provided with a space containing contents, a valve installation hole formed at a part thereof, at least one air vent hole, and a packing installation groove which is opened downwardly in a C shape inside a rim thereof. A check valve providing a combining projection at a bottom surface of a body portion enclosing the air vent hole is inserted into and combined with the valve installation hole and exhausts air of the inside of the receptacle body via the air vent hole blocking inflow of external air by enclosing, opening and closing the air vent hole. A packing is accommodated and installed at the packing installation groove and includes upper, lower, and intermediate contact portions which have a cross-section of a zigzag shape.
    Type: Grant
    Filed: September 15, 2010
    Date of Patent: November 26, 2013
    Assignee: Kodaecs Co., Ltd.
    Inventor: Chun Yong Kim
  • Publication number: 20120273488
    Abstract: A vacuum receptacle lid for easy sealing includes a lid body that closes and opens an inlet portion of a receptacle body provided with a space containing contents, and includes a valve installation hole formed at a part thereof, at least one air vent hole, and a packing installation groove which is opened downwardly in a C shape inside a rim thereof, a check valve that is provided a combining projection at a bottom surface of a body portion enclosing the air vent hole, is inserted into and combined with the valve installation hole, and exhausts air of the inside of the receptacle body via the air vent hole and blocks inflow of external air by enclosing, opening and closing the air vent hole, and a packing that is accommodated and installed at the packing installation groove, and includes an upper contact portion coming into contact with an upper surface of the packing installation groove, a lower contact portion coming into contact with the receptacle body, and an intermediate contact portion of which ends ar
    Type: Application
    Filed: September 15, 2010
    Publication date: November 1, 2012
    Applicant: KODAECS CO., LTD.
    Inventor: Chun Yong Kim
  • Publication number: 20100156446
    Abstract: A method of inspecting a substrate includes measuring a first current flowing between a first region and a second region of the substrate using a first probe. A second current flowing between the first region and the second region of the substrate may be measured using a second probe including a material different from that of the first probe. By comparing the first and second currents, it can be determined whether there is a change in a physical composition of the substrate and a change in a physical configuration of the substrate between the first region and the second region. Thus, when the current change is induced by the change in a physical configuration of the substrate, a determination error that the contaminants on the semiconductor substrate may exist based on the current change may be prevented.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 24, 2010
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Chun-Yong KIM, Mi-Ra Park, Yun-Jung Jee, Chung-Sam Jun